Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-9,576,881 Semiconductor device
According to one embodiment, a semiconductor device includes: a semiconductor substrate, the semiconductor substrate having first and second surfaces;...
US-9,576,880 Dual damascene structure with liner
A dual damascene structure with an embedded liner and methods of manufacture are disclosed. The method includes forming a dual damascene structure in a...
US-9,576,879 Heat-dissipation structure and electronic device using the same
A heat-dissipation structure includes a first carbon nanotube layer and a thermal interface material layer. The first carbon nanotube layer and the thermal...
US-9,576,878 Thermal interface material on package
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes...
US-9,576,877 Electronic component, electronic device, method of manufacturing mounted member, and method of manufacturing...
A frame member includes a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein the lengths...
US-9,576,876 Organic-inorganic hybrid thin film and method for producing the same
The present invention relates to an organic-inorganic hybrid thin film and a method for preparing the same and more specifically to an organic-inorganic hybrid...
US-9,576,875 Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip...
A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole...
US-9,576,874 Semiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of...
US-9,576,873 Integrated circuit packaging system with routable trace and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing routable traces including a first routable trace with a top plate and a...
US-9,576,872 Semiconductor devices and methods for manufacturing semiconductor devices
A method includes arranging multiple semiconductor chips over a first carrier and depositing a first material layer over surfaces of the multiple semiconductor...
US-9,576,871 Composition for electronic device
The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic...
US-9,576,870 Module package and production method
The invention relates to a module package which comprises a module substrate 1, a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8,...
US-9,576,868 Semiconductor device and method for reduced bias temperature instability (BTI) in silicon carbide devices
A system includes a silicon carbide (SiC) semiconductor device and a hermetically sealed packaging enclosing the SiC semiconductor device. The hermetically...
US-9,576,867 Device comprising a ductile layer and method of making the same
Device comprising a ductile layer, a method for making a component comprising a ductile layer and a method for testing a component are disclosed. An embodiment...
US-9,576,866 Array substrate, method for fabricating and testing array substrate, and display device
The present invention provides an array substrate, which includes a plurality of pixel units, each pixel unit includes a thin film transistor, a pixel...
US-9,576,865 Film for semiconductor package, semiconductor package using film and display device including the same
A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor...
US-9,576,864 Short-circuit unit and array substrate
The present invention provides a short-circuit unit comprising: a plurality of signal lines divided into a plurality of groups, each group comprising multiple...
US-9,576,863 Method of fine-tuning process controls during integrated circuit chip manufacturing based on substrate backside...
Disclosed is a method of manufacturing integrated circuit (IC) chips. In the method, wafers are received and the backside roughness levels of these wafers are...
US-9,576,862 Optical acoustic substrate assessment system and method
A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are...
US-9,576,861 Method and system for universal target based inspection and metrology
Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and...
US-9,576,860 Method and apparatus providing inline photoluminescence analysis of a photovoltaic device
A method and apparatus are disclosed which use a photoluminescent light intensity signature to characterize a processed photovoltaic substrate.
US-9,576,859 Semiconductor device and method for fabricating the same
A method for fabricating a semiconductor device comprises: Firstly, a semiconductor fin comprising a first sub-fin and a second sub-fin protruding from a...
US-9,576,858 Dual work function integration for stacked FinFET
A three-dimensional stacked fin complementary metal oxide semiconductor (CMOS) device having dual work function metal gate structures is provided. The stacked...
US-9,576,857 Method and structure for SRB elastic relaxation
A method of forming SRB finFET fins first with a cut mask that is perpendicular to the subsequent fin direction and then with a cut mask that is parallel to the...
US-9,576,856 Fabrication of nanowire field effect transistor structures
Methods are presented for facilitating fabrication of nanowire structures, such as one or more nanowire field effect transistors. The methods include, for...
US-9,576,855 Device and methods for high-k and metal gate stacks
A method for fabricating a semiconductor device includes providing a semiconductor substrate having regions for an n-type field-effect transistor (nFET) core,...
US-9,576,854 Peeling apparatus, peeling system, and peeling method
Provided is a peeling apparatus configured to suppress damage to a substrate, by forming a peeling start point. The peeling apparatus separates a superimposed...
