Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-1,001,4253 Method of manufacturing semiconductor integrated circuit device
A semiconductor integrated circuit device capable of stably forming a fuse element that is used to adjust the characteristics of the semiconductor integrated...
US-1,001,4252 Integrated circuit with multi-level arrangement of e-fuse protected decoupling capacitors
An embodiment is a circuit. The circuit includes active circuitry, a first capacitor, a first fuse, a second capacitor, and a second fuse. The active circuitry...
US-1,001,4251 Semiconductor device with self-protecting fuse and method of fabricating the same
A semiconductor device with the metal fuse is provided. The metal fuse connects an electronic component (e.g., a transistor) and a existing dummy feature which...
US-1,001,4250 Semiconductor devices
A semiconductor device includes a substrate and at least one inductor on the substrate. The inductor includes top portions separated from one another, bottom...
US-1,001,4249 Circuit board and smart card module and smart card utilizing the same
A circuit board and a smart card module and a smart card employing the circuit board are provided. The circuit board includes a substrate and a pad region...
US-1,001,4248 Semiconductor device with less positional deviation between aperture and solder
Provided is a semiconductor device that includes a semiconductor chip, and a packaging substrate on which the semiconductor chip is mounted. The semiconductor...
US-1,001,4246 Circuit substrate, semiconductor package and process for fabricating the same
A circuit substrate has the following elements. A stacked circuit structure has a first surface and a second surface opposite thereto surface. A first patterned...
US-1,001,4245 Method for removing material from a substrate using in-situ thickness measurement
A method for removing material from a substrate includes providing the substrate with first and second opposing major surfaces. A masking layer is disposed...
US-1,001,4244 Through-hole electrode substrate
A method of manufacturing a through-hole electrode substrate includes forming a plurality of through-holes in a substrate, forming a plurality of through-hole...
US-1,001,4243 Interconnection substrates for interconnection between circuit modules, and methods of manufacture
An interposer (110) has contact pads at the top and/or bottom surfaces for connection to circuit modules (e.g. ICs 112). The interposer includes a substrate...
US-1,001,4242 Interposer substrate and method of fabricating the same
The invention provides an interposer substrate and a method of fabricating the same. The method includes: etching a carrier to form a recessed groove thereon;...
US-1,001,4241 Semiconductor device
A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is...
US-1,001,4240 Embedded component package and fabrication method
An array includes a substrate having a frontside surface and a backside surface. A backside cavity is formed in the backside surface. Backside through vias...
US-1,001,4239 Information processing device and cooling unit
An information processing device includes a substrate configured to include a mounting surface above which an electronic component is mounted; a flow passage...
US-1,001,4238 Method, system, and electronic assembly for thermal management
There are provided methods, systems, and electronic assemblies for efficient thermal management in electronics applications. For example, there is provided an...
US-1,001,4237 Circuit board having a heat dissipating sheet with varying metal grain size
A circuit board includes an insulating substrate; a metal circuit sheet joined to a first principal surface of the insulating substrate; and a heat dissipating...
US-1,001,4236 Semiconductor device
A semiconductor device includes an insulating substrate, semiconductor elements and a cooling device. The cooling device includes a heat radiation substrate,...
US-1,001,4235 Underfill material, laminated sheet and method for producing semiconductor device
An underfill material having sufficient curing reactivity, and capable of achieving a small change in viscosity and good electrical connection even when loaded...
US-1,001,4234 Semiconductor device comprising a die seal including long via lines
The patterning technique used for forming sophisticated metallization systems of semiconductor devices may be monitored and evaluated more efficiently by...
US-1,001,4233 Electronic component containing package and electronic device
An electronic component containing package includes a substrate including a placement region for placing an electronic component in an upper face thereof; a...
US-1,001,4232 Packaging shell and a power module having the same
The present invention provides a packaging shell and a power module having the same. The packaging shell mainly comprises an accommodating recess for receiving...
US-1,001,4231 Method and apparatus to model and monitor time dependent dielectric breakdown in multi-field plate gallium...
A first set of test structures for a gallium nitride (GaN) transistor that includes N field plates is disclosed, where N is an integer and X is an integer...
US-1,001,4230 Monitor structures and methods of formation thereof
A method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second...
US-1,001,4229 Generating a wafer inspection process using bit failures and virtual inspection
Methods and systems for generating a wafer inspection process are provided. One method includes storing output of detector(s) of an inspection system during...
US-1,001,4228 Method and apparatus to assist the processing of deformed substrates
A method and apparatus for detecting and handling deformed substrates, thus allowing them to be processed, and for increasing device yield on the substrate is...
US-1,001,4227 Semiconductor device having strained fin structure and method of making the same
A semiconductor device includes a semiconductor substrate, at least a first fin structure, at least a second fin structure, a first gate, a second gate, a first...
