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Patent # Description
US-9,978,754 Semiconductor arrangement with capacitor
A semiconductor arrangement includes a logic region and a memory region. The memory region has an active region that includes a semiconductor device. The memory...
US-9,978,752 Three-dimensional (3D) semiconductor memory devices
A three-dimensional (3D) semiconductor memory device may include a substrate including a cell array region and a connection region, an electrode structure...
US-9,978,748 Method of cutting fins to create diffusion breaks for finFETs
A method is provided for forming an integrated circuit with FinFETs. Initially, a fin is received with a dummy gate passing thereover. The dummy gate is removed...
US-9,978,742 Over-voltage protection circuit
A device is disclosed that includes a first transistor, a second transistor, and a first PODE device. The second transistor is electrically coupled to the first...
US-9,978,739 Semiconductor arrangement facilitating enhanced thermo-conduction
A semiconductor arrangement includes a well region and a first region disposed within the well region. The first region includes a first conductivity type. The...
US-9,978,737 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer...
A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The...
US-9,978,708 Wafer backside interconnect structure connected to TSVs
An integrated circuit structure includes a semiconductor substrate having a front surface and a back surface; a conductive via passing through the semiconductor...
US-9,978,704 Semiconductor devices with ball strength improvement
A semiconductor device includes a contact region over a substrate. The semiconductor device further includes a metal pad over the contact region. Additionally,...
US-9,978,701 Semiconductor device
A highly reliable semiconductor device capable of heavy current conduction and high temperature operation has a module structure in which a semiconductor chip...
US-9,978,696 Single lead-frame stacked die galvanic isolator
Isolators for providing electrical isolation between two circuits operating at different voltages are described, in which multiple semiconductor dies including...
US-9,978,688 Semiconductor package having a waveguide antenna and manufacturing method thereof
A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The...
US-9,978,686 Interconnection of semiconductor devices in extreme environment microelectronic integrated circuit chips
A process of fabrication and the resulting integrated circuit device is made of patterned metal electrical interconnections between semiconductor devices...
US-9,978,674 Chip-on-film semiconductor packages and display apparatus including the same
Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF...
US-9,978,672 Transistor package with terminals coupled via chip carrier
A package comprising an at least partially electrically conductive chip carrier, a first transistor chip comprising a first connection terminal, a second...
US-9,978,670 Semiconductor module and semiconductor driving device
A semiconductor module forming a semiconductor device includes lead frames in which switching elements are mounted on the side of upper surfaces and heat...
US-9,978,669 Packaged semiconductor device having a lead frame and inner and outer leads and method for forming
A method of making a packaged integrated circuit device includes forming a lead frame with leads that have an inner portion and an outer portion, the inner...
US-9,978,667 Semiconductor package with lead frame and recessed solder terminals
A semiconductor device (100) comprising a leadframe (120) having an assembly pad (121) in a first horizontal plane (180), the pad's first surface (121a) with a...
US-9,978,651 Silicon carbide single crystal substrate, silicon carbide semiconductor device, and method for manufacturing...
A silicon carbide single crystal substrate includes a first main surface and a second main surface opposite to the first main surface. The first main surface...
US-9,978,649 Solid source doping for source and drain extension doping
A method is provided for solid source doping for source and drain extensions. According to one embodiment, the method includes providing a substrate containing...
US-9,978,641 Semiconductor structure and fabrication method thereof
A method for forming a semiconductor structure includes providing a semiconductor substrate; forming a plurality of fins on the semiconductor substrate; forming...
US-9,978,640 Method of fabricating a semiconductor device with reduced leak paths
A method of manufacturing a semiconductor device includes fabricating a transistor, surrounding a gate of the transistor with a spacer, and applying an...
US-9,978,627 System and method for selective zapping
A system for zapping a wafer, the system includes a pulse generator; a sensor; a first conductive interface; a second conductive interface; a controller;...
US-9,978,616 Pressing apparatus, substrate bonding apparatus and stacked substrate
Moving the substrates quickly, as well as applying a large pressure to the substrates are required. A pressing apparatus for pressing a plurality of substrates...
US-9,978,615 Microelectronics package with inductive element and magnetically enhanced mold compound component
The present disclosure relates to a microelectronics package with an inductive element and a magnetically enhanced mold compound component, and a process for...
US-9,978,613 Method for making lead frames for integrated circuit packages
Disclosed examples include a method of making a semiconductor die package comprising arranging at least one preformed die attach pad and at least two preformed...
US-9,978,611 Stack frame for electrical connections and the method to fabricate thereof
A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts...
