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Patent # Description
US-9,735,367 Light emitting diode
A light emitting diode includes an insulating substrate, a first MgO layer, a semiconductor carbon nanotube layer, a second MgO layer, a functional dielectric...
US-9,735,366 Heterostructure comprising a carbon nanomembrane
A heterostructure comprising at least one carbon nanomembrane on top of at least one carbon layer, a method of manufacture of the heterostructure, and an...
US-9,735,365 Low band gap polymer compound, synthesis of thereof, and organic photovoltaic cell containing the same
The present disclosure relates to a novel polymer compound and a method for preparing the same. More particularly, the present disclosure relates to a novel...
US-9,735,364 OLED display device and preparation method thereof, display apparatus
An organic light emitting diode (OLED) display device and a preparation method thereof, and a display apparatus are disclosed. The OLED display device includes...
US-9,735,363 Method for imprinting opto-electronic components with bus bars
In a method for imprinting optoelectronic components with at least one bus bar, the bus bar following the shape of the optoelectronic component and allowing a...
US-9,735,362 Tunneling nanotube field effect transistor and manufacturing method thereof
A tunneling nanotube field effect transistor includes: an insulating layer disposed on a substrate; a gate electrode disposed on the insulating layer; a source...
US-9,735,361 Method of making a stack of the type comprising a first electrode, an active layer, and a second electrode
A method of making a stack of the type comprising a first electrode, an active layer, and a second electrode, for use in an electronic device, in particular of...
US-9,735,360 Access devices to correlated electron switch
Subject matter disclosed herein may relate to programmable fabrics including correlated electron switch devices.
US-9,735,359 Methods of forming a memory cell material, and related methods of forming a semiconductor device structure,...
A method of forming a memory cell material comprises forming a first portion of a dielectric material over a substrate by atomic layer deposition. Discrete...
US-9,735,358 Noble metal / non-noble metal electrode for RRAM applications
A method for forming a non-volatile memory device includes disposing a junction layer comprising a doped silicon-bearing material in electrical contact with a...
US-9,735,357 Resistive memory cell with intrinsic current control
Providing for a two-terminal memory cell having intrinsic current limiting characteristic is described herein. By way of example, the two-terminal memory cell...
US-9,735,356 Strained multilayer resistive-switching memory elements
The resistive-switching memory element of the present invention comprises a first electrode, a resistive-switching element; and a second electrode wherein the...
US-9,735,355 Electrically actuated switch
An electrically actuated switch comprises a first electrode, a second electrode, and an active region disposed therebetween. The active region comprises at...
US-9,735,354 Forming resistive random access memories together with fuse arrays
A resistive random access memory array may be formed on the same substrate with a fuse array. The random access memory and the fuse array may use the same...
US-9,735,353 Phase-change memory cell having a compact structure
A memory cell includes a selection transistor having a control gate and a first conduction terminal connected to a variable-resistance element. The memory cell...
US-9,735,352 Phase change memory element
A phase-change memory element with an electrically isolated conductor is provided. The phase-change memory element includes: a first electrode and a second...
US-9,735,351 Magneto-resistance random access memory device and method of manufacturing the same
Manufacturing a MRAM device may include removing etch residues from a magnetic tunnel junction (MTJ) pattern in the presence of an atmosphere. The removing may...
US-9,735,350 Method and system for removing boron from magnetic junctions usable in spin transfer torque memory applications
A method provides a magnetic junction having a top and sides. A first magnetic layer, a nonmagnetic spacer layer and a second magnetic layer are deposited. The...
US-9,735,349 Magnetoresistive random access memory device and method of manufacturing the same
In a method of manufacturing an MRAM device, a lower electrode and a preliminary first free layer pattern sequentially stacked are formed on a substrate. An...
US-9,735,348 High stability spintronic memory
An embodiment includes a magnetic tunnel junction (MTJ) including a free magnetic layer, a fixed magnetic layer, and a tunnel barrier between the free and fixed...
US-9,735,347 Magnetic memory device and method of manufacturing the same
According to one embodiment, a magnetic memory device includes: a first magnetic layer; a nonmagnetic layer on the first magnetic layer; a second magnetic layer...
US-9,735,346 Electronic device and method for fabricating the same
An electronic device may include a semiconductor memory. The semiconductor memory may include a substrate including a first region and a second region; buried...
US-9,735,345 Vertical hall effect sensor
In one aspect, a vertical Hall effect sensor includes a semiconductor wafer having a first conductivity type and a plurality of semiconductive electrodes...
US-9,735,344 Hybrid hall effect magnetoelectronic gate
Hybrid Hall Effect Devices implemented with Spin Transfer Torque write capability are configured as magnetoelectronic (ME) devices. These devices are useable as...