US-9,576,853 Magnetic trap for cylindrical diamagnetic materials
A magnetic trap is configured to arrange at least one diamagnetic rod. The magnetic trap includes first and second magnets on a substrate that forms the...
US-9,576,852 Integrated circuits with self aligned contacts and methods of manufacturing the same
Integrated circuits and methods for producing the same are provided. A method for producing an integrated circuit includes forming an interconnect in a first...
US-9,576,851 Interconnect structure and methods of making same
A method of manufacturing a semiconductor interconnect structure may include forming a low-k dielectric layer over a substrate and forming an opening in the...
US-9,576,850 Method for manufacturing semiconductor device
When a recess is formed in a SiCOH film, C is removed from the film to form a damage layer. If the damage layer is removed by hydrofluoric acid or the like, the...
US-9,576,849 Semiconductor package and method for manufacturing the same
The semiconductor package includes semiconductor chips, each chip having one or more bonding pads. The semiconductor chips are stacked in a stepped...
US-9,576,848 Method of treating a porous dielectric layer and a method of fabricating a semiconductor device using the same
A method of treating a porous dielectric layer includes preparing a substrate on which the porous dielectric layer including an opening and pores exposed by the...
US-9,576,847 Method for forming integrated circuit structure with thinned contact
Methods for forming integrated circuit structures are provided. The method includes providing a substrate including a first diffusion region, a second diffusion...
US-9,576,846 Methods for manufacturing a data storage device
Methods for manufacturing a data storage device are provided. A method may include forming an interlayer dielectric layer on a substrate, patterning the...
US-9,576,845 Method for manufacturing a semiconductor device including a hollow structure around an electrode of a...
A method for manufacturing a semiconductor device includes: forming a semiconductor element having an electrode on a main surface of a semiconductor substrate;...
US-9,576,844 Method for manufacturing a composite wafer having a graphite core, and composite wafer having a graphite core
A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer...
US-9,576,843 Process for bonding in an atmosphere of a gas having a negative Joule-Thomson coefficient
The present invention relates to a process for direct bonding two substrates, comprising at least: (a) bringing the surfaces to be bonded of said substrates in...
US-9,576,842 Grass removal in patterned cavity etching
A method of manufacturing a semiconductor device includes providing a first semiconductor substrate having a first main surface and an opposing second main...
US-9,576,841 Semiconductor device and manufacturing method
A semiconductor device includes a first-conductivity-type semiconductor layer including an active region in which a transistor having impurity regions is formed...
US-9,576,840 Method of manufacturing semiconductor device using surface treatment and semiconductor device manufactured by...
A method of manufacturing a semiconductor device includes forming a first plurality of recessed regions in a substrate, the substrate having a protruded active...
US-9,576,839 Substrate carrier arrangement, coating system having a substrate carrier arrangement and method for performing...
A substrate carrier arrangement (10, 11) for a coating system (12) is provided, comprising a carrier (1) which comprises at least one support region (3) having...
US-9,576,838 Devices for methodologies related to wafer carriers
Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a...
US-9,576,837 Method of forming a flexible semiconductor layer and devices on a flexible carrier
A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a...
US-9,576,836 Damage-free self-limiting through-substrate laser ablation
A first substrate, bonded to a second substrate by a material, is provided. The first substrate is transparent to at least some wavelengths of electromagnetic...
US-9,576,835 Workpiece processing method
A method for processing a workpiece including: a supporting plate preparing step of preparing a supporting plate having, on a top surface side of the supporting...
US-9,576,834 Stocker and method for dispatching wafer carrier in stocker
A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality...
US-9,576,833 Robot for a substrate processing system
A robot for a substrate processing system includes a first arm and a second arm each including a first arm portion connected to a base, a second arm portion...
US-9,576,832 Article transport vehicle with damper element
An article transport vehicle is provided in which it is difficult for the transported article support portions to interfere with the supported portion of the...
US-9,576,831 Substrate container, a load port apparatus, and a substrate treating apparatus
A substrate container includes a housing, rack members, housing-side support members for supporting ends of substrates, a moving mechanism for moving the...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.