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Patent # Description
US-1,000,8485 Semiconductor device and method of manufacture
A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package...
US-1,000,8484 Solid state light fixtures suitable for high temperature operation having separate blue-shifted-yellow/green...
Solid state light fixtures include a plurality of blue-shifted-yellow/green light emitting diode ("LED") packages and a plurality of blue-shifted-red LED...
US-1,000,8483 Micro-transfer printed LED and color filter structure
A micro-transfer printed intermediate structure comprises an intermediate substrate and one or more pixel structures disposed on the intermediate substrate....
US-1,000,8482 Methods of making light-emitting assemblies comprising an array of light-emitting diodes having an optimized...
Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a...
US-1,000,8481 Method of manufacturing illumination device, illumination device, illumination device manufacturing system,...
In a method of manufacturing an illumination device, a color tone of each of a plurality of light emitting devices having different color tones is detected. In...
US-1,000,8480 Package-on-package structure with through molding via
Disclosed herein is a device comprising a first package having a first side with a plurality of connectors disposed thereon and a second package mounted on the...
US-1,000,8479 Semiconductor device with discrete blocks
A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having...
US-1,000,8478 Fabricating method for wafer-level packaging
The present disclosure discloses a fabrication method for wafer-level packaging, comprising: forming a first photoresist on a first chip and a plurality of...
US-1,000,8477 Microelectronic element with bond elements to encapsulation surface
A microelectronic structure includes a semiconductor having conductive elements at a first surface. Wire bonds have bases joined to the conductive elements and...
US-1,000,8476 Stacked semiconductor package including a smaller-area semiconductor chip
A semiconductor package comprising: a base substrate; a first semiconductor chip unit attached to the base substrate and including at least one first...
US-1,000,8475 Stacked-die including a die in a package substrate
Some embodiments described herein include apparatuses and methods of forming such apparatuses. In one such embodiment, an apparatus may include a substrate, a...
US-1,000,8474 Dense assembly of laterally soldered, overmolded chip packages
Embodiments of the invention are directed to an integrated circuit (IC) package assembly, including: one or more printed circuit boards (PCBs); and a set of...
US-1,000,8472 Method for making semiconductor device with sidewall recess and related devices
A method is for making a semiconductor device. The method may include providing a lead frame having a recess, forming a sacrificial material in the recess of...
US-1,000,8471 Bonding material and bonding method using the same
A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and...
US-1,000,8470 Embedded chip packages and methods for manufacturing an embedded chip package
A method for manufacturing an embedded chip package is provided. The method may include: forming electrically conductive lines over a substrate; placing the...
US-1,000,8469 Wafer-level packaging using wire bond wires in place of a redistribution layer
An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the...
US-1,000,8468 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged...
US-1,000,8467 Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a semiconductor substrate, a pad, a circuit board, a first bump, and a second bump. The pad is disposed on a top surface of...
US-1,000,8466 Semiconductor device and manufacturing method thereof
A flip-chip mounting technique with high reliability is provided in flip-chip mounting using a Cu pillar. In a semiconductor device to be coupled to a mounting...
US-1,000,8465 Methods for surface attachment of flipped active components
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component...
US-1,000,8464 Smart BGA chip maintenance device
The present invention relates to a smart BGA chip maintenance device comprising a base, a moving worktable, a horizontal slide, a vertical slide, a grinding...
US-1,000,8463 Wafer-level packaging mechanisms
A semiconductor package includes a first semiconductor die surrounded by a molding compound. The semiconductor package further includes a first conductive pad...
US-1,000,8462 Semiconductor package
A semiconductor package includes a semiconductor substrate and an electrode pad formed on the semiconductor substrate. The electrode pad includes a central...
US-1,000,8461 Semiconductor structure having a patterned surface structure and semiconductor chips including such structures
A connector structure and a manufacturing method thereof are provided. The connector structure includes a semiconductor substrate, a metal layer, a passivation...
US-1,000,8460 Semiconductor package and method of forming the same
According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes: a chip having a plurality of joint pads; a...
US-1,000,8459 Structures having a tapering curved profile and methods of making same
An embodiment ladder bump structure includes an under bump metallurgy (UBM) feature supported by a substrate, a copper pillar mounted on the UBM feature, the...
US-1,000,8458 Semiconductor device capable of realizing impedance control and method of manufacturing the same
The present technology relates to a semiconductor device and a method of manufacturing the semiconductor device capable of realizing impedance control of the...
