Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-9,941,232 Electronic component device
An electronic component device includes: a lower wiring substrate; an electronic component on the lower wiring substrate; an upper wiring substrate disposed...
US-9,941,231 Semiconductor device
A semiconductor chip includes a substrate, an electrode pad formed on the substrate, an insulating layer covering the substrate and the electrode pad, and...
US-9,941,230 Electrical connecting structure between a substrate and a semiconductor chip
The present invention provides an electrical connecting structure between a substrate 21 and a semiconductor chip 22. The electrical connecting structure...
US-9,941,229 Device including semiconductor chips and method for producing such device
A device includes a first semiconductor chip including a first face, wherein a first contact pad is arranged over the first face. The device further includes a...
US-9,941,228 Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond...
US-9,941,227 Impedance matching configuration
A package is provided. The package comprises a die and an impedance matching network. The die has a first terminal and a second terminal. The impedance matching...
US-9,941,226 Integrated millimeter-wave chip package
An integrated millimeter-wave chip package structure including an interposer structure, a millimeter-wave chip and a substrate is provided. The interposer...
US-9,941,224 Multi-die integrated circuit device with capacitive overvoltage protection
An electronic device includes a package, a plurality of external leads extending outside the package, a first die within the package having one or more first...
US-9,941,223 Devices and methods for detecting counterfeit semiconductor devices
Techniques for providing a tamper mechanism for semiconductor devices are disclosed herein. The techniques include, for example, providing at least one die and...
US-9,941,222 Integrated circuit with sensor and method of manufacturing such an integrated circuit
Disclosed is an integrated circuit comprising a substrate carrying a plurality of circuit elements; a metallization stack interconnecting said circuit elements,...
US-9,941,221 Warpage control in package-on-package structures
A package includes a bottom substrate and a bottom die over and bonded to the bottom substrate. A metal-particle-containing compound material is overlying a top...
US-9,941,220 Integrated circuit
An integrated circuit includes a scribe line, a bonding pad structure and an extension pad structure. The scribe line is disposed on a substrate, and the...
US-9,941,219 Control of warpage using ABF GC cavity for embedded die package
Embodiments include semiconductor device packages and methods of forming such packages. In an embodiment, the package may include a die-side reinforcement layer...
US-9,941,218 Display apparatus capable of easily acquiring identification about a display panel and a driving chip
A display apparatus is provided including a display panel displaying an image, and a driving chip including a front surface and a rear surface provided with a...
US-9,941,217 Mark, method for forming same, and exposure apparatus
A mark forming method includes: forming recessed portion on a mark formation area of a substrate; coating the recessed portion with a polymer layer containing a...
US-9,941,216 Conductive pattern and integrated fan-out package having the same
A conductive pattern including a teardrop shaped portion, a routing line, and a connection portion is provided. The routing line links to the teardrop shaped...
US-9,941,215 Semiconductor device and method for fabricating the same
A method for fabricating semiconductor device is disclosed. First, a substrate is provided, a first gate structure is formed on the substrate, a first spacer is...
US-9,941,214 Semiconductor devices, methods of manufacture thereof, and inter-metal dielectric (IMD) structures
Semiconductor devices, methods of manufacture thereof, and IMD structures are disclosed. In some embodiments, a semiconductor device includes an adhesion layer...
US-9,941,213 Nitridized ruthenium layer for formation of cobalt interconnects
An advanced metal conductor structure is described. An integrated circuit device including a substrate having a dielectric layer is patterned. The pattern...
US-9,941,212 Nitridized ruthenium layer for formation of cobalt interconnects
An advanced metal conductor structure and a method for constructing the structure are described. A pattern is provided in a dielectric layer. The pattern...
US-9,941,211 Reducing metallic interconnect resistivity through application of mechanical strain
Methods are provided for fabricating metallic interconnect structures having reduced electrical resistivity that is obtained by applying mechanical strain to...
US-9,941,210 Semiconductor devices with protruding conductive vias and methods of making such devices
An embodiment of a semiconductor die includes a base semiconductor substrate and an electrically conductive through substrate via (TSV) extending between the...
US-9,941,208 Substrate structure and manufacturing method thereof
A substrate structure includes a metal substrate, a first connection layer, a second connection layer, a dielectric material layer, a metal core layer and an...
US-9,941,207 Semiconductor device and method of fabricating 3D package with short cycle time and high yield
A method of making a semiconductor device comprising the steps of providing a first manufacturing line, providing a second manufacturing line, and forming a...
