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Patent # Description
US-9,603,295 Mounted structure and manufacturing method of mounted structure
In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes...
US-9,603,294 Apparatus for mounting semiconductor chips
An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage....
US-9,603,293 Noise-reducing shielded cable
As a noise-reducing shielded cable according to the present invention, provided is a shielded cable having an inverter (10), a motor (30), a cable (20)...
US-9,603,292 Aluminum EMI/RF shield with fins
A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing...
US-9,603,291 Semiconductor device
A semiconductor device includes a semiconductor element accommodated in an outer case; a control circuit board fixed to the outer case at a position away from...
US-9,603,290 Shield unit and method of manufacturing same
A first plate of a shield shell includes a flat plate member and at least one crimping piece extending from an outer circumferential edge of the flat plate...
US-9,603,289 Chassis arrangement systems and methods for dual depth cards and dual depth faraday cages
A chassis arrangement includes different depth cards with associated Faraday cages. The chassis arrangement provides support for a first set of cards at a first...
US-9,603,288 Electronic/electrical component housing with strips of metal plate and shape memory material forming a heat...
A housing for electronic/electrical components includes an inner panel and an outer panel, a strip of metal plate, and a strip of shape memory material. The...
US-9,603,287 Integrated power module
An integrated power module is provided, which may include a gate driver circuit, a plurality of first metal plates, a plurality of chips, a plurality of second...
US-9,603,286 Heat sink attachment apparatus and method
There is provided an electronic device. The electronic device includes a circuit board having heat generating components thereon. The electronic device further...
US-9,603,285 Coolant supply unit, cooling unit, and electronic device
A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant...
US-9,603,284 Fluid heat exchanger configured to provide a split flow
A fluid heat exchanger can define a plurality of microchannels each having a first end and an opposite end and extending substantially parallel with each other...
US-9,603,283 Electronic module with free-formed self-supported vertical interconnects
An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic...
US-9,603,282 Datacenter and cooling control fault-tolerance using compute resources
Management of infrastructure devices is performed by computing devices that are associated with the processing being provided by the data center, such as...
US-9,603,281 Truly modular building datacenter facility
A modular datacenter facility is constructed with a set of building modules of different types of functionality to form an entire datacenter facility having a...
US-9,603,280 Flash module
A flash module includes a top cover and a bottom cover, a printed circuit board (PCB) comprising memory, solid state storage, a storage controller configured to...
US-9,603,279 Central electronics complex (`CEC`) and fan structure
A server chassis, including: a first compartment configured to receive one or more central electronics complexes (`CECs`); and a second compartment configured...
US-9,603,278 Server casing and plate connecting structure thereof
A server casing includes a frame having first and second plates and a plate connecting structure including first and second side boards extending from the first...
US-9,603,277 Field-reconfigurable backplane system
In a circuit card chassis, a backplane system includes card guides that are slideable on rails to provide any selected spacing between adjacent circuit cards. A...
US-9,603,276 Electronic assembly that includes a plurality of electronic packages
Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic...
US-9,603,275 Blackplane board and wiring method of backplane board
The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with...
US-9,603,274 Container for housing electronic component and electronic device
A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of...
US-9,603,273 Universal system for mounting rack doors
A mount for mounting a door to rack includes a rack including a first pair of vertically-extending supports, each support including an array of openings; a...
US-9,603,272 Lid structure and electronic device
A lid structure includes: a housing; a lid body configured to open and close an opening of the housing; an elastic member configured to be compressed by the...
US-9,603,271 Foldable display apparatus
A foldable display apparatus including a display panel configured to include a display area including a first display area, a second display area, and a bending...
US-9,603,270 Docking mechanism for locking and undocking multiple electronic instruments
A docking mechanism for locking and undocking multiple electronic instruments is provided which includes upper and lower instruments. The upper electronic...
US-9,603,269 Modular enclosure and construction method
A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a...
US-9,603,268 Gas barrier film, method of producing a gas barrier film, and electronic device
Provided is a gas barrier film including a base, a first barrier layer containing silicon which is formed on at least one surface of the base, and a second...
US-9,603,267 Bracket and frame body having the same
A frame body includes a bottom plate, a connection portion, and a bracket. The bracket includes a first sidewall, a second sidewall, a bending portion, a...
US-9,603,266 Display device
Provided is a display device that has: first engaging portions formed on a frame member; and second engaging portions that are formed on a front plate and...
US-9,603,265 Multi-layered printed circuit board having inner-layer portion and outer-layer portions and manufacturing...
A multi-layered printed circuit board and a manufacturing method thereof are disclosed. The multi-layered printed circuit board in accordance with an aspect of...
US-9,603,264 Method and apparatus for welding printed circuits
The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. In particular, a magnetic flux...
US-9,603,263 Manufacturing method of circuit substrate
A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a...
US-9,603,262 Electronic component mounting apparatus and method
An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven...
US-9,603,261 Method for improving coating
A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating...
US-9,603,260 Method and products related to deposited particles
The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate...
US-9,603,259 Methods for surface attachment of flipped active components
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component...
US-9,603,258 Composition and method for electroless plating of palladium phosphorus on copper, and a coated component therefrom
A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto...
US-9,603,257 Pattern substrate, method of producing the same, information input apparatus, and display apparatus
A pattern substrate includes a substrate having a surface on which a first area and a second area are formed, and a pattern layer formed at the first area among...
US-9,603,256 Process for producing articles having an electrically conductive coating
The present invention relates to a process for producing articles having on at least part of their surface an electrically conductive coating by at least partly...
US-9,603,255 Method for producing a printed circuit board
A method for producing a printed circuit board is disclosed. In the method, a slot is formed in a substrate having at least three layers with the slot extending...
US-9,603,254 Apparatus for filling a wafer via with solder
A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air...
US-9,603,253 Wiring substrate, manufacturing method therefor, and semiconductor package
A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes...
US-9,603,252 Integrated circuit device system with elevated configuration and method of manufacture thereof
A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a...
US-9,603,251 Apparatus and method of midplane panel connections
A connector board for an electronic assembly, the connector board including a passive circuit board, mounted horizontally at an elevated position within the...
US-9,603,250 Electromagnetic field manipulation around vias
A circuit may include a signal path, a first layer including the signal path, and a second layer including the signal path. The circuit may additionally include...
US-9,603,249 Direct metalization of electrical circuit structures
An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the...
US-9,603,248 Wiring board and method for manufacturing the same
A wiring board includes a board including a core, a conductive layer on the core, and a laminated structure over the core and conductive layer, and a stacked...
US-9,603,247 Electronic package with narrow-factor via including finish layer
This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a...
US-9,603,246 Electronic package, package carrier, and method of manufacturing package carrier
A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the...
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