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According to one embodiment, a semiconductor device includes: a semiconductor substrate, the semiconductor substrate having first and second surfaces;...
Dual damascene structure with liner
A dual damascene structure with an embedded liner and methods of manufacture are disclosed. The method includes forming a dual damascene structure in a...
Heat-dissipation structure and electronic device using the same
A heat-dissipation structure includes a first carbon nanotube layer and a thermal interface material layer. The first carbon nanotube layer and the thermal...
Thermal interface material on package
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes...
Electronic component, electronic device, method of manufacturing mounted
member, and method of manufacturing...
A frame member includes a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein the lengths...
Organic-inorganic hybrid thin film and method for producing the same
The present invention relates to an organic-inorganic hybrid thin film and a method for preparing the same and more specifically to an organic-inorganic hybrid...
Methods for manufacturing a chip arrangement, methods for manufacturing a
chip package, a chip package and chip...
A method for manufacturing a chip arrangement is provided, the method including: forming a hole in a carrier including at least one chip, wherein forming a hole...
Semiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. In some embodiments, a semiconductor device includes a substrate, and a plurality of...
Integrated circuit packaging system with routable trace and method of
A method of manufacture of an integrated circuit packaging system includes: providing routable traces including a first routable trace with a top plate and a...
Semiconductor devices and methods for manufacturing semiconductor devices
A method includes arranging multiple semiconductor chips over a first carrier and depositing a first material layer over surfaces of the multiple semiconductor...
Composition for electronic device
The present invention provides a composition of which viscosity does not cause the problem of use at high temperature in the mounting process of electronic...
Module package and production method
The invention relates to a module package which comprises a module substrate 1, a chip 2, 3 applied using the flip chip process, and an encapsulation layer 8,...
Semiconductor device and method for reduced bias temperature instability
(BTI) in silicon carbide devices
A system includes a silicon carbide (SiC) semiconductor device and a hermetically sealed packaging enclosing the SiC semiconductor device. The hermetically...
Device comprising a ductile layer and method of making the same
Device comprising a ductile layer, a method for making a component comprising a ductile layer and a method for testing a component are disclosed. An embodiment...
Array substrate, method for fabricating and testing array substrate, and
The present invention provides an array substrate, which includes a plurality of pixel units, each pixel unit includes a thin film transistor, a pixel...
Film for semiconductor package, semiconductor package using film and
display device including the same
A semiconductor package may include a first output test pad and a second output test pad disposed on a first surface of an insulating film, and a semiconductor...
Short-circuit unit and array substrate
The present invention provides a short-circuit unit comprising: a plurality of signal lines divided into a plurality of groups, each group comprising multiple...
Method of fine-tuning process controls during integrated circuit chip
manufacturing based on substrate backside...
Disclosed is a method of manufacturing integrated circuit (IC) chips. In the method, wafers are received and the backside roughness levels of these wafers are...
Optical acoustic substrate assessment system and method
A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are...
Method and system for universal target based inspection and metrology
Universal target based inspection drive metrology includes designing a plurality of universal metrology targets measurable with an inspection tool and...
Method and apparatus providing inline photoluminescence analysis of a
A method and apparatus are disclosed which use a photoluminescent light intensity signature to characterize a processed photovoltaic substrate.
Semiconductor device and method for fabricating the same
A method for fabricating a semiconductor device comprises: Firstly, a semiconductor fin comprising a first sub-fin and a second sub-fin protruding from a...
Dual work function integration for stacked FinFET
A three-dimensional stacked fin complementary metal oxide semiconductor (CMOS) device having dual work function metal gate structures is provided. The stacked...
Method and structure for SRB elastic relaxation
A method of forming SRB finFET fins first with a cut mask that is perpendicular to the subsequent fin direction and then with a cut mask that is parallel to the...
Fabrication of nanowire field effect transistor structures
Methods are presented for facilitating fabrication of nanowire structures, such as one or more nanowire field effect transistors. The methods include, for...
Device and methods for high-k and metal gate stacks
A method for fabricating a semiconductor device includes providing a semiconductor substrate having regions for an n-type field-effect transistor (nFET) core,...
