At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.
Tipless transistors, short-tip transistors, and methods and circuits
An integrated circuit can include a plurality of first transistors formed in a substrate and having gate lengths of less than one micron and at least one...
Source and drain stressors with recessed top surfaces
An integrated circuit structure includes a gate stack over a semiconductor substrate, and a silicon germanium region extending into the semiconductor substrate...
High voltage semiconductor devices and methods of making the devices
A multi-cell MOSFET device including a MOSFET cell with an integrated Schottky diode is provided. The MOSFET includes n-type source regions formed in p-type...
Semiconductor device comprising plurality of conductive portions disposed
within wells and a nanowire coupled...
A semiconductor device is provided. The semiconductor device includes a first conductive portion on a first side of a first shallow trench isolation (STI)...
Integrated circuit with matching threshold voltages and method for making
An integrated circuit having a substrate, a buffer layer formed over the substrate, a barrier layer formed over the buffer layer, and an isolation region that...
Semiconductor charge pump with imbedded capacitor
A charge pump for an integrated circuit includes a substrate, first and second transistors and a capacitor. The first transistor includes first source and first...
Lateral power MOSFET
A lateral power MOSFET structure is disclosed. In some embodiments, a semiconductor device comprises substantially concentric source, channel, and drain...
Stacked half-bridge package
According to an exemplary embodiment, a stacked half-bridge package includes a control transistor having a control drain for connection to a high voltage input,...
Microelectronic device packages, stacked microelectronic device packages,
and methods for manufacturing...
A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second ...
Microelectronic package with stacked microelectronic units and method for
A microelectronic package may include a first microelectronic unit including a semiconductor chip having first chip contacts, an encapsulant contacting an edge...
Package on packaging structure and methods of making same
A package on packaging structure provides for improved thermal conduction and mechanical strength by the introduction of a sold thermal coupler between the...
Complete system-on-chip (SOC) using monolithic three dimensional (3D)
integrated circuit (IC) (3DIC) technology
Embodiments disclosed in the detailed description include a complete system-on-chip (SOC) solution using monolithic three dimensional (3D) integrated circuit...
Fan out system in package and method for forming the same
Packages and methods of formation are described. In an embodiment, a system in package (SiP) includes first and second redistribution layers (RDLs), stacked die...
Integrated circuit module having a first die with a power amplifier
stacked with a second die and method of...
Disclosed is an integrated circuit module that includes a first die having a plurality of hot regions and at least one cool region when operating under normal...
Electronic device with solder pads including projections
An electronic device including a solder pad structure and methods of forming an electrical interconnection are shown. Solder pads including one or more...
This disclosure discloses a light-emitting device. The light-emitting device is configured to electrically connect to an external circuit and comprises: a first...
Light-emitting part and light-emitting apparatus, and production methods
The present invention provides a light-emitting part and a light-emitting apparatus exhibiting high brightness per unit area, and simplified production methods...
Optoelectronic semiconductor component and method for producing said
An optoelectronic semiconductor component and a method for making an optoelectronic semiconductor component are disclosed. In an embodiment the component...
Etch removal of current distribution layer for LED current confinement
A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined...
Three dimensional integrated circuit structure and manufacturing method of
Three dimensional integrated circuit structures and manufacturing methods of the same are disclosed. The three dimensional integrated circuit structure includes...
Semiconductor packaging structure and method
A system and method for packaging semiconductor dies is provided. An embodiment comprises a first package with a first contact and a second contact. A...
Array resistor and semiconductor module
A semiconductor module includes: a module board, a plurality of chips mounted on the module board, and a plurality of array resistors mounted on the module...
Damascene re-distribution layer (RDL) in fan out split die application
A semiconductor device may include a first semiconductor die. A passivation layer supports the first semiconductor die. The passivation layer may include a...
Probing chips during package formation
A method includes bonding a first package component on a first surface of a second package component, and probing the first package component and the second...
Integrated device comprising stacked dies on redistribution layers
Some features pertain to an integrated device that includes a dielectric layer configured as a base for the integrated device, several redistribution metal...
Method for producing a printed circuit, printed circuit obtained by this
method and electronic module...
