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Patent # Description
US-1,002,0293 Transferring method, manufacturing method, device and electronic apparatus of micro-LED
The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring...
US-1,002,0292 Optoelectronic semiconductor component and flashlight
Optoelectronic semiconductor component includes at least four different light sources each including at least one optoelectronic semiconductor chip, which...
US-1,002,0291 LED light emitting device
An LED light emitting device with good color mixing property is provided. The LED light emitting device including a rectangular substrate having a short-side...
US-1,002,0290 Semiconductor device having stacked semiconductor chips interconnected via TSV
A semiconductor device includes at least first and second semiconductor chips stacked on each other along a first direction, at least one through-silicon-via...
US-1,002,0289 Layout of transmission vias for memory device
Apparatuses and methods for supplying power to a plurality of dies are described. An example apparatus includes: a substrate; first, second and third memory...
US-1,002,0288 Semiconductor chips including redistribution interconnections and related semiconductor packages
A semiconductor chip is provided including an integrated circuit on a substrate; pads electrically connected to the integrated circuit; a lower insulating...
US-1,002,0287 Pass-through interconnect structure for microelectronic dies and associated systems and methods
Pass-through interconnect structures for microelectronic dies and associated systems and methods are disclosed herein. In one embodiment, a microelectronic die...
US-1,002,0286 Package on package devices and methods of packaging semiconductor dies
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die...
US-1,002,0285 Method of producing a semiconductor device and a semiconductor device
A method of producing a semiconductor device is provided. The method includes: providing a semiconductor wafer, the wafer including an upper layer of a...
US-1,002,0284 Functional spacer for SIP and methods for forming the same
A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first...
US-1,002,0283 Direct metal bonding method
Method including the steps of a) Providing a first stack including a first substrate on which is deposited a first metal layer including a first metal, and a...
US-1,002,0282 Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat...
In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal...
US-1,002,0281 Metal bonding pads for packaging applications
Methods and semiconductor devices for bonding a first semiconductor device to a second semiconductor device include forming metal pads including a textured...
US-1,002,0280 Method of manufacturing a carrier tape
The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both...
US-1,002,0279 Semiconductor device including built-in crack-arresting film structure
A wafer-to-wafer semiconductor device includes a first wafer substrate having a first bonding layer formed on a first bulk substrate layer. A second wafer...
US-1,002,0278 Method for positioning a semiconductor chip on a carrier and method for material-fit bonding of a semiconductor...
A semiconductor chip includes a semiconductor body having a bottom side and a top side opposite the bottom side, and passivation arranged on the top side. The...
US-1,002,0277 Circuit substrate and method for manufacturing circuit substrate
A circuit substrate includes: a base material; and a capacitor layer. The capacitor layer includes a first metal layer that is provided on the base material, a...
US-1,002,0276 Protrusion bump pads for bond-on-trace processing
An embodiment apparatus includes a dielectric layer in a die, a conductive trace in the dielectric layer, and a protrusion bump pad on the conductive trace. The...
US-1,002,0275 Semiconductive packaging device and manufacturing method thereof
A semiconductor device includes a first substrate including a plurality of first pads disposed on a first surface of the first substrate, a second substrate...
US-1,002,0274 Solder particle
Disclosed is a solder particle including a plastic core; a copper-free metal layer which is formed on an external surface of the plastic core; and a solder...
US-1,002,0273 Semiconductor devices and methods of forming the same
According to aspects provided herein, a semiconductor device may include a bump providing improved reliability and reduced size. In some aspects, a conductive...
US-1,002,0272 Electronic component package
An electronic component package includes: a frame, including a through-hole and a through-wiring; an electronic component disposed in the through-hole of the...
US-1,002,0271 Calibration kits for RF passive devices
A method includes measuring a first calibration kit in a wafer to obtain a first performance data. The wafer includes a substrate, and a plurality of dielectric...
US-1,002,0270 Semiconductor device including a LDMOS transistor, monolithic microwave integrated circuit and method
In an embodiment, a semiconductor device includes a semiconductor substrate including a front surface, an LDMOS transistor structure in the front surface, a...
US-1,002,0269 Devices and methods related to electrostatic discharge protection benign to radio-frequency operation
Disclosed are systems, devices and methods for providing electrostatic discharge (ESD) protection for integrated circuits. In some implementations, first and...
