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Patent # Description
US-9,865,794 Thermoelectric devices with interface materials and methods of manufacturing the same
Thermoelectric devices with interface materials and methods of manufacturing the same are provided. A thermoelectric device can include at least one shunt, at...
US-9,865,793 Method of forming a thermally enhanced energy generator
A method for forming an energy generating device which includes two layers of dissimilar materials in terms of electron density and configuration in contact...
US-9,865,792 System and method for manufacturing a temperature difference sensor
An embodiment of the invention relates to a Seebeck temperature difference sensor that may be formed in a trench on a semiconductor device. A portion of the...
US-9,865,791 Nanostructured copper-selenide with high thermoelectric figure-of-merit and process for the preparation thereof
Disclosed is a nanostructured p-type copper-selenide as a cost-effective thermoelectric material with a high thermoelectric figure-of-merit. The nanostructured...
US-9,865,790 Nanostructured bulk thermoelectric material
A thermoelectric material includes a composite having a first electrically conducting component and second low thermal conductivity component. The first...
US-9,865,789 Device and method for thermoelectronic energy conversion
A thermoelectronic energy converter device (100) comprises an electron emitter (11) being adapted for a temperature-dependent release of electrons (1), an...
US-9,865,788 Thermoelectric device, in particular thermoelectric generator or heat pump
A thermoelectric device may include a housing that may have a first housing element and a second housing element. The first housing element and the second...
US-9,865,787 Chip substrate and chip package module
A chip substrate includes conductive portions, insulation portions, cavities and a heat dissipating portion. The insulation portions are alternately bonded to...
US-9,865,786 Method of manufacturing structures of LEDs or solar cells
The disclosure relates to a manufacturing method comprising the formation of elemental LED or photovoltaic structures on a first substrate, each comprising at...
US-9,865,785 Optoelectronic component and method of production thereof
A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts,...
US-9,865,784 Optoelectronic component including a reflective layer sequence and method for producing a reflective layer sequence
An optoelectronic component includes a first layer sequence being designed to emit or to detect electromagnetic radiation, and a second layer sequence being...
US-9,865,783 Distributed Bragg reflector on an aluminum package for an LED
A light-emitting diode (LED) assembly includes an aluminum substrate, a silver layer, a distributed Bragg reflector (DBR) and an LED device. The aluminum...
US-9,865,782 LED package structure and lens thereof
A lens of an LED package structure includes a square-shaped base layer, a first light-guiding portion integrally connected to the base layer, a second...
US-9,865,781 Method for manufacturing light emitting device comprising lens with tapered profile
A manufacturing method for a light emitting device can include providing a bonding layer over a base, and disposing a shim plate with an opening over the...
US-9,865,780 LED package with encapsulant having planar surfaces
LED packages are disclosed that are compact and efficiently emit light, and can comprise encapsulants with planar surfaces that refract and/or reflect light...
US-9,865,779 Methods of manufacturing the package and light-emitting device
A method of manufacturing a package, the method comprising the steps of: preparing a resin compact having a recess, and including a pair of leads arranged at a...
US-9,865,778 Light emitting device and lighting apparatus having same
A light-emitting device discloses a light emitting structure layer including an active layer between first and second conductive semiconductor layers, a first...
US-9,865,777 Semicondcutor light-emitting device and fabricating method thereof
A semiconductor light-emitting device including a light-emitting diode chip and an electrode disposed thereon is provided. The electrode at least includes a...
US-9,865,776 Method for separating regions of a semiconductor layer
The invention relates to a method for separating regions of a semiconductor layer and for introducing an outcoupling structure into an upper side of the...
US-9,865,775 Light emitting element
The light emitting element is provided to comprise: a first conductive type semiconductor layer; a mesa; a current blocking layer; a transparent electrode; a...
US-9,865,774 Nitride semiconductor device and method for producing the same
A method for producing a nitride semiconductor device. The method comprises providing a substrate made of a material other than a nitride semiconductor. The...
US-9,865,773 Semiconductor light emitting device
A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions...
US-9,865,772 LED structures for reduced non-radiative sidewall recombination
LED structures are disclosed to reduce non-radiative sidewall recombination along sidewalls of vertical LEDs including p-n diode sidewalls that span a top...
US-9,865,771 Semiconductor light-emitting element
A semiconductor light-emitting element includes: a lower clad layer 12 that is provided on a substrate 10; an active layer 20 that is provided on the lower clad...
US-9,865,770 Semiconductor light emitting element and method for manufacturing the same
According to one embodiment, a light emitting element includes n-type and p-type semiconductor layers and a light emitting unit. The light emitting unit is...
