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Patent # Description
US-9,647,213 Interlayer for electronic devices
Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such...
US-9,647,212 Mask plate, method for packaging OLED device and OLED device
A mask plate, a method for packaging an OLED device and an OLED device are disclosed, the mask plate includes at least one opening for forming a pattern of a...
US-9,647,211 Method of manufacturing ink for forming functional layer and method of manufacturing organic EL element
A method of manufacturing an ink for forming a functional layer includes: dispersing a mixture in which a low molecular material and a high molecular material...
US-9,647,210 Tunable voltage margin access diodes
The present invention relates generally to high current density access devices (ADs), and more particularly, to a structure and method of forming tunable...
US-9,647,209 Integrated phase change switch
Various methods and devices that involve phase change material (PCM) switches are disclosed. An exemplary integrated circuit comprises an active layer with a...
US-9,647,208 Low voltage embedded memory having conductive oxide and electrode stacks
Low voltage embedded memory having conductive oxide and electrode stacks is described. For example, a material layer stack for a memory element includes a first...
US-9,647,207 Resistive random access memory (RRAM) structure
A resistive random access memory (RRAM) cell with a high .kappa. layer based on a group-V oxide and hafnium oxide is provided. The RRAM cell includes a bottom...
US-9,647,206 Method for etching layer to be etched
Provided is a method for etching an etching target layer of a workpiece. The workpiece has a mask on the etching target layer. The etching target layer and the...
US-9,647,205 Integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom...
An integrated circuit shielding technique utilizing stacked die technology incorporating top and bottom nickel-iron alloy shields having a low coefficient of...
US-9,647,204 Spin torque MRAM based on Co, Ir synthetic antiferromagnetic multilayer
Magnetic memory devices having an antiferromagnetic reference layer based on Co and Ir are provided. In one aspect, a magnetic memory device includes a...
US-9,647,203 Magnetoresistive element having a magnetic layer including O
According to one embodiment, a magnetoresistive element includes a first magnetic layer including O and one of Co, Fe, Ni and Mn, a second magnetic layer, a...
US-9,647,202 Magnetic random access memory with perpendicular enhancement layer
The present invention is directed to an MRAM element comprising a plurality of magnetic tunnel junction (MTJ) memory elements. Each of the memory elements...
US-9,647,201 Magnetic memory devices
The inventive concepts provide magnetic memory devices. The device includes a first magnetic pattern provided in one united body on a substrate and having a...
US-9,647,200 Encapsulation of magnetic tunnel junction structures in organic photopatternable dielectric material
Methods and devices are provided to construct magnetic devices, such as magnetic random access memory devices, having MTJ (magnetic tunnel junction) structures...
US-9,647,199 Piezoelectric device and method for manufacturing piezoelectric device
In a method of manufacturing a piezoelectric device, during an isolation formation step, a supporting substrate has a piezoelectric thin film formed on its...
US-9,647,198 Piezoelectric oriented ceramics and method of manufacturing the same
Piezoelectric oriented ceramics containing a Pb(Ti, Zr)O.sub.3-based compound having a high degree of orientation not lower than 0.64, which was calculated with...
US-9,647,197 Piezoelectric ceramics and method for manufacturing the same
There is provided a piezoelectric ceramics, including a perovskite compound of a non-stoichiometric composition represented by a composition formula...
US-9,647,196 Wafer-level package and method for production thereof
A hermetic wafer-level package composed of two piezoelectric wafers, preferably identical in terms of material, and a production method therefor are presented....
US-9,647,195 Multi-frequency ultra wide bandwidth transducer
Piezoelectric micromachined ultrasonic transducer (pMUT) arrays and techniques for frequency shaping in pMUT arrays are described, for example to achieve both...
US-9,647,194 Superconductive multi-chip module for high speed digital circuits
An electrical module having electrically interconnecting substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising...
US-9,647,193 Thermoelectric conversion element and thermoelectric conversion device
[Object] To increase the degree of freedom in designing a system for taking out power from a temperature gradient in terms of a thermoelectric conversion...
US-9,647,192 Solar concentrator assembly and methods of using same
A solar concentrator assembly includes a tripod, a base, a reflective dish, a receptacle, and a thermoelectric module or a heat transfer module. The tripod...
US-9,647,191 Method for thermal energy-to-electrical energy conversion
An improved method and apparatus for thermal-to-electric conversion involving relatively hot and cold juxtaposed surfaces separated by a small vacuum gap...
US-9,647,190 Package for light emitting apparatus and light emitting apparatus including the same
A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a...
US-9,647,189 Methods for adhesive bonding of electronic devices
In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure...