US-9,978,610 Pulsing RF power in etch process to enhance tungsten gapfill performance
Methods and apparatuses for filling features with metal materials such as tungsten-containing materials in a substantially void-free manner are provided. In...
US-9,978,607 Through via structure and method
A device comprises a via in a substrate comprising a lower via portion with a first width formed of a first conductive material and an upper via portion with a...
US-9,978,604 Salicide formation using a cap layer
A method of forming a semiconductor device includes forming a gate stack over a first portion of a source and a first portion of a drain. The method includes...
US-9,978,602 Method of making a transistor
The invention relates to a method for manufacturing a transistor comprising the preparation of a stack of layers of the semiconductor on insulator type...
US-9,978,597 Method for treating the surface of a silicon-carbide substrate including a removal step in which a modified...
This method for treating a surface of a SiC substrate includes a first removal step in which a modified layer produced by subjecting the substrate (70) to...
US-9,978,596 Self-aligned multiple spacer patterning schemes for advanced nanometer technology
The present disclosure provides forming nanostructures with precision dimension control and minimum lithographic related errors for features with dimension...
US-9,978,595 Photo mask and exposure system
The present invention belongs to the field of semiconductor technology, and specifically provides a photo mask and an exposure system. The photo mask is...
US-9,978,594 Formation method of semiconductor device structure using patterning stacks
Formation methods of a semiconductor device structure are provided. The method includes forming an under layer over a substrate, forming a middle layer over the...
US-9,978,593 Plasma processing device, plasma processing method and manufacturing method of electronic device
A plasma processing device, a plasma processing method and a manufacturing method of an electronic device with excellent uniformity, are capable of performing...
US-9,978,588 Nitride spacer for protecting a fin-shaped field effect transistor (FinFET) device
Approaches for protecting a semiconductor device (e.g., a fin field effect transistor device (FinFET)) using a nitride spacer are provided. Specifically, a...
US-9,978,587 Method of manufacturing semiconductor device including forming a film containing a first element, a second...
A technique includes forming a film containing a first element, a second element and carbon on a substrate by performing a cycle a predetermined number of...
US-9,978,586 Method of material deposition
A method and apparatus for material deposition onto a sample to form a protective layer composed of at least two materials that have been formulated and...
US-9,978,585 Organoaminodisilane precursors and methods for depositing films comprising same
Described herein are precursors and methods for forming silicon-containing films. In one aspect, there is a precursor of following Formula I: ##STR00001## ...
US-9,978,584 Apparatus and method for treating substrate
A method for treating a substrate, in which a supercritical fluid is supplied into a chamber, in which the substrate is carried, to treat the substrate, the...
US-9,978,583 Opening fill process and structures formed thereby
Methods of forming conductive structures and the conductive structures are disclosed. A method includes forming an opening in a dielectric layer over a...
US-9,978,582 Methods for improving wafer planarity and bonded wafer assemblies made from the methods
A method to improve the planarity of a semiconductor wafer and an assembly made from the method. In a preferred embodiment of the method, a compressive PECVD...
US-9,978,581 Lighting device and lighting device manufacturing method
A lighting device 1 has phosphors, a porous material (5), and emitters 4. The emitters are interposed between the phosphors and surfaces (2a) to be irradiated...
US-9,978,580 Lamps and light sources including RFID tags, and methods of assembling and operating the same
A lamp is provided. The lamp includes a transparent envelope for emitting light, and an RFID tag coupled to a portion of the transparent envelope.
US-9,978,579 Analyser arrangement for particle spectrometer
The present invention relates to a method for determining at least one parameter related to charged particles emitted from a particle emitting sample, e.g. a...
US-9,978,578 Segmented linear ion trap for enhanced ion activation and storage
A linear ion trap includes at least two discrete trapping regions for processing ions, a RF electrical potential generator, a multi-output DC electrical...
US-9,978,577 Orthogonal acceleration coaxial cylinder time of flight mass analyser
A Time of Flight mass analyzer is disclosed comprising an annular ion guide having a longitudinal axis and comprising a first annular ion guide section and a...
US-9,978,576 Time-of-flight analysis of a continuous beam of ions by a detector array
Systems and methods are provided for time-of-flight analysis of a continuous beam of ions by a detector array. A sample is ionized using an ion source to...
US-9,978,575 Grouping amplitudes of TOF extractions to detect convolution due to resolution saturation
Sample molecules are ionized producing a beam of ions using an ion source. A plurality of ion extractions are performed on the beam of ions using a TOF mass...
US-9,978,574 Sample collection in compact mass spectrometry systems
Mass spectrometry systems include a core featuring an ion source, an ion trap, and an ion detector connected along a gas path, a pressure regulation subsystem...
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