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Patent # Description
US-9,705,108 Display panel
A display panel that includes a plurality of pixels, each pixel includes a first area including a display device; a second area including a first reflective...
US-9,705,095 Organic transistor, compound, organic semiconductor material for non-light-emitting organic semiconductor...
Provided are an organic transistor having high carrier mobility that contains a compound represented by the following formula in a semiconductor active layer; a...
US-9,705,086 Blue fluorescent compounds and organic light emitting diode devices using the same
A blue fluorescent compound is disclosed. The blue fluorescent compound represented by the following Chemical Formula 1, ##STR00001## where R1 and R2 are each...
US-9,705,085 Method for manufacturing organic light-emitting device
The present application relates to a method of preparing an organic light emitting device. The method of preparing the organic light emitting device according...
US-9,705,083 Method for stretching vapor deposition mask, method for producing frame-equipped vapor deposition mask, method...
In a method for stretching a vapor deposition mask including a metal mask in which a slit is formed and a resin mask in which an opening corresponding to a...
US-9,705,077 Spin torque MRAM fabrication using negative tone lithography and ion beam etching
A method for forming a memory device includes masking a photoresist material using a reticle and a developer having a polarity opposite that of the photoresist...
US-9,705,076 Magnetoresistive element and manufacturing method of the same
According to one embodiment, there is provided a magnetoresistive element, including a lower electrode having crystallinity on a substrate, a first conductive...
US-9,705,063 Sacrificial shorting straps for superconducting qubits
A technique relates to protecting a tunnel junction. A first electrode paddle and a second electrode paddle are on a substrate. The first and second electrode...
US-9,705,062 Encapsulation of high temperature thermoelectric modules
A method of encapsulating a thermoelectric device and its associated thermoelectric elements in an inert atmosphere and a thermoelectric device fabricated by...
US-9,705,058 Method for producing a plurality of optoelectronic semiconductor chips, and optoelectronic semiconductor chip
An optoelectronic semiconductor chip includes a semiconductor body that has a semiconductor layer sequence and at least one opening that extends through a...
US-9,705,057 Method for producing a laser diode, mount and laser diode
In a method for producing a laser diode, a number of laser diodes are produced on a wafer. The wafer is broken down into wafer pieces, each wafer piece having a...
US-9,705,054 Light emitting device module
A light emitting device module including a first and second lead frames, a light emitting device electrically connected to the first and second lead frames, the...
US-9,705,046 Light emitting apparatus
Disclosed is a light emitting apparatus which includes at least one light emitting device; a substrate under the light emitting device; a bonding member between...
US-9,705,042 Micro assembled LED displays and lighting elements
The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with...
US-9,705,028 Light emitting diodes with N-polarity and associated methods of manufacturing
Light emitting diodes ("LEDs") with N-polarity and associated methods of manufacturing are disclosed herein. In one embodiment, a method for forming a light...
US-9,705,024 Invisible light flat plate detector and manufacturing method thereof, imaging apparatus
The present invention provides an invisible light flat plate detector and a manufacturing method thereof, an imaging apparatus, relates to the field of...
US-9,705,023 Avalanche photodiode and manufacturing method thereof
An avalanche photodiode includes a GeOI substrate; an I--Ge absorption layer configured to absorb an optical signal and generate a photo-generated carrier; a...
US-9,705,022 Photovoltaic device
This photovoltaic device is provided with a crystalline semiconductor substrate, and a first amorphous layer formed on the main surface of the substrate. At the...
US-9,705,020 Sheet and module structure
A module structure is provided, which includes a front sheet, a back sheet opposite the front sheet, and a solar cell disposed between the front sheet and the...
US-9,705,012 Method of passivating an iron disulfide surface via encapsulation in zinc sulfide
A method for passivating the surface of crystalline iron disulfide (FeS.sub.2) by encapsulating it in crystalline zinc sulfide (ZnS). Also disclosed is the...
US-9,704,995 Gate all around device architecture with local oxide
A system and method for fabricating non-planar devices while managing short channel and heating effects are described. A semiconductor device fabrication...
US-9,704,993 Method of preventing epitaxy creeping under the spacer
After forming a gate spacer on each sidewall of a sacrificial gate structure, portions of each dielectric fin cap portion underneath the gate spacer is...
US-9,704,991 Gate height and spacer uniformity
Embodiments are directed to a method of forming a semiconductor device and resulting structures having self-aligned spacer protection layers. The method...
US-9,704,983 Lateral MOSFET with dielectric isolation trench
A lateral trench MOSFET comprises an insulating layer buried in a substrate, a body region in the substrate, an isolation region in the substrate, a first...
