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Patent # Description
US-9,968,020 Electronic-component mounting apparatus
Provided is a flip chip mounting apparatus for mounting chips (400) to a substrate (200), and the apparatus includes at least one sectionalized mounting stage...
US-9,968,019 Component feeding device, and component mounting device
A component feeding device transports a tape (a component feeding tape) in which electronic components are stored with some transportation device, and exposes...
US-9,968,018 Commissioning of a building service system
The invention relates to adjusting at least one of installed building service sensors (10) of a building service system. A sensor coverage area of at least one...
US-9,968,017 Electromagnetic shielding tube
An electromagnetic shielding tube has a resin inner layer as the innermost layer, a resin outer layer as the outermost layer, and a metal metal-layer between...
US-9,968,016 Magnetic field shield
A magnetic field shield having a plurality of tunable resonant loops arranged on a planar support medium. The resonant loops are loaded with a lumped component...
US-9,968,015 Cases having selectable RF shielding
Device cases with selectable RF shielding are described. Some implementations can include a case for an electronic device. The case can include selectable radio...
US-9,968,014 Shielding cover, shielding cover assembly and electronic device employing the same
A shielding cover includes a first frame, a second frame, a first cover and a second cover. The second frame is arranged adjacent to the first frame and defines...
US-9,968,013 Cooling arrangement for components disposed in an interior of a switch cabinet
The invention relates to a switch cabinet with a cooling apparatus which has a first closed coolant circuit and a second closed coolant circuit separated...
US-9,968,012 Heat-sink-attached power module substrate, heat-sink-attached power module, and method for producing...
A heat-sink-attached-power module substrate (1) has a configuration such that either one of a metal layer (13) and a heat sink (31) is composed of aluminum or...
US-9,968,011 Systems and methods for dynamically updated thermal options based on thermal state
In accordance with embodiments of the present disclosure, a system may include a temperature sensor configured to sense an inlet ambient temperature associated...
US-9,968,010 Information handling system having flexible chassis block radiators
A liquid handling (LH) block of an Information Handling System (IHS) having a first transfer conduit having node-receiving intake port/s sealably engaged for...
US-9,968,009 System with fresh air flow toward downstream components for cooling
The present technology provides a system for supplying fresh air to downstream components. The system comprises a housing with a first end and a second end, a...
US-9,968,008 Method of improving efficiency of fan in information technology hardware
An electronic rack includes a plurality of information technology (IT) components arranged in a stack, and a rack power supply having a voltage converter and a...
US-9,968,007 Rack assembly
A rack assembly includes a rack body and a jet generating device. The rack body is configured to hold a plurality of servers that are displaced from each other...
US-9,968,006 Locking louver assembly for air-moving assembly
Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver...
US-9,968,005 Different HDD gap architecture to reduce upstream preheat for high-density storage
Systems, methods and computer-readable media for reducing upstream preheat for high-density hard disk drive storage. A system can include first and second rows...
US-9,968,004 Thermal interface materials including electrically-conductive material
According to various aspects, exemplary embodiments are disclosed of thermal interface materials including electrically-conductive material, shields including...
US-9,968,003 Cooling device and electronic device
A cooling device 100 includes a first heat receiving unit 400, a second heat receiving unit 410, a first heat dissipating unit 700, and a second heat...
US-9,968,002 Heat-transfer mechanism of motor primary
The present invention provides a heat-transfer mechanism of a motor primary, wherein a heat-transfer member having a metallic body is sandwiched between a motor...
US-9,968,001 Heat dissipation assembly and communications device
Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat...
US-9,968,000 Arrangement for cooling channels in an electrode system
Provided is an arrangement for cooling channels in an electrode column assembly of an electric arc furnace, wherein the lower part of the electrode column...
US-9,967,999 Device for controlling heat dissipation fan and electronic equipment
Disclosed are a device for controlling a heat dissipation fan and an electric equipment, to solve the problem that the reliability of speed-regulation control...
US-9,967,998 Server rack architecture that facilitates reduced current density
A server rack with vertically stacked shelves is disclosed. The shelves are used for housing loads (e.g. servers) and power supply units. Thus, both the power...
