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Patent # Description
US-9,793,489 Pyrene compound and organic light emitting diode device including the same
A pyrene compound and an organic light emitting diode device including the same are disclosed. The organic light emitting diode device includes at least two...
US-9,793,488 Compound for organic optoelectronic element, organic light-emitting element comprising same, and display device...
Disclosed are a compound for an organic optoelectronic device, an organic light emitting diode including the same, and a display device including the organic...
US-9,793,487 Organic light-emitting device
An organic light-emitting device includes: a first electrode; a second electrode; and an organic layer between the first electrode and the second electrode, the...
US-9,793,486 Polymer compound and light-emitting element using the same
A polymer compound is provided having a constitutional unit represented by the following formula (1): ##STR00001## wherein: R.sup.1 and R.sup.2 represent an...
US-9,793,485 Benzocyclobutenes derived compositions, and electronic devices containing the same
The invention provides compositions comprising crosslinkable BCB-functionalized materials for use in OLEDs applications. The inventive compositions can be used...
US-9,793,484 Composition comprising polymeric organic semiconducting compounds
The present invention relates to novel compositions comprising one or more polymeric organic semiconducting (OSC) compounds and one or more organic solvents....
US-9,793,483 Hexafluoroisopropanol group-containing diamine, polyimide and polyamide using same, cyclized product thereof,...
Disclosed are a diamine represented by the following formula, a polyimide and a polyamide using the same as the raw material, a cyclized product thereof, and a...
US-9,793,482 Light-emitting device and method for manufacturing the same
The present invention provides a display device and a manufacturing method thereof that can simplify manufacturing steps and enhance efficiency in the use of...
US-9,793,481 Patterning by stamped metal resist
A method is provided. A first layer is provided over a substrate, the first layer comprising a first material. A patterned second layer is applied over the...
US-9,793,480 Method for manufacturing organic electronic devices
The present invention relates to a method for manufacturing organic electronic devices including a dipyrannylidene film as an anodic interface layer, the method...
US-9,793,479 Methods for fabricating devices including photovoltaic devices
Embodiments described herein provide methods for processing various polymer materials for use in devices, such as photovoltaic devices. In some cases, oxidative...
US-9,793,478 Structured silicon-based thermal emitter
An optical radiation source produced from a disordered semiconductor material, such as black silicon, is provided. The optical radiation source includes a...
US-9,793,477 Multinozzle emitter arrays for ultrahigh-throughput nanoelectrospray mass spectrometry
The present invention provides for a structure comprising a plurality of emitters, wherein a first nozzle of a first emitter and a second nozzle of a second...
US-9,793,476 Apparatus and method for treating a substrate
Provided are a substrate treating apparatus and method of manufacturing a phase-change layer having superior deposition characteristics. The substrate treating...
US-9,793,474 Low temperature P+ polycrystalline silicon material for non-volatile memory device
A method of forming a non-volatile memory device. The method includes providing a substrate having a surface region and forming a first dielectric material...
US-9,793,473 Memristor structures
A memristor structure may be provided that includes a first electrode, a second electrode, and a buffer layer disposed on the first electrode. The memristor...
US-9,793,472 Method for forming a hard mask pattern and method for manufacturing a semiconductor device using the same
The inventive concepts provide a method for forming a hard mask pattern. The method includes forming a hard mask layer on an etch target layer disposed on a...
US-9,793,471 Spin transfer torque cell for magnetic random access memory
Embodiments are directed to STT MRAM devices. One embodiment of an STT MRAM device includes a reference layer, a tunnel barrier layer, a free layer and one or...
US-9,793,470 Magnetoresistive stack/structure and method of manufacturing same
A method of manufacturing a magnetoresistive stack/structure comprising etching through a second magnetic region to (i) provide sidewalls of the second magnetic...
US-9,793,469 Magnetoresistive element and magnetic memory
A magnetoresistive element according to an embodiment includes: a first magnetic layer; a second magnetic layer; a first nonmagnetic layer disposed between the...
US-9,793,468 Magnetoresistive MTJ stack having an unpinned, fixed synthetic anti-ferromagnetic structure
A magnetoresistive magnetic tunnel junction (MTJ) stack includes a free magnetic region, a fixed magnetic region, and a dielectric layer positioned between the...
US-9,793,467 Method for reducing size and center positioning of magnetic memory element contacts
A method of centering a contact on a layer of a magnetic memory device. In one embodiment, a spacers is formed in an opening surrounding the upper layer and the...
US-9,793,466 Ultrasonic sensor and manufacturing method thereof
An ultrasonic sensor includes a substrate. A first electrode and a first piezoelectric layer are stacked on one side of the substrate. A second electrode and a...
