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Patent # Description
US-9,685,490 Organic light-emitting diode display
An organic light emitting diode (OLED) display includes: a first electrode around a center point of a virtual tetragon, e.g., a virtual square; second...
US-9,685,487 Organic light emitting diode display and method of manufacturing the same
An organic light emitting diode display includes a substrate, a display pixel unit that displays an image, the display pixel unit being on the substrate, and a...
US-9,685,478 Flip-chip bonding method and solid-state image pickup device manufacturing method characterized in including...
An electrode of an electronic component element (1) is bonded to an electrode (5) of a substrate (4) via a bump (2) by: after applying, to the bump (2), only a...
US-9,685,474 Semiconductor device and a manufacturing method thereof
A semiconductor device has a chip region including a back-side illumination type photoelectric conversion element, a mark-like appearance part, a pad electrode,...
US-9,685,473 4-color pixel image sensor having visible color noise reduction function in near infrared ray pixel
A 4-color pixel image sensor having a visible color noise reduction function in a near infrared ray (NIR) pixel may include an active pixel region having a...
US-9,685,472 Image sensor with reduced spectral and optical crosstalk and method for making the image sensor
An integrated image sensor may include adjacent pixels, with each pixel including an active semiconductor region including a photodiode, an antireflection layer...
US-9,685,462 Semiconductor device and method of manufacturing the same
A semiconductor device of an embodiment includes an oxide semiconductor layer including a first region, a second region and the third region provided between...
US-9,685,460 Array substrate, method for manufacturing the same, and display device
The present disclosure provides an array substrate, its manufacturing method and a display device. The method includes forming a source electrode and a drain...
US-9,685,458 Display device
A display device includes a display region comprising a plurality of pixels, each pixel of the plurality of pixels comprises a light emitting element which...
US-9,685,452 Three-dimensional semiconductor device with vertical and horizontal channels in stack structure having...
A three-dimensional (3D) semiconductor device includes a stack structure including electrodes vertically stacked on a substrate, a channel structure coupled to...
US-9,685,450 Semiconductor devices and methods of fabricating the same
Provided are semiconductor devices and methods of fabricating the same. The methods may include forming a molding layer on a semiconductor substrate. A storage...
US-9,685,448 Semiconductor device
Disclosed herein is a method includes: forming first and second cavities, the first cavity having a first width, each of the second cavities having a second...
US-9,685,445 Semiconductor device and manufacturing method of the same
A semiconductor device includes a buffer layer formed with a semiconductor adapted to produce piezoelectric polarization, and a channel layer stacked on the...
US-9,685,441 Semiconductor device with tunable work function
The metal-oxide semiconductor structure includes a substrate, a gate dielectric multi-layer, an etch stop layer, a work function metallic layer, a barrier layer...
US-9,685,428 Display device and light-emitting array module thereof
A light-emitting array module includes a circuit substrate, a light-emitting unit, and an encapsulation body. The light-emitting unit includes a plurality of...
US-9,685,425 Integrated circuit package
An integrated circuit package may have a package substrate with a surface to which an integrated circuit die is soldered. A first set of contacts on the package...
US-9,685,420 Localized sealing of interconnect structures in small gaps
An apparatus relates generally to a microelectronic device. In such an apparatus, a first substrate has a first surface with first interconnects located on the...
US-9,685,413 Semiconductor package having an EMI shielding layer
Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing...
US-9,685,409 Top metal contact for vertical transistor structures
A vertical transistor includes a source layer arranged on a substrate; a channel extending vertically from the source layer; a drain arranged on a distal end of...
US-9,685,408 Contact pad structure and method for fabricating the same
A contact pad structure includes alternately stacked N insulating layers (N.gtoreq.6) and N conductive layers, and has N regions arranged in a 2D array exposing...
US-9,685,398 Thin semiconductor device packages
In a general aspect, a packaged semiconductor device can include a semiconductor die having at least a first terminal on a first side of the semiconductor die...
US-9,685,397 Semiconductor package with clip structure
A semiconductor package comprise a downset has a first end coupled to a connection portion and a second opposite end electrically coupled to a lead of a lead...
US-9,685,390 Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer
A microelectronic package having an encapsulated substrate comprising a plurality of microelectronic devices encapsulated within an encapsulation material,...
US-9,685,388 Picture frame stiffeners for microelectronic packages
A microelectronic package may be formed with a picture frame stiffener surrounding a microelectronic die for reducing warpage of the microelectronic package. An...
US-9,685,381 Integrating VLSI-compatible fin structures with selective epitaxial growth and fabricating devices thereon
Different n- and p-types of device fins are formed by epitaxially growing first epitaxial regions of a first type material from a substrate surface at a bottom...