Peeling apparatus, peeling system, and peeling method
Provided is a peeling apparatus configured to suppress damage to a substrate, by forming a peeling start point. The peeling apparatus separates a superimposed...
Magnetic trap for cylindrical diamagnetic materials
A magnetic trap is configured to arrange at least one diamagnetic rod. The magnetic trap includes first and second magnets on a substrate that forms the...
Integrated circuits with self aligned contacts and methods of
manufacturing the same
Integrated circuits and methods for producing the same are provided. A method for producing an integrated circuit includes forming an interconnect in a first...
Interconnect structure and methods of making same
A method of manufacturing a semiconductor interconnect structure may include forming a low-k dielectric layer over a substrate and forming an opening in the...
Method for manufacturing semiconductor device
When a recess is formed in a SiCOH film, C is removed from the film to form a damage layer. If the damage layer is removed by hydrofluoric acid or the like, the...
Semiconductor package and method for manufacturing the same
The semiconductor package includes semiconductor chips, each chip having one or more bonding pads. The semiconductor chips are stacked in a stepped...
Method of treating a porous dielectric layer and a method of fabricating a
semiconductor device using the same
A method of treating a porous dielectric layer includes preparing a substrate on which the porous dielectric layer including an opening and pores exposed by the...
Method for forming integrated circuit structure with thinned contact
Methods for forming integrated circuit structures are provided. The method includes providing a substrate including a first diffusion region, a second diffusion...
Methods for manufacturing a data storage device
Methods for manufacturing a data storage device are provided. A method may include forming an interlayer dielectric layer on a substrate, patterning the...
Method for manufacturing a semiconductor device including a hollow
structure around an electrode of a...
A method for manufacturing a semiconductor device includes: forming a semiconductor element having an electrode on a main surface of a semiconductor substrate;...
Method for manufacturing a composite wafer having a graphite core, and
composite wafer having a graphite core
A composite wafer is manufactured by providing a carrier wafer including graphite and a protective layer, forming a bonding layer, and bonding the carrier wafer...
Process for bonding in an atmosphere of a gas having a negative
The present invention relates to a process for direct bonding two substrates, comprising at least: (a) bringing the surfaces to be bonded of said substrates in...
Grass removal in patterned cavity etching
A method of manufacturing a semiconductor device includes providing a first semiconductor substrate having a first main surface and an opposing second main...
Semiconductor device and manufacturing method
A semiconductor device includes a first-conductivity-type semiconductor layer including an active region in which a transistor having impurity regions is formed...
Method of manufacturing semiconductor device using surface treatment and
semiconductor device manufactured by...
A method of manufacturing a semiconductor device includes forming a first plurality of recessed regions in a substrate, the substrate having a protruded active...
Substrate carrier arrangement, coating system having a substrate carrier
arrangement and method for performing...
A substrate carrier arrangement (10, 11) for a coating system (12) is provided, comprising a carrier (1) which comprises at least one support region (3) having...
Devices for methodologies related to wafer carriers
Disclosed are systems, devices and methodologies for handling wafers in wafer processing operations through use of wafer carriers. In an example situation, a...
Method of forming a flexible semiconductor layer and devices on a flexible
A method for fabricating a semiconductor device comprises providing a preformed spalled structure comprising a stressor layer stack on a first surface of a...
Damage-free self-limiting through-substrate laser ablation
A first substrate, bonded to a second substrate by a material, is provided. The first substrate is transparent to at least some wavelengths of electromagnetic...
Workpiece processing method
A method for processing a workpiece including: a supporting plate preparing step of preparing a supporting plate having, on a top surface side of the supporting...
Stocker and method for dispatching wafer carrier in stocker
A stocker includes a storage shelf, an output-relay shelf, a first crane, an output shelf, a second crane, and a controller. The storage shelf has a plurality...
Robot for a substrate processing system
A robot for a substrate processing system includes a first arm and a second arm each including a first arm portion connected to a base, a second arm portion...
Article transport vehicle with damper element
An article transport vehicle is provided in which it is difficult for the transported article support portions to interfere with the supported portion of the...
Substrate container, a load port apparatus, and a substrate treating
A substrate container includes a housing, rack members, housing-side support members for supporting ends of substrates, a moving mechanism for moving the...