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Patent # Description
US-1,000,8556 Organic light-emitting display device
An organic light-emitting display device includes a substrate including a display area and a peripheral area surrounding the display area. The display area...
US-1,000,8555 Display device and method of manufacturing the same
Disclosed are an organic light emitting display device and a method of manufacturing the same, which reduce a loss of light emitted from an organic light...
US-1,000,8554 Display apparatus
A display apparatus includes a display apparatus includes a display panel including a curved display area, and an optical unit including a liquid crystal layer...
US-1,000,8535 Image sensor having first fixed charge film for anti-reflection and second fixed charge film for moisture...
An image sensor includes a substrate including a plurality of photoelectric conversion parts and a pixel isolation trench extending from a surface of the...
US-1,000,8533 Semiconductor package
A semiconductor package device includes a first semiconductor package including a first package substrate and a semiconductor chip stacked on the first package...
US-1,000,8529 Solid-state imaging device, method of manufacturing the same, and electronic apparatus
The present disclosure relates to a solid-state imaging device that enables diffusion of components in the interfaces between microlenses and an antireflection...
US-1,000,8528 Solid-state image sensor, method of manufacturing the same, and camera
A solid-state image sensor includes a substrate including a photoelectric conversion portion, an insulating layer having an opening, and a member arranged...
US-1,000,8521 Solid-state imaging device
A backside illumination-type solid-state imaging device is provided in which an amount of accumulated charge of a photodiode is increased and a read out path of...
US-1,000,8517 Display device having reduced parasitic capacitance and cross-talk and method of manufacturing the same
A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a plurality of pixels, wherein each pixel...
US-1,000,8515 Semiconductor device
An object is to provide a semiconductor device using an oxide semiconductor having stable electric characteristics and high reliability. A transistor including...
US-1,000,8513 Semiconductor device
A semiconductor device includes a first and a second conductive films over an insulating surface; a first insulating film over the insulating surface and the...
US-1,000,8506 Semiconductor arrangement with capacitor
A semiconductor arrangement includes a logic region and a memory region. The memory region has an active region that includes a semiconductor device. The memory...
US-1,000,8500 Semiconductor devices
The present disclosure relates to semiconductor structures and, more particularly, to segmented or cut finFET structures and methods of manufacture. The...
US-1,000,8487 Optoelectroic semiconductor chip and method of producing an optoelectronic semiconductor chip
An optoelectronic semiconductor chip includes a semiconductor layer sequence with an upper face and a lower face opposite the upper face, wherein the...
US-1,000,8485 Semiconductor device and method of manufacture
A semiconductor device and method for providing an enhanced removal of heat from a semiconductor die within an integrated fan out package on package...
US-1,000,8477 Microelectronic element with bond elements to encapsulation surface
A microelectronic structure includes a semiconductor having conductive elements at a first surface. Wire bonds have bases joined to the conductive elements and...
US-1,000,8471 Bonding material and bonding method using the same
A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and...
US-1,000,8467 Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a semiconductor substrate, a pad, a circuit board, a first bump, and a second bump. The pad is disposed on a top surface of...
US-1,000,8465 Methods for surface attachment of flipped active components
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component...
US-1,000,8461 Semiconductor structure having a patterned surface structure and semiconductor chips including such structures
A connector structure and a manufacturing method thereof are provided. The connector structure includes a semiconductor substrate, a metal layer, a passivation...
US-1,000,8460 Semiconductor package and method of forming the same
According to an exemplary embodiment, a semiconductor package is provided. The semiconductor package includes: a chip having a plurality of joint pads; a...
US-1,000,8449 Self-forming barrier for subtractive copper
A method of forming electrically conductive structures that includes forming a copper containing layer including a barrier forming element, and applying a first...
US-1,000,8445 Embedded fuse with conductor backfill
Embedded fuse structures and fabrication techniques. An embedded fuse may include a non-planar conductive line having two high-z portions extending to a greater...
US-1,000,8430 Semiconductor device, manufacturing apparatus for semiconductor device and manufacturing method for...
A semiconductor device includes: a semiconductor element; a frame which has a first surface, holds the semiconductor element on the first surface, and is...
US-1,000,8417 Vertical transport fin field effect transistors having different channel lengths
A method of forming multiple vertical transport fin field effect transistors (VT FinFETs) having different channel lengths, including, forming a vertical fin on...
US-1,000,8416 Forming a protective layer to prevent formation of leakage paths
A gate structure is formed over a substrate. The gate structure includes a gate electrode and a hard mask located over the gate electrode. The hard mask...