US-9,793,465 Ultrasonic sensor utilizing chemically strengthened glass as substrate
An ultrasonic sensor includes a first electrode, a first piezoelectric layer, a substrate, a second electrode, a second piezoelectric layer, and a third...
US-9,793,464 Ferroelectric film and method for manufacturing the same
To produce a ferroelectric film formed of a lead-free material. The ferroelectric film according to an aspect of the present invention includes a...
US-9,793,463 Piezoelectric vibration module
Disclosed herein is a piezoelectric vibration module capable of improving adhesion between a piezoelectric element and an external electrode disposed on the...
US-9,793,462 Thermoelectric module, thermoelectric power generating apparatus, and thermoelectric generator
A thermoelectric module includes a low temperature-side wiring line, a high temperature-side wiring line, a low temperature-side member, a plurality of low...
US-9,793,461 Nano-structured porous thermoelectric generators
Methods and processes to fabricate thermoelectric materials and more particularly to methods and processes to fabricate nano-sized doped silicon-based...
US-9,793,460 Thermoelectric conversion module
A thermoelectric conversion module is disclosed that corrects the difference in thermal resistance between a P-type thermoelectric conversion member and an...
US-9,793,459 Light emitting device having heat dissipation terminal arranged on substrate
A light emitting device includes a substrate, a light emitting element, a sealing member, a light transmissive member and a heat dissipation terminal. The...
US-9,793,458 Light-emitting device and method of manufacturing thereof
The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor...
US-9,793,457 Light emitting device package and lighting apparatus having same
An embodiment relates to a light emitting device package and a lighting apparatus having the same. According to the embodiment, A light emitting device package...
US-9,793,456 Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted...
A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which...
US-9,793,455 Semiconductor light-emitting device
A semiconductor light-emitting device can include a wavelength converting layer including a surrounding portion, which covers at least one semiconductor...
US-9,793,454 Method for making a light-emitting device
This disclosure discloses a method for making a light-emitting device, comprising steps of: providing a substrate; forming a light-emitting stack on the...
US-9,793,453 Light emitting device
A light emitting device includes a package that has an opening, a first outer side surface of a first resin and a second outer side surface of a second resin,...
US-9,793,452 Blue light leakage-suppressing LED structure
A blue light leakage-suppressing LED structure for emitting white light includes at least one LED chip, an encapsulation element, a light output lens, and an...
US-9,793,451 Light-emitting diode device
An encapsulated light-emitting diode device is disclosed. The encapsulated light-emitting diode device includes a circuit carrier including a surface; a...
US-9,793,450 Light emitting apparatus having one or more ridge structures defining at least one circle around a common center
A light emitting device includes a light emitting device on a substrate; an encapsulation layer covering the light emitting device; and a texture layer on the...
US-9,793,449 LED package structure and LED light-emitting device
The present disclosure provides a LED package structure and a LED light-emitting device. The LED package structure comprises a LED chip and a wavelength...
US-9,793,448 Light emitting diode chip having wavelength converting layer and method of fabricating the same, and package...
A light-emitting diode (LED) includes a substrate, a semiconductor stacked structure disposed on the substrate, the semiconductor stacked structure including a...
US-9,793,447 Optoelectronic semiconductor chip and optoelectronic semiconductor component
An optoelectronic semiconductor chip has a non-rectangular, parallelogram-shaped top surface and an active zone, which is at a distance from the top surface and...
US-9,793,446 Composite having semiconductor structure including a nanocrystalline core and shell embedded in a matrix
Composites having semiconductor structures embedded in a matrix are described. In an example, a composite includes a matrix material. A plurality of...
US-9,793,445 Method of manufacturing optoelectronic components and device for manufacturing optoelectronic components
A method of manufacturing optoelectronic components includes spraying a fluorescent layer of an optoelectronic component onto a substrate, the substance or the...
US-9,793,444 Display device and electronic device
One object of the invention is to provide a display device that can display an image which causes a viewer less strain associated with viewing and gives a...
US-9,793,443 Method for manufacturing an optical unit and electronic apparatus
A purpose of the present disclosure is to provide an optical unit that is capable of effectively sealing one or a plurality of optical devices even without a...
US-9,793,442 Optoelectronic component
An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a...
US-9,793,441 Light emitting diode module for surface mount technology and method of manufacturing the same
An LED is provided to include: a first conductive type semiconductor layer; an active layer positioned over the first conductive type semiconductor layer; a...
US-9,793,440 Light emitting diode having electrode pads
A substrate, a first conductive type semiconductor layer arranged on the substrate, a second conductive type semiconductor layer arranged on the first...
US-9,793,439 Metallic contact for optoelectronic semiconductor device
A contact to a semiconductor layer in a light emitting structure is provided. The contact can include a plurality of contact areas formed of a metal and...
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