US-9,735,343 Magnetic memory device and element
There is disclosed a memory element including a memory layer that has a magnetization perpendicular to a film face; a magnetization-fixed layer that has a...
US-9,735,342 Piezoelectric thin film and method for producing the same
A piezoelectric thin film is formed through sputtering and consists essentially of scandium aluminum nitride. The carbon atomic content is 2.5 at % or less....
US-9,735,341 Single-crystal piezoelectric fiber composite and magnetoelectric laminate composite including the same
A piezoelectric fiber composite and a magnetoelectric laminate composite including the same are disclosed. The piezoelectric fiber composite includes a first...
US-9,735,340 Method of manufacturing an electronic component
A method for manufacturing an electronic component is provided where resin adhesive rarely spreads before curing. The method includes providing a first sealing...
US-9,735,339 Piezoelectric device and an apparatus
A piezoelectric device comprises at least one element comprising at least one sheet of piezoelectric material. The element is mounted on a circuit board...
US-9,735,338 Protected resonator
A bulk acoustic wave resonator structure that isolates the core resonator from both environmental effects and aging effects. The structure has a piezoelectric...
US-9,735,337 Piezoelectric actuator
A piezoelectric actuator comprises a substantially rectangular parallelepiped piezoelectric element. One outer surface of the piezoelectric element includes a...
US-9,735,335 Thermoelectric conversion element and pyroelectric sensor
A thermoelectric conversion element includes a first electrode on provided a substrate; a pyroelectric film that is provided on the first electrode, is formed...
US-9,735,334 Apparatus for manufacturing thermoelectric module
An apparatus for manufacturing a thermoelectric module includes an alignment mechanism for aligning a plurality of thermoelectric elements with respect to a...
US-9,735,333 Thermoelectric module
A thermoelectric module is provided that includes a housing that has at least two opposite walls, and a plurality of thermoelectric elements that have at least...
US-9,735,332 Thermoelectric power generation system for vehicle
A thermoelectric power generation system for a vehicle is provided. The system includes an air compressor that is configured to compress and discharge air and a...
US-9,735,331 Bonding wire for semiconductor package and semiconductor package including same
Provided is a bonding wire for a semiconductor package and a semiconductor package including the same. The bonding wire for the semiconductor package may...
US-9,735,330 Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices,...
A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame...
US-9,735,329 Light emitting diode
A light emitting diode including a first light emitting cell and a second light emitting cell separated from each other on a substrate, a first transparent...
US-9,735,328 Light emitting device package and lighting apparatus including the package
Embodiments provide a light emitting device package including a substrate, a light emitting structure disposed under the substrate and including a first...
US-9,735,327 Light emitting device and manufacturing method for same
Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a support substrate, a reflective ohmic contact...
US-9,735,326 Method of producing light emitting device
A method of producing a light emitting device includes providing a light emitting element on a base member, the base member including an insulating member and a...
US-9,735,325 Semiconductor device and manufacturing method of semiconductor device
According to one embodiment, a manufacturing method of a semiconductor device includes the transferring a first group from a first support to a second support;...
US-9,735,324 Light emitting device and manufacturing method thereof
A light emitting device including a substrate including an entire top surface that is flat, a light emitting diode on the substrate, a lead frame disposed on...
US-9,735,323 Light emitting device having a triple phosphor fluorescent member
A light emitting device includes a light emitting element of a peak emission wavelength in a range of 430 nm to 470 nm and a fluorescent member. The fluorescent...
US-9,735,322 Light-emitting diode package
The present invention relates to a light-emitting diode package comprising a high-strength molding part. The light-emitting diode package, according to the...
US-9,735,321 Light-emitting diode including a plurality of luminescent regions
Various embodiments may relate to A light-emitting diode, including an LED chip having at least one emitter surface for emitting primary light, and a plurality...
US-9,735,320 LED packages and manufacturing method thereof
A method of manufacturing LED packages includes the steps of: forming a conductive circuit layer on a substrate; screen printing a wall layer on the conductive...
US-9,735,319 Radiation emitting or receiving optoelectronic semiconductor chip
An optoelectronic semiconductor chip includes a multiplicity of active regions arranged at a distance from one another, and a continuous current spreading...
US-9,735,318 Epitaxial hexagonal materials on IBAD-textured substrates
A multilayer structure including a hexagonal epitaxial layer, such as GaN or other group III-nitride (III-N) semiconductors, a <111> oriented textured...
US-9,735,317 Method for forming a semiconducting portion by epitaxial growth on a strained portion
The invention pertains to formation of a semiconducting portion (60) by epitaxial growth on a strained germination portion (40), comprising the steps in which a...
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