Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-9,991,230 Integrated circuits and methods for fabricating integrated circuits and electrical interconnects for III-V...
Integrated circuits, methods for fabricating integrated circuits, and methods for fabricating electrical interconnects for III-V devices are provided. In an...
US-9,991,229 Semiconductor device
A semiconductor device including a package substrate having, at the periphery of the main surface thereof, bonding leads disposed in a row, a semiconductor chip...
US-9,991,228 Semiconductor device with electromagnetic shield
A semiconductor device includes an electronic component and a wiring structural body located below the electronic component. The wiring structural body includes...
US-9,991,227 Bonding pad arrangement design for multi-die semiconductor package structure
A semiconductor package structure includes a base. A first die is mounted on the base. The first die includes a plurality of first pads arranged in a first...
US-9,991,226 Semiconductor packages having asymmetric chip stack structure
A semiconductor package may include first chip stack including first chips which are stacked on a package substrate and offset to form a first reverse stepwise...
US-9,991,225 High voltage device with multi-electrode control
A high-voltage transistor (HVT) structure adapts a low-voltage transistor (LVT) to high-voltage environments. The HVT structure includes a drain node, a source...
US-9,991,224 Bump-on-trace interconnect having varying widths and methods of forming same
Disclosed herein is a bump-on-trace interconnect with a wetted trace sidewall and a method for fabricating the same. A first substrate having conductive bump...
US-9,991,223 Semiconductor package alignment frame for local reflow
Embodiments of the present disclosure describe package alignment frames for a local reflow process to attach a semiconductor package to an interposer. The frame...
US-9,991,222 Package substrate and manufacturing method thereof and package
A package substrate including a carrier, a first patterned conductive layer, a second patterned conductive layer and a 3D-printing conductive wire is provided....
US-9,991,221 Semiconductor integrated circuit device
A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a...
US-9,991,220 Semiconductor device
The semiconductor device includes an insulating substrate including an insulating plate and a circuit plate; a semiconductor chip having a front surface formed...
US-9,991,219 Fan-out semiconductor package module
A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor...
US-9,991,218 Connector structures of integrated circuits
A die includes a substrate, a metal pad over the substrate, and a passivation layer covering edge portions of the metal pad. A metal pillar is formed over the...
US-9,991,217 Semiconductor device
A semiconductor device that includes a bipolar transistor, wherein a third opening, through which a pillar bump and a second wiring line, which is electrically...
US-9,991,216 Antenna cavity structure for integrated patch antenna in integrated fan-out packaging
A method for forming an integrated fan-out package includes depositing an adhesive layer on a carrier, forming a back-side buffer layer over the adhesive layer,...
US-9,991,215 Semiconductor structure with through substrate via and manufacturing method thereof
A semiconductor structure includes a substrate including a first side and a second side opposite to the first side; a first via extending through the substrate;...
US-9,991,214 Activating reactions in integrated circuits through electrical discharge
Embodiments of the present invention provide integrated circuits and methods for activating reactions in integrated circuits. In one embodiment, an integrated...
US-9,991,213 Resin-encapsulated semiconductor device and its manufacturing method
A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device (100)...
US-9,991,212 Semiconductor device
A semiconductor device includes; a semiconductor substrate including a major surface; a first diffusion region in the major surface in a main cell region; a...
US-9,991,211 Semiconductor package having an EMI shielding layer
Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing...
US-9,991,210 Electromagnetic shield and associated methods
Semiconductor devices are described, along with methods and systems that include them. One such device includes a diffusion region in a semiconductor material,...
US-9,991,209 Guard structure for signal isolation
A method of fabricating an electrical guard structure for providing signal isolation is provided. The method includes providing a substrate having a mounting...
US-9,991,208 Susceptor for holding a semiconductor wafer having an orientation notch, a method for depositing a layer on a...
A semiconductor wafer processing susceptor for holding a wafer having an orientation notch during deposition of a layer on the wafer, having a placement surface...
US-9,991,207 Test key strcutures, integrated circuit packages and methods of forming the same
Test key structures, integrated circuit packages and methods of forming the same are disclosed. One of the test key structures includes a first pattern over a...
US-9,991,206 Package method including forming electrical paths through a mold layer
A package method includes disposing a chip and a plurality of solder bumps on a substrate by disposing a plurality of chip interfaces and the plurality of...
US-9,991,205 Semiconductor device and method
A representative method for manufacturing a semiconductor device (e.g., a fin field-effect transistor) includes the steps of depositing a first insulating...