US-1,000,8411 Parallel plate waveguide for power circuits
A power semiconductor package includes a first group of semiconductor dies attached to a first side of a substrate and evenly distributed over a width of the...
US-1,000,8404 Electrostatic chuck assembly for high temperature processes
An electrostatic chuck assembly includes a puck and a cooling plate. The puck includes an electrically insulative upper puck plate comprising one or more...
US-1,000,8402 Vertical wafer boat
A vertical wafer boat includes a top plate, a bottom plate, three support posts, and wafer support parts. The support posts include a first and a second support...
US-1,000,8394 Method for mounting an electrical component, wherein a hood is used, and hood suitable for use in said method
A method for mounting an electrical component to a substrate may include mounting the component onto the substrate, forming a cover including a thermally...
US-1,000,8392 Method for producing a power semiconductor module
A power semiconductor module is produced by: providing an electrically conductive terminal block having a screw thread, a connecting conductor having first and...
US-1,000,8385 Enlarged sacrificial gate caps for forming self-aligned contacts
Methods of forming a sacrificial gate cap and a self-aligned contact for a device structure. A gate electrode is arranged between a first sidewall spacer and a...
US-1,000,8383 Semiconductor structure and manufacturing method thereof
The present disclosure provides a semiconductor structure includes a substrate and an epitaxy region that is partially disposed in the substrate. A doping...
US-1,000,8377 Ion transfer tube flow and pumping system load
A mass spectrometer system can include an ion source, a vacuum chamber; a mass analyzer within the vacuum chamber, a transfer tube between the ion source and...
US-1,000,8373 Impedance spectrometer with temperature-controlled micro-platform
An impedance spectrometer comprised of a thermal micro-platform supported with phononic structured nanowires disposed within a micromachined structure is...
US-1,000,8371 Determining a value of a variable on an RF transmission model
Systems and methods for determining a value of a variable on a radio frequency (RF) transmission model are described. One of the methods includes identifying a...
US-1,000,8369 Cyclical plasma etching
There is provided an apparatus for cyclical plasma etching of a substrate, the apparatus comprising: a process chamber; a support within the process chamber for...
US-1,000,8366 Seasoning process for establishing a stable process and extending chamber uptime for semiconductor chip processing
Embodiments of the present disclosure generally provide improved methods for processing substrates with improved process stability, increased mean wafers...
US-1,000,8360 Objective lens system for fast scanning large FOV
The device includes a beam source for generating an electron beam, a beam guiding tube passed through an objective lens, an objective lens for generating a...
US-1,000,8359 X-ray tube having magnetic quadrupoles for focusing and magnetic dipoles for steering
An X-ray tube can include: a cathode including an electron emitter; an anode configured to receive the emitted electrons; a first magnetic quadrupole between...
US-1,000,8351 Control system for a wireless power switch without a neutral wire
A control system for a wireless power switch without a NEUTRAL wire comprises a wireless controlled power switch with both terminals connected between a LINE...
US-1,000,8347 Electrical switch with built in fuse improvement
Electrical switches with pivotable toggle portions having replaceable fuses mounted in the toggle portions, and a removable cover/boot protecting the fuse. The...
US-1,000,8343 Safety interlock door switch override tool
An apparatus and method for a safety interlock door switch tool are disclosed. An example embodiment includes: support posts having a top end and a bottom end;...
US-1,000,8340 Composite electronic component, board having the same, and power smoother including the same
A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite...
US-1,000,8337 Activated carbon for an electric double-layer capacitor electrode and manufacturing method for same
There are disclosed activated carbon for use in an electric double-layer capacitor electrode, the carbon being capable of improving rate characteristics and...
US-1,000,8336 Dye-sensitized solar cell element
A dye-sensitized solar cell (DSC) element includes at least one DSC. The DSC includes a first base material having a transparent substrate, a second base...
US-1,000,8332 Multilayer ceramic capacitor
In an embodiment, a capacitor body 11 of a multilayer ceramic capacitor 10 has, at a position adjoining a lower height-direction surface f6, a tapered part 11a...
US-1,000,8329 Multilayer capacitor having first internal electrodes and second internal electrodes alternately disposed
A length in a third direction of a first connection portion is smaller than a length in the third direction of a first main electrode portion. A length in the...
US-1,000,8326 Multilayer ceramic electronic component having an inorganic matter at an interface between an external...
A multilayer ceramic electronic component in which an interface of an edge region of an external electrode that extends around to a side surface of a ceramic...
US-1,000,8281 One time programmable read-only memory (ROM) in SOI CMOS
A method of operating a programmable read-only-memory (ROM) cell unit having a series coupled CMOS NFET and CMOS PFET device formed on a semiconductor layer...
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