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Mounted structure and manufacturing method of mounted structure
In a case where a first mounted substrate to which a semiconductor element is bounded by solder is mounted on a second substrate, connection strength becomes...
Apparatus for mounting semiconductor chips
An apparatus includes a pick and place system with a bonding head, picking head and support table. The picking head and support table are mounted on a carriage....
Noise-reducing shielded cable
As a noise-reducing shielded cable according to the present invention, provided is a shielded cable having an inverter (10), a motor (30), a cable (20)...
Aluminum EMI/RF shield with fins
A shield made from aluminum (AL) or an aluminum-based alloy coated with a solderable plating such as nickel or tin provides thermal improvement over existing...
A semiconductor device includes a semiconductor element accommodated in an outer case; a control circuit board fixed to the outer case at a position away from...
Shield unit and method of manufacturing same
A first plate of a shield shell includes a flat plate member and at least one crimping piece extending from an outer circumferential edge of the flat plate...
Chassis arrangement systems and methods for dual depth cards and dual
depth faraday cages
A chassis arrangement includes different depth cards with associated Faraday cages. The chassis arrangement provides support for a first set of cards at a first...
Electronic/electrical component housing with strips of metal plate and
shape memory material forming a heat...
A housing for electronic/electrical components includes an inner panel and an outer panel, a strip of metal plate, and a strip of shape memory material. The...
Integrated power module
An integrated power module is provided, which may include a gate driver circuit, a plurality of first metal plates, a plurality of chips, a plurality of second...
Heat sink attachment apparatus and method
There is provided an electronic device. The electronic device includes a circuit board having heat generating components thereon. The electronic device further...
Coolant supply unit, cooling unit, and electronic device
A coolant supply unit includes a plurality of pumps, a casing that includes a coolant inlet port, a plurality of branch ports that respectively convey coolant...
Fluid heat exchanger configured to provide a split flow
A fluid heat exchanger can define a plurality of microchannels each having a first end and an opposite end and extending substantially parallel with each other...
Electronic module with free-formed self-supported vertical interconnects
An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic...
Datacenter and cooling control fault-tolerance using compute resources
Management of infrastructure devices is performed by computing devices that are associated with the processing being provided by the data center, such as...
Truly modular building datacenter facility
A modular datacenter facility is constructed with a set of building modules of different types of functionality to form an entire datacenter facility having a...
A flash module includes a top cover and a bottom cover, a printed circuit board (PCB) comprising memory, solid state storage, a storage controller configured to...
Central electronics complex (`CEC`) and fan structure
A server chassis, including: a first compartment configured to receive one or more central electronics complexes (`CECs`); and a second compartment configured...
Server casing and plate connecting structure thereof
A server casing includes a frame having first and second plates and a plate connecting structure including first and second side boards extending from the first...
Field-reconfigurable backplane system
In a circuit card chassis, a backplane system includes card guides that are slideable on rails to provide any selected spacing between adjacent circuit cards. A...
Electronic assembly that includes a plurality of electronic packages
Some forms relate to an electronic assembly that includes a plurality of electronic package. The electronic assembly includes a frame and a first electronic...
Blackplane board and wiring method of backplane board
The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with...
Container for housing electronic component and electronic device
A container for housing an electronic component includes: a container body including a bottom plate and a polygonal side wall surrounding a central region of...
Universal system for mounting rack doors
A mount for mounting a door to rack includes a rack including a first pair of vertically-extending supports, each support including an array of openings; a...
Lid structure and electronic device
A lid structure includes: a housing; a lid body configured to open and close an opening of the housing; an elastic member configured to be compressed by the...
Foldable display apparatus
A foldable display apparatus including a display panel configured to include a display area including a first display area, a second display area, and a bending...
Docking mechanism for locking and undocking multiple electronic
A docking mechanism for locking and undocking multiple electronic instruments is provided which includes upper and lower instruments. The upper electronic...
Modular enclosure and construction method
A modular enclosure configurable to achieve one of a plurality of environmental ratings is disclosed. The modular enclosure includes a base having a...
Gas barrier film, method of producing a gas barrier film, and electronic
Provided is a gas barrier film including a base, a first barrier layer containing silicon which is formed on at least one surface of the base, and a second...
Bracket and frame body having the same
A frame body includes a bottom plate, a connection portion, and a bracket. The bracket includes a first sidewall, a second sidewall, a bending portion, a...
Provided is a display device that has: first engaging portions formed on a frame member; and second engaging portions that are formed on a front plate and...
Multi-layered printed circuit board having inner-layer portion and
outer-layer portions and manufacturing...
A multi-layered printed circuit board and a manufacturing method thereof are disclosed. The multi-layered printed circuit board in accordance with an aspect of...
Method and apparatus for welding printed circuits
The invention relates to a method for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. In particular, a magnetic flux...
Manufacturing method of circuit substrate
A manufacturing method of a circuit substrate includes the following steps. The peripheries of two metal layers are bonded to form a sealed area. At least a...
Electronic component mounting apparatus and method
An electronic component mounting apparatus includes a bonding tool for thermally bonding an electronic component onto a substrate, the bonding tool to be driven...
Method for improving coating
A system and a method, the method includes determining or receiving a multiple iteration printing scheme indicative of multiple printing iterations of a coating...
Method and products related to deposited particles
The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate...
Methods for surface attachment of flipped active components
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component...
Composition and method for electroless plating of palladium phosphorus on
copper, and a coated component therefrom
A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto...
Pattern substrate, method of producing the same, information input
apparatus, and display apparatus
A pattern substrate includes a substrate having a surface on which a first area and a second area are formed, and a pattern layer formed at the first area among...
Process for producing articles having an electrically conductive coating
The present invention relates to a process for producing articles having on at least part of their surface an electrically conductive coating by at least partly...
Method for producing a printed circuit board
A method for producing a printed circuit board is disclosed. In the method, a slot is formed in a substrate having at least three layers with the slot extending...
Apparatus for filling a wafer via with solder
A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air...
Wiring substrate, manufacturing method therefor, and semiconductor package
A wiring substrate includes a heat radiation plate and a substrate provided on the heat radiation plate interposed by an adhesive layer. The substrate includes...
Integrated circuit device system with elevated configuration and method of
A system and method of manufacture of an integrated circuit device system includes: a carrier having a first side; a base device mounted on the first side; a...
Apparatus and method of midplane panel connections
A connector board for an electronic assembly, the connector board including a passive circuit board, mounted horizontally at an elevated position within the...
Electromagnetic field manipulation around vias
A circuit may include a signal path, a first layer including the signal path, and a second layer including the signal path. The circuit may additionally include...
Direct metalization of electrical circuit structures
An electrical interconnect including a first circuitry layer with a first surface and a second surface. At least a first dielectric layer is printed on the...
Wiring board and method for manufacturing the same
A wiring board includes a board including a core, a conductive layer on the core, and a laminated structure over the core and conductive layer, and a stacked...
Electronic package with narrow-factor via including finish layer
This disclosure relates generally to an electronic package and methods that include an electrically conductive pad, a package insulator layer including a...
Electronic package, package carrier, and method of manufacturing package
A method of manufacturing package carrier is provided. In the method, a holding substrate and a conductive layer are provided. The conductive layer is on the...