US-9,704,979 Semiconductor device and an electronic device
A semiconductor device and an electronic device are improved in performances by supporting a large current. An emitter terminal protrudes from a first side of a...
US-9,704,971 Epi facet height uniformity improvement for FDSOI technologies
A method of controlling the facet height of raised source/drain epi structures using multiple spacers, and the resulting device are provided. Embodiments...
US-9,704,961 Semiconductor structure having buried gate structure, method for manufacturing the same, and memory cell having...
A method for forming a semiconductor structure includes forming a trench in a semiconductor substrate; forming a gate dielectric layer over a bottom surface and...
US-9,704,951 Apparatus and method for magnetic-field guided metal-assisted chemical etching
A magnetic field-guided method of metal-assisted chemical etching comprises immersing a structure that comprises a two-dimensional magnetic pattern layer on a...
US-9,704,947 Semiconductor device and method for manufacturing same
A semiconductor device including a terminal region that can suppress a resist collapse in manufacturing and effectively relieve a concentration of electric...
US-9,704,914 Array substrate and method for manufacturing the same, x-ray flat panel detector, image pickup system
An array substrate and manufacturing method thereof, an X-ray flat panel detector and an image pickup system are provided. The array substrate is divided into a...
US-9,704,913 Manufacturing of an imager device and imager device
Embodiments related to the manufacturing of an imager device and an imager device are disclosed. Embodiments associated with methods of an imager device are...
US-9,704,908 Methods and applications of non-planar imaging arrays
System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging...
US-9,704,892 Display panel
A display panel including a first substrate, a second substrate and a display medium is provided. The first substrate includes a base substrate, a gate, an...
US-9,704,885 Pixel structure, array substrate and display device
A pixel structure, an array substrate and a display device. The pixel substrate comprises a first pixel electrode and a second pixel electrode arranged in a...
US-9,704,884 Low temperature poly-silicon (LTPS) thin film transistor based liquid crystal display
An array substrate comprises a substrate, a common electrode formed on the substrate, a light shielding layer disposed on the common electrode, an insulating...
US-9,704,876 Semiconductor apparatus with multiple tiers, and methods
Apparatus and methods are disclosed, including an apparatus that includes a number of tiers of a first semiconductor material, each tier including at least one...
US-9,704,870 Compact semiconductor memory device having reduced number of contacts, methods of operating and methods of making
An integrated circuit including a link or string of semiconductor memory cells, wherein each memory cell includes a floating body region for storing data. The...
US-9,704,854 DC-to-DC converter and method for fabricating the same
A DC-to-DC converter includes: a substrate having a switching element region defined by an isolation layer; a transistor formed over the switching element...
US-9,704,847 Variable capacitance device
A variable capacitance device that includes a semiconductor substrate, a redistribution layer disposed on a surface of the semiconductor substrate, and a...
US-9,704,836 Semiconductor package assembly
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first semiconductor package including a first...
US-9,704,827 Hybrid bond pad structure
The present disclosure relates to a multi-dimensional integrated chip having a redistribution layer vertically extending between integrated chip die, which is...
US-9,704,813 Method of manufacturing semiconductor device
A device region (17) is formed at a central part of a semiconductor wafer (2) and a ring-shaped reinforced portion (18) which is thicker than the device region...
US-9,704,805 Semiconductor device and manufacturing method of same
To provide a semiconductor device having improved reliability by improving a coupling property between a semiconductor chip and a bonding wire. A redistribution...
US-9,704,804 Oxidation resistant barrier metal process for semiconductor devices
An integrated circuit and method comprising an underlying metal geometry, a dielectric layer on the underlying metal geometry, a contact opening through the...
US-9,704,801 Semiconductor memory device
A semiconductor memory device includes first and second stacked bodies and a conductive body. The first and second stacked bodies are disposed side by side on...
US-9,704,797 Waterfall wire bonding
A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually...
US-9,704,792 Semiconductor package assembly
The invention provides a semiconductor package assembly. The semiconductor package assembly includes a redistribution layer (RDL) structure die-attach surface...
US-9,704,781 Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
The present technology is directed to manufacturing semiconductor dies with under-bump metal (UBM) structures for die-to-die and/or package-to-package...
US-9,704,779 Semiconductor module cooler and method for manufacturing same
A semiconductor module cooler for reducing a pressure loss of a coolant includes a first plate mounted with a first semiconductor module; a jacket disposed...
US-9,704,772 Chip package and method for forming the same
A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a...
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