US-9,967,997 Server equipment having fool-proof structure
Server equipment having a fool-proof structure includes a casing and a tray. The casing includes a storage unit area, a plurality of motherboard areas, a back...
US-9,967,996 Server chassis
A server chassis includes a tray, two inner rails and two outer rails. The tray includes a bottom plate. Two opposite side walls extend from an edge of the...
US-9,967,995 Single action din rail latch
An electronics module includes a latch with a first latch portion and a second latch portion. The latch portions move between a latched position and an...
US-9,967,994 Insulator for magnetic core around a bus bar
An insulating component having a first core accommodating section that receives a first magnetic body core, a second core accommodating section that receives a...
US-9,967,993 Printed circuit board enclosure assembly
An enclosure assembly for housing printed circuit boards and related electrical components that provides secured component mounting in outdoor environments.
US-9,967,992 PCB fixing mechanism and liquid crystal display device
The present invention provides a PCB Fixing Mechanism and Liquid Crystal Display Device. The PCB fixing mechanism utilizes annular conducting foam (30) and...
US-9,967,991 Semiconductor device and busbar
A semiconductor device, including a plurality of semiconductor modules, each including a semiconductor element, a main terminal and a wiring portion that...
US-9,967,990 Electronic apparatus
Provided is an electronic apparatus that has enhanced strength and reduced weight. An electronic apparatus includes: a housing having two faces that face each...
US-9,967,989 Display device
According to one embodiment, a display device includes a display, a circuit substrate, connector terminals, a first cover, a second cover, and a fastening...
US-9,967,988 Retention system for an electronic device
Disclosed is a retention system for an electronic device including a base member for receiving the electronic device, a retention pad attached to the base...
US-9,967,987 Electronic device enclosure and electronic device
The present invention discloses an electronic device enclosure and an electronic device. The electronic device enclosure includes: a housing enclosing an...
US-9,967,986 Semiconductor package and method therefor
In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment...
US-9,967,985 Display device and assembling method thereof
A display device includes a backplate and a supporting member. The backplate has a positioning hole formed thereon. The positioning hole includes a first area...
US-9,967,984 Power adapter packaging
A power adapter package comprises a power conversion module, an input board assembly comprising terminals for receiving power from an input source and...
US-9,967,983 Managed connectivity in electrical systems and methods thereof
An electrical connector arrangement includes a storage device coupled to a connector housing. The storage device is configured to store physical layer...
US-9,967,982 Method of producing an interposer with microspring contacts
An interposer including stress-engineered nonplanar microsprings may provide interconnection of bonding pads of electronic structures disposed above and below...
US-9,967,981 Light source unit
Provided is a light source unit including a base unit formed on a front surface thereof with a first circuit pattern by irradiating laser light to a resin...
US-9,967,980 Electronic component, mounted electronic component, and method for mounting electronic component
A multilayer ceramic capacitor includes a ceramic element body including first and second external electrodes on first and second end surface sides of the...
US-9,967,979 Light-emitting device
A light-emitting device includes a plurality of light-emitting elements mounted on a wiring board, and a plurality of wirings that are provided on the wiring...
US-9,967,978 Methods and apparatus for a rail-mounted array assembly
A rear-loaded electronics array, comprising a first circuit board assembly comprising a rail and at least one slat assembly. The at least one slat assembly can...
US-9,967,977 Step etched metal electrical contacts
A step etched metal electrical contact including a main body formed from a metal sheet defining a metal tab sized to match a die/device terminal and an...
US-9,967,976 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed...
A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive...
US-9,967,975 Multi-layer circuit board
A multi-layer circuit board includes a first circuit board, multiple conducting blocks, a second circuit board, and multiple conducting recesses. The first...
US-9,967,974 Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin...
US-9,967,973 Electrode arrangement with 3D structure and fabrication method thereof
An electrode arrangement which is based on elastomer and has elasticity and flexibility may include: an elastomer substrate; first and second pads arranged over...
US-9,967,972 Circuit board having an asymmetric layer structure
A circuit board is described which includes a layer composite with at least one dielectric layer which includes a planar extension in parallel with respect to...
US-9,967,971 Method of reducing warpage of an orgacnic substrate
A method for reducing warpage on an organic substrate. The method includes: preparing an organic substrate, which includes (i) a core layer having an organic...
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