US-9,991,204 Through via structure for step coverage improvement
A semiconductor device includes a substrate, a dielectric structure, a barrier layer, a glue layer, a copper seed layer and a copper layer. The dielectric...
US-9,991,203 Semiconductor device and method of fabricating the same
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes an interlayer insulating film, a first trench having...
US-9,991,202 Method to reduce resistance for a copper (CU) interconnect landing on multilayered metal contacts, and...
A method of forming a semiconductor structure includes forming a first insulating layer containing a first metal layer embedded therein and on a surface of a...
US-9,991,201 Electrical antifuse including phase change material of tantalum
An antifuse structure including a first electrode that is present in at a base of the opening in the dielectric material. The antifuse structure further...
US-9,991,200 Air gap structure and method
A device comprises a first protection layer over sidewalls and a bottom of a first trench in a first dielectric layer, a first barrier layer over the first...
US-9,991,199 Integrated shielding and decoupling capacitor structure
A shielding and decoupling capacitor structure can be fabricated within an integrated circuit (IC) by forming recesses in a top surface of a dielectric layer...
US-9,991,198 Layout method for compound semiconductor integrated circuits
A layout method for compound semiconductor integrated circuits, comprising following steps of: forming a first metal layer within a first circuit layout area...
US-9,991,197 Fabrication method of semiconductor package
A semiconductor package is provided, which includes: a dielectric layer made of a material used for fabricating built-up layer structures; a conductive trace...
US-9,991,196 Printed circuit board and method of fabricating an element
The present invention provides a printed circuit board fabricated by a Non-Plating Process that includes at least one plating bar disposed around at least one...
US-9,991,195 Semiconductor device
The semiconductor device includes a wiring substrate having a plurality of ball lands formed on a lower surface of a core layer, a solder resist film covering...
US-9,991,194 Sensor package and method of manufacture
A method of manufacture and a substrate for sensor packages is provided. The method involves premolding a lead frame with strips having V-grooves; cutting the...
US-9,991,193 Semiconductor device package
A semiconductor device package includes a first conductive base, a first semiconductor die, a dielectric layer, a first patterned conductive layer, and a second...
US-9,991,192 Semiconductor package
Provided is a semiconductor package. The semiconductor package includes: a first die that is a monolithic type die, a driver circuit and a low-side output power...
US-9,991,191 Electronic power device with flat electronic interconnection structure
Electronic power device comprising: an active layer comprising several lateral and/or semi-lateral components for which the electrodes are located on a front...
US-9,991,190 Packaging with interposer frame
The mechanisms of using an interposer frame to package a semiconductor die enables fan-out structures and reduces form factor for the packaged semiconductor...
US-9,991,189 Semiconductor device having a dual material redistribution line
A semiconductor device includes a first passivation layer over an interconnect structure. The semiconductor device further includes a first redistribution line...
US-9,991,188 Electronic component cooler
A cooler with a cooler main body that, in one configuration, includes a first wall portion forming a cooling surface that cools an electronic component, a...
US-9,991,187 Electronic device and method for manufacturing the same, and substrate structure and method for manufacturing...
A semiconductor device includes: a silicon substrate that includes a heat release mechanism formed on a rear surface thereof; and an element layer that includes...
US-9,991,186 Method of manufacture for a semiconductor device
A method of manufacture for a semiconductor device is disclosed. The method includes providing a semiconductor stack structure that includes a device terminal...
US-9,991,185 Direct bonded copper semiconductor packages and related methods
A power semiconductor package includes a first direct bonded copper (DBC) substrate having a plurality of connection traces on a first face of the first DBC...
US-9,991,184 Electronic module and method of manufacturing the same
An electronic module 1 includes an electronic module 10 that includes a substrate 11 and an electronic element 12, an electronic module 20 that includes a...
US-9,991,183 Semiconductor component having inner and outer semiconductor component housings
A semiconductor component includes an inner semiconductor component housing and an outer semiconductor component housing. The inner semiconductor component...
US-9,991,182 Encapsulation material for light emitting diodes
The invention relates to the use of specific organopolysilazanes as an encapsulation material for light emitting diodes (LED). The organopolysilazane polymers...
US-9,991,181 Air-cavity package with enhanced package integration level and thermal performance
The present disclosure relates to an air-cavity package, which includes a bottom substrate, a top substrate, a perimeter wall, a bottom electronic component, a...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.