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Patent # Description
US-9,966,291 De-chuck control method and plasma processing apparatus
A de-chuck control method is provided for de-chucking a workpiece from an electrostatic chuck that electrostatically attracts the workpiece. The de-chuck...
US-9,966,290 System and method for wafer alignment and centering with CCD camera and robot
A wafer alignment system includes an image capture module that captures an image of a wafer positioned on a robot. An image analysis module analyzes the image...
US-9,966,289 Substrate processing apparatus, method for manufacturing semiconductor device, and non-transitory...
An apparatus and method capable of reducing the footprint of substrate processing system. An apparatus includes a housing chamber including a housing cabinet...
US-9,966,288 Structure for fastening together resin members in substrate storing container
The lower lid includes a bottom plate that supports the substrate storing container and a lower lid peripheral wall that extends upwards from a periphery of the...
US-9,966,287 Drying holder for solar cell and method for producing solar cell
A drying holder holds a solar cell in an upright state, and is used in an electrode drying process. The drying holder is provided with a base part on which the...
US-9,966,286 Substrate processing apparatus
A space needed to transfer a substrate container is decreased. A substrate processing apparatus includes a locating part where a substrate container...
US-9,966,285 Teaching method and substrate treating apparatus using the same
Disclosed is a teaching method of setting a location of a robot that transports a substrate onto a rotatable support plate that supports the substrate, the...
US-9,966,284 Alignment method, pattern formation system, and exposure device
According to one embodiment, an alignment method includes calculating a position gap of a predetermined point in a device area of a wafer based on a stress...
US-9,966,282 Substrate processing apparatus and substrate processing method
According to one embodiment, a substrate processing apparatus includes a first liquid supplier, a second liquid supplier, and a controller. The first liquid...
US-9,966,281 Methods and systems for chemical mechanical polish cleaning
The present disclosure provides a cleaning unit for a chemical mechanical polishing (CMP) process. The cleaning unit comprises a cleaning solution; a brush...
US-9,966,280 Process gas generation for cleaning of substrates
Provided is a method and system for cleaning a substrate with a cleaning system comprising a pre-treatment system and a wet clean system. One or more objectives...
US-9,966,279 Method for manufacturing semiconductor device
The reliability of a semiconductor device is improved. During resin injection in a molding step, in a plan view, a plurality of gates of a molding die are...
US-9,966,278 Stack packages having with confined underfill fillet and methods of manufacturing the same
There is provided a method of manufacturing a stack package. The method includes vertically stacking core dies on a base die wafer to provide a stack structure,...
US-9,966,277 Arrangement and method for manufacturing the same
An arrangement is provided. The arrangement may include: a substrate having a front side and a back side, a die region within the substrate, a multi-purpose...
US-9,966,276 Semiconductor device and manufacturing method thereof
Provided are a semiconductor device including an interposer having a relatively thin thickness without a through silicon via and a method of manufacturing the...
US-9,966,275 Methods of treating nitride films
Methods for reducing oxygen content in an oxidized annealed metal nitride film comprising exposing the film to a plasma.
US-9,966,274 Method of generating plasma in remote plasma source and method of fabricating semiconductor device using the...
Provided are a method of generating plasma and a method of fabricating a semiconductor device including the method, which may improve selectivity in an etching...
US-9,966,273 Plasma etching method
There is provided a plasma etching method. The plasma etching method includes generating plasma, by using a first high frequency power output from a first high...
US-9,966,272 Methods for nitride planarization using dielectric
The disclosure is directed to methods of planarizing an integrated circuit structure including: forming a dielectric over a first nitride layer; planarizing the...
US-9,966,271 Method for modifying epitaxial growth shape
Methods for forming semiconductor devices, such as FinFET devices, are provided. An epitaxial film is formed over a semiconductor fin, and the epitaxial film...
US-9,966,270 Gas reaction trajectory control through tunable plasma dissociation for wafer by-product distribution and etch...
Methods, systems, and computer programs are presented for controlling gas flow in a semiconductor manufacturing chamber. The method includes flowing a reactant...
US-9,966,269 Polishing liquid for CMP, polishing liquid set for CMP, and polishing method
One embodiment of the present invention relates to a polishing liquid for CMP containing cerium oxide particles and water, wherein the half-value width of the...
US-9,966,268 Method of manufacturing semiconductor device and substrate processing apparatus
Provided are a method of manufacturing a semiconductor device capable of forming a high-quality film having low roughness and resistivity and a substrate...
US-9,966,267 Semiconductor device having vertical channels and method of manufacturing the same
A method of manufacturing a semiconductor device which can prevent leakage current caused by gate electrodes intersecting element isolation layers in a major...
US-9,966,266 Apparatus for semiconductor wafer treatment and semiconductor wafer treatment
An apparatus for semiconductor wafer treatment includes a wafer holding unit configured to receive a single wafer, at least a solution supply unit configured to...