US-1,000,8457 Resonance-coupled signaling between IC modules
Coupled resonators for galvanically isolated signaling between integrated circuit modules. An illustrative multi-module integrated circuit comprises: a...
US-1,000,8456 Laminated spacers for field-effect transistors
Structures for spacers in a device structure for a field-effect transistor and methods for forming spacers in a device structure for a field-effect transistor....
US-1,000,8455 Radio frequency isolation using substrate opening
Radio-frequency (RF) devices are fabricated by providing a field-effect transistor (FET) formed over a an oxide layer formed on a substrate layer and removing...
US-1,000,8454 Wafer level package with EMI shielding
A semiconductor device includes a semiconductor die having a top side and a bottom, active side. During assembly of the semiconductor device, a metal film is...
US-1,000,8452 Microelectronic structures having laminated or embedded glass routing structures for high density packaging
Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing...
US-1,000,8451 Bridge interconnect with air gap in package assembly
Embodiments of the present disclosure are directed towards techniques and configurations for a bridge interconnect assembly that can be embedded in a package...
US-1,000,8450 Oxidation resistant barrier metal process for semiconductor devices
An integrated circuit and method comprising an underlying metal geometry, a dielectric layer on the underlying metal geometry, a contact opening through the...
US-1,000,8449 Self-forming barrier for subtractive copper
A method of forming electrically conductive structures that includes forming a copper containing layer including a barrier forming element, and applying a first...
US-1,000,8448 Dielectric/metal barrier integration to prevent copper diffusion
An interconnect structure for use in semiconductor devices and a method for fabricating the same is described. The method includes positioning a substrate in a...
US-1,000,8447 Solar cell powered integrated circuit device and method therefor
A semiconductor device includes a circuitry die and a solar cell die. The circuitry die includes a plurality of interconnect layers on a front side of the...
US-1,000,8446 Advanced E-fuse structure with enhanced electromigration fuse element
A structure for an e-Fuse device in a semiconductor device is described. The e-Fuse device includes an anode region, a cathode region and a fuse element which...
US-1,000,8445 Embedded fuse with conductor backfill
Embedded fuse structures and fabrication techniques. An embedded fuse may include a non-planar conductive line having two high-z portions extending to a greater...
US-1,000,8444 Driving chip package and display device including the same
A display device includes a display panel and a chip-on-film (COF) bonded to the display panel. The chip-on-film includes a film on which a driving chip is...
US-1,000,8443 Implant device
The invention provides chip packaging and processes for the assembly of retinal prosthesis devices. Advantageously, photo-patternable adhesive or epoxy such as...
US-1,000,8442 Through-electrode substrate, method for manufacturing same, and semiconductor device in which through-electrode...
A through-electrode substrate includes a base including a first surface and a second surface mutually opposing each other, and a through-electrode arranged in a...
US-1,000,8441 Semiconductor package
A semiconductor package includes a circuit board, a semiconductor chip, a heat spreading layer, an encapsulant layer, a plurality of conductive connections, and...
US-1,000,8440 Carrier for an electrical component
A carrier for an electrical component, including a substrate having a surface, with an electrically conductive contact zone arranged on the surface of the...
US-1,000,8439 Thin recon interposer package without TSV for fine input/output pitch fan-out
Semiconductor devices and manufacturing methods are provided for using a Recon interposer that provides a high density interface between the active...
US-1,000,8438 Low profile leaded semiconductor package and method of fabricating the same
In a semiconductor package a lead having a bottom surface coplanar with the flat bottom surface of the plastic body extends outward at the bottom of the...
US-1,000,8437 Lead frame and electronic component device
An electronic component device, includes: a lead frame including a terminal portion, the terminal portion including a columnar electrode and a metal plating...
US-1,000,8436 Semiconductor device
A semiconductor device includes: a semiconductor substrate; a wiring layer provided on a front-surface side of the semiconductor substrate; a through-via that...
US-1,000,8435 Semiconductor device and method of manufacturing semiconductor device
A semiconductor device including a semiconductor chip and a heat dissipation unit (heat sink) is configured as follows. The heat dissipation unit (heat sink)...
US-1,000,8433 Semiconductor device
A semiconductor device includes a semiconductor chip formed using a silicon carbide and having electrodes on a first surface and a second surface opposite to...
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