The invention concerns a method for producing a printed circuit for a chip card module. This method involves producing two layers of electrically conductive...
Methods for bonding a hermetic module to an electrode array
A method for bonding a hermetic module to an electrode array including the steps of: providing the electrode array having a flexible substrate with a top...
Multiple bond via arrays of different wire heights on a same substrate
Apparatuses relating generally to a substrate are disclosed. In such an apparatus, first wire bond wires ("first wires") extend from a surface of the substrate....
Reliability of a semiconductor device is improved. A semiconductor device has a base material of insulating material having a through hole, a terminal formed on...
Semiconductor die package including low stress configuration
A semiconductor die package. The semiconductor die package comprises a semiconductor die and a molded clip structure comprising a clip structure and a first...
Semiconductor packaging containing sintering die-attach material
Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art...
Systems and methods for high-speed, low-profile memory packages and pinout
Systems and methods are provided for stacked semiconductor memory packages. Each package can include an integrated circuit ("IC") package substrate capable of...
Conductive pillar shaped for solder confinement
Pillar-type connections and methods for fabricating a pillar-type connection. A conductive layer is formed on a bond pad. A second conductive layer is formed on...
Method for transferring light-emitting elements onto a package substrate
A method for transferring light-emitting elements onto a package substrate includes: providing a light-emitting unit including a supporting substrate and a...
A semiconductor package includes a dielectric layer, a plurality of traces, a plurality of electrical pads, a plurality of studs and at least a semiconductor...
Chip on film and display device having the same
A flexible chip on film includes a base insulating layer, a metal layer disposed on an upper surface of the base insulating layer and including a circuit...
EMI shielding method of semiconductor packages
Disclosed is an EMI shielding method of semiconductor packages, including a tape attaching step of attaching an edge of a tape to a lower side of a frame to...
Semiconductor device and method of forming a shielding layer between
stacked semiconductor die
A semiconductor device has a first semiconductor die with a shielding layer formed over its back surface. The first semiconductor die is mounted to a carrier. A...
Metal electromagnetic interference (EMI) shielding coating along an edge
of a ceramic substrate
An electrical component may be mounted on a substrate such as a ceramic substrate. Contacts may be formed on upper and lower surfaces of the substrate. The...
Method for applying magnetic shielding layer, method for manufacturing a
die, die and system
A method for applying a magnetic shielding layer to a substrate is provided, wherein a first magnetic shielding layer is adhered to a first surface of the...
Method for displaying position of alignment mark, array substrate and
manufacturing method thereof
A method for displaying a position of an alignment mark, an array substrate and a manufacturing method thereof are provided. The method for displaying the...
Interconnect structure including middle of line (MOL) metal layer local
interconnect on etch stop layer
An interconnect structure includes an insulator stack on an upper surface of a semiconductor substrate. The insulator stack includes a first insulator layer...
A conductor provided in an interconnection layer is allowed to have a low resistance. An insulator film is provided over a substrate, and is comprised of...
Semiconductor devices including metal-silicon-nitride patterns
A semiconductor memory device can include a first conductive line crossing over a field isolation region and crossing over an active region of the device, where...
Memory device comprising memory strings penetrating through a stacking
structure and electrically contacting...
A memory device and a method for fabricating the same are provided. The memory device includes a substrate, a ground layer disposed on the substrate, a stacking...
Interconnect structure with misaligned metal lines coupled using different
In some embodiments, an interconnect structure includes a first metal line, a second metal line and a first connection structure. The first metal line is formed...
Manufacturing method of a semiconductor device and method for creating a
A method for manufacturing a semiconductor device of one embodiment of the present invention includes: forming an insulation layer to be processed over a...
Package apparatus and manufacturing method thereof
A package apparatus comprises a first conductive wiring layer, a first conductive pillar layer, a first conductive glue layer, an internal component, a second...
Forming fence conductors using spacer etched trenches
A spacer etching process produces ultra-narrow conductive lines in a plurality of semiconductor dice. Trenches are formed in a first dielectric then a...
Metal line structure and method
A device comprises a first rounded metal line in a metallization layer over a substrate, a second rounded metal line in the metallization layer, a first air gap...