US-9,647,188 Wafer-level flip chip device packages and related methods
In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded...
US-9,647,187 Multi-slice two-dimensional phased array assembly
A two-dimensional phased array beam former comprising at least first and second chips having each top and bottom surfaces, the bottom surface of the first chip...
US-9,647,186 Method for producing an electronic component and electronic component
A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps:...
US-9,647,185 Composition for reflection film for light emitting element, light emitting element, and method of producing...
A light emitting element having a light emitting layer, an electro-conductive reflection film that reflects light emitted from the light emitting layer and a...
US-9,647,184 Light emitting device package and lighting apparatus including the same
A light emitting device package includes a package body, first and second lead frames located on the package body, a light source mounted on at least one of the...
US-9,647,183 Vertical light emitting diode with photonic nanostructures and method of fabrication thereof
There is provided a method of fabricating a vertical light emitting diode which includes forming a light emitting diode structure. Forming the light emitting...
US-9,647,182 Enhanced emission from plasmonic coupled emitters for solid state lighting
There is provided an illumination device (100) comprising an energy source (102) for exciting a photon emitter; a first wavelength conversion layer (104) and a...
US-9,647,181 Light emitting device with phosphors
Provided is a light emitting device in which with the general color rendering index Ra and the special color rendering index R9 maintained at high numeric...
US-9,647,180 Glass-phosphor composite containing rare-earth ion and light-emitting diode including same
A method of manufacturing a glass-phosphor composite is disclosed. The method comprises: preparing rare earth ion-containing parent glass; mixing the rare-earth...
US-9,647,178 Package structure of optical module having printed shielding layer and its method for packaging
A package structure of an optical module includes: a substrate having a frame defined with a light-emitting region and a light-admitting region; a...
US-9,647,177 Semiconductor optoelectronic device with an insulative protection layer and the manufacturing method thereof
The present disclosure is to provide an optoelectronic device. The optoelectronic device comprises a heat dispersion substrate; an insulative protection layer...
US-9,647,176 Reflective display devices
A technique of producing a control component for a reflective display device, comprising: forming an array of electronic switching devices; forming over said...
US-9,647,175 Light emitting element and lighting device comprising same
The present disclosure provides a light emitting element, wherein each of first and second semiconductor layers has first and second pits disposed therein,...
US-9,647,174 Optoelectronic semiconductor chip
An optoelectronic semiconductor chip includes a semiconductor layer sequence having an active layer that generates radiation and at least one n-doped layer...
US-9,647,173 Light emitting device (LED) having an electrode hole extending from a nonconductive semiconductor layer to a...
A light-emitting device comprises a first conductive type semiconductor layer; a second conductive type semiconductor layer under the first conductive type...
US-9,647,172 Light emitting device
A light-emitting diode comprises a substrate; a semiconductor stack on the substrate, wherein the semiconductor stack comprises a first semiconductor layer, an...
US-9,647,171 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent...
Described herein are printable structures and methods for making, assembling and arranging electronic devices. A number of the methods described herein are...
US-9,647,170 Method for producing group III nitride semiconductor light-emitting device
The present techniques provide a method for producing a Group III nitride semiconductor light-emitting device, with suppression of an increase in polarity...
US-9,647,169 Light emitting diode (LED) using carbon materials
Carbon-based light emitting diodes (LEDs) and techniques for the fabrication thereof are provided. In one aspect, a LED is provided. The LED includes a...
US-9,647,168 Optoelectronic device with modulation doping
An improved heterostructure for an optoelectronic device is provided. The heterostructure includes an active region, an electron blocking layer, and a p-type...
US-9,647,167 Solid-state radiation transducer devices having flip-chip mounted solid-state radiation transducers and...
Solid-state radiation transducer (SSRT) devices and methods of manufacturing and using SSRT devices are disclosed herein. One embodiment of the SSRT device...
US-9,647,166 Electronic device including laterally arranged P-type and N-type regions in a two dimensional (2D) material...
According to example embodiments, an electronic device includes a substrate, an insulating layer on the substrate, and a diode layer on the insulating layer....
US-9,647,165 Germanium photodetector with SOI doping source
Various particular embodiments include a method for forming a photodetector, including: forming a structure including a barrier layer disposed between a layer...
US-9,647,164 Single-band and dual-band infrared detectors
Bias-switchable dual-band infrared detectors and methods of manufacturing such detectors are provided. The infrared detectors are based on a back-to-back...
US-9,647,163 Solar cell having a double-sided structure, and method for manufacturing same
The present invention relates to a solar cell having nanostructures on both surfaces of a transparent substrate, and to a method for manufacturing same. The...
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