US-9,865,769 Back contact LED through spalling
A method of forming, and corresponding structure, of an LED device where an LED and the contacts for the device are formed on a surface of the substrate, and...
US-9,865,768 Ultrafast light emitting diodes for optical wireless communications
In one aspect, there is provided an apparatus including a light emitting diode. The apparatus may include a plurality of layers including a substrate layer, a...
US-9,865,767 Light emitting, photovoltaic or other electronic apparatus and system
The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus...
US-9,865,766 Ultraviolet photodetectors and methods of making ultraviolet photodetectors
A method of making an ultraviolet sensor includes applying a metal-containing solution to a substrate using a spin coating technique to form a metal-containing...
US-9,865,765 Package structure with optical barrier, optical package structure and manufacturing methods thereof
A package structure with an optical barrier is provided. An emitter for emitting an optical signal and a detector for receiving the optical signal are disposed...
US-9,865,764 Image capture device with integrated illumination and method for producing the device
An image capture device to produce images of an object in contact with or in immediate proximity to the device comprises a sensor and illumination means capable...
US-9,865,763 Method, a semiconductor detector, and a detector arrangement, for the detection of sunlight
The present invention concerns a method for the detection of sunlight with a detector arrangement that delivers an output signal as a function of incident...
US-9,865,762 Thin-film photoelectric conversion device and method for manufacturing same
The thin-film photoelectric conversion device of the present invention includes: a transparent electroconductive film having zinc oxide as a main component; a...
US-9,865,761 Emitter-less, back-surface alternating-contact solar cell
The disclosure provides an emitter-less solar cell design featuring p-or-n type GaAs with alternating p-n junction regions on the back-surface of the cell,...
US-9,865,759 Solar cell interconnection
A solar cell can include a conductive foil having a first portion with a first yield strength coupled to a semiconductor region of the solar cell. The solar...
US-9,865,758 Collector grid and interconnect structures for photovoltaic arrays and modules
An interconnected arrangement of photovoltaic cells is achieved using laminating current collector electrodes. The electrodes comprise a pattern of conductive...
US-9,865,757 Method for quick self interconnection of photovoltaic cell arrays and panels
Interconnectable solar photovoltaic appliance that can be connected to each other and other derivative products in multiple series and parallel configurations...
US-9,865,756 Method for manufacturing a thin-layer photovoltaic device, in particular for solar glazing
A method for producing a thin-film photovoltaic device (1), comprising the following steps: providing a substrate (2); placing a photovoltaic film (3) on said...
US-9,865,755 Method for producing a thin film cell arrangement
The present invention relates to a method for the production of a thin-film solar cell array in which a plurality of individual thin-film solar cells are...
US-9,865,754 Hole collectors for silicon photovoltaic cells
One embodiment of the present invention provides a solar cell. The solar cell includes a base layer comprising crystalline Si (c-Si), a hole collector situated...
US-9,865,753 Metallization of solar cells using metal foils
A solar cell structure includes P-type and N-type doped regions. A dielectric spacer is formed on a surface of the solar cell structure. A metal layer is formed...
US-9,865,752 Encapsulating material for solar cell and solar cell module
An encapsulating material for solar cell of the invention contains an ethylene/.alpha.-olefin copolymer, and a content of a fluorine element in the...
US-9,865,751 Method for producing pretinned connectors for PV cells and metal foil with a corrugated structure running in...
To produce pretinned strips of connectors for PV cells, a metal foil (30) is guided through a roll gap (46) of a rolling mill in which at least one work roll...
US-9,865,750 Schottky diode
The present disclosure generally relates to a Schottky diode that has a substrate, a drift layer provided over the substrate, and a Schottky layer provided over...
US-9,865,749 Merged P-i-N Schottky structure
A Merged P-i-N Schottky device in which the oppositely doped diffusions extend to a depth and have been spaced apart such that the device is capable of...
US-9,865,748 Semiconductor structure and method for manufacturing the same
A semiconductor structure includes a semiconductor substrate having a first electrical portion, a second electrical portion, and a bridged conductive layer. The...
US-9,865,747 Etch stop region based fabrication of bonded semiconductor structures
Bonded semiconductor device structures and device structure fabrication processes to obviate the need for SOI wafers in many device fabrication applications are...
US-9,865,746 Semiconductor device
A highly reliable semiconductor device having stable electrical characteristics is provided. Oxide films each containing one or more kinds of metal elements...
US-9,865,745 Thin-film transistor and method for forming the same
A thin-film transistor comprises a substrate, a first electrode on the top surface of the substrate, an insulation layer on the top surface of the substrate and...
US-9,865,744 Semiconductor device
The semiconductor device includes a power element which is in an on state when voltage is not applied to a gate, a switching field-effect transistor for...
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