US-1,002,0268 Random number generator device and control method thereof
A random number generator device has at least at least a memory unit, a voltage generator, and a control circuit. Each memory unit has two memory cells, one of...
US-1,002,0267 2.5D electronic package
A 2.5D electronic package is provided in which at least one integrated circuit is mounted on an interposer that is mounted on a package substrate. To reduce...
US-1,002,0265 Semiconductor structure and fabricating method thereof
A method of fabricating a semiconductor structure includes forming an alignment mark layer on a substrate; patterning the alignment mark layer for forming at...
US-1,002,0264 Integrated circuit substrate and method for manufacturing the same
The description discloses a method for use in manufacturing integrated circuit chips. The method comprises providing a wafer having a plurality of integrated...
US-1,002,0263 Semiconductor package and manufacturing method thereof
Provided are a semiconductor package and a manufacturing method thereof for securing a space for mounting a semiconductor device by etching a temporary metal...
US-1,002,0262 High resolution solder resist material for silicon bridge application
In accordance with disclosed embodiments, there are provided high resolution solder resist material for silicon bridge application. For instance, in accordance...
US-1,002,0261 Split rail structures located in adjacent metal layers
A first metal layer of a semiconductor device includes a plurality of first metal lines that each extend along a first axis, and a first rail structure that...
US-1,002,0260 Corrosion and/or etch protection layer for contacts and interconnect metallization integration
The present disclosure relates to semiconductor structures and, more particularly, to a corrosion and/or etch protection layer for contacts and interconnect...
US-1,002,0259 Copper etching integration scheme
The present disclosure relates to a method for forming an interconnect structure. In some embodiments, the method may be performed by forming an opening within...
US-1,002,0257 Electrical fuse and/or resistor structures
Electrical fuse (eFuse) and resistor structures and methods of manufacture are provided. The method includes forming metal gates having a capping material on a...
US-1,002,0256 Electronic fuse having an insulation layer
A structure including a dual damascene feature in a dielectric layer, the dual damascene feature including a first via, a second via, and a trench, the first...
US-1,002,0255 Integration of super via structure in BEOL
Semiconductor devices including super via structures and BEOL processes for forming the same, according to embodiments of the invention, generally include...
US-1,002,0254 Integration of super via structure in BEOL
Semiconductor devices including super via structures and BEOL processes for forming the same, according to embodiments of the invention, generally include...
US-1,002,0253 Manufacturing method of memory device
The invention provides a memory device. The memory device includes a substrate, a plurality of first wires, a plurality of etch-stop layers, a dielectric layer,...
US-1,002,0252 Wiring with external terminal
Apparatuses for providing external terminals of a semiconductor device are described. An example apparatus includes: a pad formation area including a plurality...
US-1,002,0251 Semiconductor device and method fabricating the same
According to an exemplary embodiment, a semiconductor device is provided. The semiconductor device includes a first seal ring and a first circuit. The first...
US-1,002,0250 Interposer, module, and method of producing interposer
To achieve an interposer being capable of corresponding to a variety of pitch conversions and being inexpensive as compared to the one in the related art. An...
US-1,002,0249 Electronic device package using a substrate side coaxial interface
An electronic device is provided. In particular, the electronic device includes (i) an electronic integrated circuit (IC) chip, (ii) a chip mounting substrate...
US-1,002,0248 Tape for electronic devices with reinforced lead crack
Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting...
US-1,002,0247 Method and system for improved matching for on-chip capacitors
Methods and systems for improved matching for on-chip capacitors may comprise in a semiconductor die comprising an on-chip capacitor with one or more metal...
US-1,002,0246 Semiconductor device
A semiconductor device includes: a semiconductor substrate through which a via hole is formed from a back surface to a front surface of the semiconductor...
US-1,002,0245 Laminate electronic device
A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second...
US-1,002,0244 Polymer via plugs with high thermal integrity
The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that...
US-1,002,0242 Immersion cooling arrangements for electronic devices
An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic...
US-1,002,0241 Heat-dissipating structure and method for manufacturing same
A heat-dissipating structure including a heat sink having a recessed portion on a first surface facing a heat generator, the recessed portion having a side...
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