US-9,685,376 Semiconductor device and method of manufacturing semiconductor device
A semiconductor device including: a support plate 1; a semiconductor chip 2 mounted on one principal surface of the support plate 1 via an adhesive layer, with...
US-9,685,371 Method of enabling seamless cobalt gap-fill
Methods for depositing a metal layer in a feature definition of a semiconductor device are provided. In one implementation, a method for depositing a metal...
US-9,685,370 Titanium tungsten liner used with copper interconnects
Approaches for providing a liner at a via-to-wire interface are provided. A method includes: forming a via opening that exposes an upper surface of a copper...
US-9,685,365 Method of forming a wire bond having a free end
A method of forming a wire bond having a free end includes joining an end of a metal wire to a conductive element at a surface of a first component, the end of...
US-9,685,358 Apparatus for liquid treatment of wafer shaped articles and heating system for use in such apparatus
An apparatus for treating a disc-shaped article comprises a spin chuck and at least three individually controllable infrared heating elements. The infrared...
US-9,685,335 Power device including a field stop layer
Provided are a power device having an improved field stop layer and a method of manufacturing the same. The power device includes: a first field stop layer...
US-9,685,325 Carbon and/or nitrogen incorporation in silicon based films using silicon precursors with organic co-reactants...
Methods for the deposition of a silicon-containing film using an organic reactant, a silicon precursor and a plasma.
US-9,685,319 Method for filling gaps of semiconductor device and semiconductor device formed by the same
A method for filling gaps of semiconductor device and a semiconductor device with insulation gaps formed by the same are provided. First, a silicon substrate...
US-9,685,304 Isotopically-enriched boron-containing compounds, and methods of making and using same
An isotopically-enriched, boron-containing compound comprising two or more boron atoms and at least one fluorine atom, wherein at least one of the boron atoms...
US-9,685,297 Systems and methods for monitoring faults, anomalies, and other characteristics of a switched mode ion energy...
Systems, methods and apparatus for regulating ion energies in a plasma chamber and chucking a substrate to a substrate support are disclosed. An exemplary...
US-9,685,294 Fuse
A fusible link (11) includes a fuse element (13) provided with a fusible conductor part (25) which has a melting part (31) provided between parallel inner side...
US-9,685,290 Compact magnetic switch for circuit boards
Small, low-profile magnetic switch assemblies (26, 76, 126, 168) include a base (38, 78, 156) equipped with first and second laterally spaced apart switch...
US-9,685,286 Keyboard device
There is provided a keyboard device including a plurality of key tops that include magnets and are depressible, an opposing member which is provided to face the...
US-9,685,283 Interlock for circuit interrupting device
A circuit-interrupting device includes a load-breaker operable between an open state and a closed state and a first interlock member operatively associated with...
US-9,685,281 Safety mechanism for medical treatment device and associated methods
A safety mechanism for medical treatment devices includes a switch actuator that depresses a power activation switch after movement in a first direction...
US-9,685,274 Electric capacitor for a coolant compressor
The invention relates to an electric capacitor having at least one capacitor coil, a cylindrical housing that surrounds the capacitor coil, composed of metal,...
US-9,685,265 Wearable magnet housing
Wearable housings are configured in size and shape to be securely attached to a strap, such as a belt, suspender, backpack strap, rifle strap, shoulder bag...
US-9,685,264 Die assembly and method for manufacturing wound motor laminated article
A stator core is formed from a continuous strip of wound sheet stock material, in which the sheet stock material is converted from the sheet stock to a formed...
US-9,685,261 Formation of a transparent conductive film by interfacial graphene assembly
Advantageous films and coatings (e.g., transparent conductive films), and improved methods for fabricating such films and/or coatings, are provided. The...
US-9,685,257 Electrical transmission cables with composite cores
The present invention discloses electrical cables containing a cable core and a plurality of conductive elements surrounding the cable core. The cable core...
US-9,685,254 Dielectric film, method for manufacturing the same, and transducer including the same
A dielectric film includes an elastomer and nanoparticles dispersed in the elastomer while chemically bound to the elastomer. The nanoparticles have cyano...
US-9,685,253 Conductive film composition, conductive film fabricated using the same, and optical display apparatus including...
A conductive film composition for forming a conductive film in a single coating layer on one or both sides of a base film, the composition including a metal...
US-9,685,246 Control system for nuclear facility and control method for nuclear facility
A control system allows controlling a nuclear facility in an evacuation area. The control system includes a control device in ordinary use disposed in a...
US-9,685,240 Memory device to alleviate the effects of row hammer condition and memory system including the same
There may be provided a memory or memory system. A memory may include an active cell array comprising a plurality of unit cells coupled to a word line and...
US-9,685,235 Method of initializing 3D non-volatile memory device
A 3D non-volatile memory device may include a dummy string selection line, string selection lines, wordlines, bitlines, a ground selection line, and memory...
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