US-9,966,265 Method of high voltage device fabrication
A method for manufacturing a semiconductor device includes providing a substrate structure including a substrate having multiple structures. Each of the...
US-9,966,264 Substrate for semiconductor device and method of manufacturing the same
A substrate for semiconductor device includes a substrate, a reaction layer provided on a back surface of the substrate, a transmission preventing metal having...
US-9,966,263 Method of fabricating fin structure
A method of fabricating fin structure is provided. A patterned catalyst layer and a patterned passivation layer extending along a first direction are formed on...
US-9,966,262 Methods of fabricating a semiconductor device
Methods of fabricating a semiconductor device are provided. The methods may include forming a hard mask film on a lower film and forming first spacers on the...
US-9,966,261 Method of manufacturing semiconductor device
Described herein is a technique capable of improving the uniformity of device characteristics. A method of manufacturing a semiconductor device may include: (a)...
US-9,966,260 Surface modification process for laser application
Laser lift-off methods are described in which optical flatness is provided on the back side of a temporary substrate using either an optical layer or optical...
US-9,966,259 Silicon-based substrate, semiconductor device, and method for manufacturing semiconductor device
A silicon-based substrate on which a nitride compound semiconductor layer is formed on a front surface thereof, including a first portion provided on the front...
US-9,966,258 Method of growing gallium nitride-based crystal and heat treatment apparatus
There is provided a method of growing a gallium nitride-based crystal, including: forming an interlayer including aluminum nitride or aluminum oxide on a...
US-9,966,257 Nanowire epitaxy on a graphitic substrate
A composition of matter comprising at least one nanowire on a graphitic substrate, said at least one nanowire having been grown epitaxially on said substrate,...
US-9,966,256 Film forming method and film forming apparatus
There is provided a method of forming a film on a surface to be processed of a workpiece, the method including: accommodating the workpiece with a ...
US-9,966,255 Method of densifying films in semiconductor device
Methods of densifying films, cross-linking films, and controlling the stress of films are provided herein. Methods include forming a removable film on a...
US-9,966,254 Method and apparatus for heat-treating high dielectric constant film
A substrate in which a high-dielectric-constant gate insulator is formed on a silicon substrate with an interface layer film sandwiched in between is housed in...
US-9,966,253 Forming nanotips
A nanotip apparatus which includes nanotips arranged in a pattern on a semiconductor base. Each of the nanotips have a pointed tip portion and a base portion in...
US-9,966,252 Method of manufacturing semiconductor device and substrate processing apparatus
Provided is a method of manufacturing a semiconductor device. The method includes: (a) forming an oxide film having a predetermined thickness on a substrate by...
US-9,966,251 Method of manufacturing semiconductor device and substrate processing apparatus
Provided is a method of manufacturing a semiconductor device. The method includes: (a) forming an oxide film having a predetermined thickness on a substrate by...
US-9,966,250 Method to transfer two dimensional film grown on metal-coated wafer to the wafer itself in a face-to-face manner
A method of in-situ transfer during fabrication of a component comprising a 2-dimensional crystalline thin film on a substrate is disclosed. In one embodiment,...
US-9,966,249 Silicon carbide semiconductor substrate and method for manufacturing same
A silicon carbide semiconductor substrate includes a first main surface and a second main surface opposite to the first main surface. The first main surface has...
US-9,966,248 Semiconductor manufacturing apparatus and semiconductor manufacturing method
In one embodiment, a semiconductor manufacturing apparatus includes a wafer setting module on which a wafer is to be set. The apparatus further includes a cover...
US-9,966,247 Control system and control method for component mounting machine
A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component...
US-9,966,246 Double-filament incandescent lamp for automotive vehicle front lighting
A lamp for automotive vehicle front lighting is described. The lamp 10 comprises a base 12 for mechanical and electrical connection to an automotive headlight...
US-9,966,245 Cooling apparatus, illumination optical system, exposure apparatus, and method of manufacturing article
A cooling apparatus for cooling a light source unit is provided. The cooling apparatus includes a cooling unit provided outside a path of light from the light...
US-9,966,244 Ion manipulation device
An ion manipulation method and device is disclosed. The device includes a pair of substantially parallel surfaces. An array of inner electrodes is contained...
US-9,966,243 Apparatus and methods for plasma-assisted reaction chemical ionization (PARCI) mass spectrometry
Plasma-assisted reaction chemical ionization (PARCI) provides highly sensitive elemental analysis by producing positively and negatively charged ions. The PARCI...
US-9,966,242 High throughput vacuum deposition sources and system
A high throughput deposition apparatus includes a first process chamber; one or more first deposition sources in the first process chamber; a first main carrier...
US-9,966,241 Sputtering apparatus
A sputtering apparatus includes a shutter arranged having a first surface on a side of a substrate holder and a second surface on the opposite side, a first...
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