US-9,941,206 Interconnection structures for semiconductor devices and methods of fabricating the same
An interconnection structure includes an underlying layer including a lower interconnection, and an interlayered dielectric layer including a contact hole and a...
US-9,941,205 Electrical fuse and/or resistor structures
Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a...
US-9,941,204 III-V compatible anti-fuses
An anti-fuse is provided above a semiconductor material. The anti-fuse includes a first end region including a first metal structure; a second end region...
US-9,941,203 Method of making electrical antifuse
An antifuse structure including a first electrode that is present in at a base of the opening in the dielectric material. The antifuse structure further...
US-9,941,202 Dielectric thermal conductor for passivating efuse and metal resistor
A semiconductor device includes a first dielectric layer formed on a second dielectric layer and planar contacts formed in the second dielectric layer. The...
US-9,941,201 Magnetically decoupled inductor structures
In one embodiment, an integrated circuit die includes first and second inductor structures, a first ground conductor, a second ground conductor and a conductive...
US-9,941,200 Contact trench between stacked semiconductor substrates
A first semiconductor substrate layer supports a first transistor including a first source-drain formed by a doped region of the substrate layer. A second...
US-9,941,199 Two step metallization formation
An integrated circuit structure includes a first conductive line, a dielectric layer over the first conductive line, a diffusion barrier layer in the dielectric...
US-9,941,198 Method of manufacturing a flexible substrate with carbon nanotube vias and corresponding flexible substrate
There is provided a method for manufacturing a flexible film comprising carbon nanotube interconnects, the method comprising: providing a first substrate;...
US-9,941,197 Strip-shaped substrate for producing chip carriers, electronic module with a chip carrier of this type,...
A strip-shaped substrate made from a film includes a plurality of units for producing chip carriers. Each unit has a chip island for fixing a semiconductor...
US-9,941,196 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
In one embodiment, a semiconductor device includes a semiconductor substrate having a first surface, and a second surface opposite to the first surface. The...
US-9,941,195 Vertical metal insulator metal capacitor
A semiconductor device and a method are disclosed herein. The semiconductor device includes a device die, a molding layer surrounding the device die, a...
US-9,941,194 Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
In an embodiment, a substrate made of a first material and having a surface is provided. A first and second nozzle dispense a first solvent paste including...
US-9,941,193 Semiconductor device package having solder-mounted conductive clip on leadframe
A conductive clip for a semiconductor device package. In one example, the conductive clip may include a number of protrusions that extend from a surface of the...
US-9,941,192 Semiconductor device having repairable penetration electrode
A semiconductor device having a repairable penetration electrode is provided. The semiconductor device having the repairable penetration electrode includes...
US-9,941,191 Non-bridging contact via structures in proximity
A first photoresist layer is patterned with a first pattern that includes an opening in a region between areas of two adjacent via holes to be formed. The...
US-9,941,189 Counter-flow expanding channels for enhanced two-phase heat removal
A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding...
US-9,941,188 Assembly of an integrated circuit chip and of a plate
An assembly includes an integrated circuit chip and a plate with at least one heat removal channel arranged between the chip and the plate. Metal sidewalls are...
US-9,941,187 Power converter and method for manufacturing power converter
A power converter includes a plurality of power cards, a plurality of coolers and a pressure member. Each of the power cards houses a semiconductor element. The...
US-9,941,186 Method for manufacturing semiconductor structure
A method for manufacturing a semiconductor structure is disclosed. The method includes: providing a semiconductor substrate having a plurality of dies thereon;...
US-9,941,185 Variable heat conductor
A method and apparatus for a variable heat conductor that is able to increase heat conduction capacity based on operating temperature. The variable heat...
US-9,941,184 Thermal interface material on package
A packaged assembly is disclosed, including thermal interface material dispensed on an organic package and methods of manufacturing. The method includes...
US-9,941,183 Wall mountable connector with wall covering plate
A wall mountable connector assembly with an optional wall covering plate is disclosed. The wall mountable connector provides electrical connections to each of a...
US-9,941,182 Electronic device and method for manufacturing same
In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin,...
US-9,941,181 Chip package and method of forming a chip package
In various embodiments, a chip package is provided. The chip package may include a chip including a chip metal surface, a metal contact structure electrically...
US-9,941,180 Semiconductor device and manufacturing method thereof
A semiconductor package and a manufacturing method thereof, which can reduce the size of the semiconductor package and improve product reliability. In a...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.