US-1,001,4226 Method of manufacturing semiconductor device
A process of forming a first mask on a first region of a metal film formed on a surface of a substrate, a process of modulating a work function of a first...
US-1,001,4225 Methods for fabricating metal gate structures
One aspect of the present disclosure is a method of fabricating metal gate by forming a silicon-nitride layer (SiN) over a dummy gate at a second metal gate...
US-1,001,4224 Structure and formation method of fin-like field effect transistor
A structure and a formation method of a semiconductor device are provided. The semiconductor device includes a semiconductor substrate and a fin structure over...
US-1,001,4223 Multi-gate devices with replaced-channels and methods for forming the same
A device includes a semiconductor substrate, isolation regions in the semiconductor substrate, and a Fin Field-Effect Transistor (FinFET). The FinFET includes a...
US-1,001,4222 Fabrication of a vertical fin field effect transistor with reduced dimensional variations
A method of forming a fin field effect transistor (finFET) having fin(s) with reduced dimensional variations, including forming a dummy fin trench within a...
US-1,001,4221 FinFET devices
FinFET devices and processes to prevent fin or gate collapse (e.g., flopover) in finFET devices are provided. The method includes forming a first set of...
US-1,001,4220 Self heating reduction for analog radio frequency (RF) device
A method of forming a semiconductor device includes forming a plurality of semiconductor fins from an upper semiconductor layer located on a first region of a...
US-1,001,4219 Semiconductor device
A semiconductor device includes a structure on a substrate and a plurality of gate-all-around devices on the structure. The structure includes a plurality of...
US-1,001,4218 Method for forming semiconductor device structure with bumps
A method for forming a semiconductor device structure is provided. The method includes providing a semiconductor structure. The semiconductor structure has a...
US-1,001,4217 Method of singulating semiconductor wafer having a plurality of die and a back layer disposed along a major surface
De are singulated from a wafer having a back layer by placing the wafer onto a first carrier substrate with the back layer adjacent the carrier substrate,...
US-1,001,4216 Method for manufacturing semiconductor device using high speed epitaxial lift-off and template for III-V direct...
Disclosed is a method for manufacturing a semiconductor device, which includes providing a template having a first substrate and a patterned first III-V group...
US-1,001,4215 Method and apparatus for placing a gate contact inside a semiconductor active region having high-k dielectric...
A method provides a structure having a FinFET in an Rx region, the FinFET including a channel, source/drain (S/D) regions and a gate, the gate including gate...
US-1,001,4214 Electronic device including moat power metallization in trench
An electronic device is provided. The electronic device includes a semiconductor layer, a dielectric layer disposed on the semiconductor layer, circuitry...
US-1,001,4213 Selective bottom-up metal feature filling for interconnects
A method for selective bottom-up filling of recessed features with a low resistivity metal for semiconductor devices is described in several embodiments. The...
US-1,001,4212 Selective deposition of metallic films
Metallic layers can be selectively deposited on one surface of a substrate relative to a second surface of the substrate. In some embodiments, the metallic...
US-1,001,4211 Methods of forming one or more covered voids in a semiconductor substrate
Some embodiments include methods of forming voids within semiconductor constructions. In some embodiments the voids may be utilized as microstructures for...
US-1,001,4210 SOI substrate and manufacturing method thereof
The present invention application provides a method for manufacturing a SOI substrate, and the method comprising: providing a first semiconductor substrate;...
US-1,001,4209 Methods, apparatus and system for local isolation formation for finFET devices
At least one method, apparatus and system are disclosed for forming a fin field effect transistor (finFET) while reducing oxidization and fin critical dimension...
US-1,001,4208 Semiconductor device having a device isolation layer
A semiconductor device includes a fin protruding from a substrate and extending in a first direction, first and second gate structures intersecting the fin, a...
US-1,001,4207 Method of manufacturing dielectric layers of semiconductor structure
A method of filling a dielectric trench includes forming two adjacent conductors on a substrate, forming a dielectric layer over a surface of the conductors and...
US-1,001,4206 Trench isolated IC with transistors having locos gate dielectric
An integrated circuit (IC) including at least one transistor having a metal-oxide-semiconductor (MOS) gate includes a substrate having a semiconductor surface....
US-1,001,4205 Substrate conveyance robot and operating method thereof
A substrate conveyance robot has an end effector provided to a robot arm and including a substrate holding unit configured to hold a substrate, arm drive unit...
US-1,001,4204 Method for realizing ultra-thin sensors and electronics with enhanced fragility
A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one...
US-1,001,4203 Pick and place device comprising pick arm correction module
A semiconductor die pick and place device comprising a handing mechanism comprising a pick arm movable between a placement location and a pick-up location. A...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.