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Patent # Description
US-1,002,0250 Interposer, module, and method of producing interposer
To achieve an interposer being capable of corresponding to a variety of pitch conversions and being inexpensive as compared to the one in the related art. An...
US-1,002,0249 Electronic device package using a substrate side coaxial interface
An electronic device is provided. In particular, the electronic device includes (i) an electronic integrated circuit (IC) chip, (ii) a chip mounting substrate...
US-1,002,0248 Tape for electronic devices with reinforced lead crack
Provided is a tape for electronic devices with lead crack and a method of manufacturing the tape. According to the present invention, by forming a cutting...
US-1,002,0247 Method and system for improved matching for on-chip capacitors
Methods and systems for improved matching for on-chip capacitors may comprise in a semiconductor die comprising an on-chip capacitor with one or more metal...
US-1,002,0246 Semiconductor device
A semiconductor device includes: a semiconductor substrate through which a via hole is formed from a back surface to a front surface of the semiconductor...
US-1,002,0245 Laminate electronic device
A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second...
US-1,002,0244 Polymer via plugs with high thermal integrity
The present disclosure relates to providing via plugs in vias of a semiconductor material. The via plugs may be formed of a polymer, such as a polyimide, that...
US-1,002,0243 Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system
A power electronics assembly having a semiconductor device stack having a wide bandgap semiconductor device, a first electrode electrically coupled the wide...
US-1,002,0242 Immersion cooling arrangements for electronic devices
An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic...
US-1,002,0241 Heat-dissipating structure and method for manufacturing same
A heat-dissipating structure including a heat sink having a recessed portion on a first surface facing a heat generator, the recessed portion having a side...
US-1,002,0240 Semiconductor device
A semiconductor device includes a wiring substrate, a semiconductor element mounted on the wiring substrate, a heat dissipation plate bonded to an upper surface...
US-1,002,0239 Semiconductor structure and manufacturing method thereof
A semiconductor structure includes a substrate comprising a die pad disposed over the substrate, and a passivation disposed over the substrate and surrounding...
US-1,002,0238 Method for manufacturing composite body and composition
Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a...
US-1,002,0237 Power semiconductor module and method for producing a power semiconductor module
A power semiconductor module includes a module housing and a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied...
US-1,002,0236 Dam for three-dimensional integrated circuit
An apparatus comprising a first substrate, a dam structure disposed on a first side of the first substrate, and an integrated circuit (IC) memory chip coupled...
US-1,002,0235 Selective surface treatment of thallium bromide (TLBR)-based detectors to improve longevity and/or restore...
In various approaches room-temperature gamma detector longevity may be improved by selectively removing, or selectively incorporating, alternate halogen...
US-1,002,0234 Method of inspecting device using first measurement and second measurement lights
A method for fabricating a substrate includes forming a first substrate including a thin film transistor array, and inspecting a first surface of an inspecting...
US-1,002,0233 Plasma processing apparatus and plasma processing method
In a plasma processing method and apparatus for processing a film to be processed contained in a film structure preliminarily formed on an upper surface of a...
US-1,002,0232 Integrated circuits with recessed gate electrodes
Integrated circuits including MOSFETs with selectively recessed gate electrodes. Transistors having recessed gate electrodes with reduced capacitive coupling...
US-1,002,0231 Semiconductor device and method for fabricating the same
In one embodiment, the semiconductor device includes at least one active fin protruding from a substrate, a first gate electrode crossing the active fin, and a...
US-1,002,0230 FinFETs with multiple threshold voltages
A device includes a substrate, a semiconductor fin over the substrate, and a gate dielectric layer on a top surface and sidewalls of the semiconductor fin. A...
US-1,002,0229 Fin type field effect transistors with different pitches and substantially uniform fin reveal
A semiconductor device that includes a first plurality of fin structures in a first device region and a second plurality of fin structures in a second device...
US-1,002,0228 Integrated circuitry and methods of forming transistors
Some embodiments include integrated circuits having first and second transistors. The first transistor is wider than the second transistor. The first and second...
US-1,002,0227 Stress memorization technique for strain coupling enhancement in bulk finFET device
A method for forming strained fins includes etching trenches in a bulk substrate to form fins, filling the trenches with a dielectric fill and recessing the...
US-1,002,0226 Method for forming a semiconductor device and a semiconductor device
In certain embodiments, a semiconductor device includes a plurality of semiconductor chips. Each semiconductor chip comprises a semiconductor body having a...
US-1,002,0225 Method of manufacturing semiconductor device
An object of the present invention is to improve the reliability of a semiconductor device. A semiconductor device has a first lead group comprised of a...
US-1,002,0224 Self-aligned via forming to conductive line and related wiring structure
A method of forming a via and a wiring structure formed are disclosed. The method may include forming a conductive line in a first dielectric layer; forming a...
US-1,002,0223 Reduced tip-to-tip and via pitch at line end
A semiconductor structure and methods of forming the semiconductor structure forming a single damascene line formed of a conductive material in a dielectric...
US-1,002,0222 Method for processing an inner wall surface of a micro vacancy
There is provided a method for processing an inner wall surface of a micro vacancy, capable of reliably etching or cleaning even if the hole provided to the...
US-1,002,0221 Method and structure for minimizing fin reveal variation in FinFET transistor
A semiconductor device includes a plurality of fins spaced apart from each other on a substrate; a liner layer on the substrate between each fin of the...
US-1,002,0220 Wafer positioning pedestal for semiconductor processing
An assembly used in a process chamber for depositing a film on a wafer and including a pedestal extending from a central axis. An actuator is configured for...
US-1,002,0219 Method for realizing ultra-thin sensors and electronics with enhanced fragility
A method of fabricating ultra-thin semiconductor devices includes forming an array of semiconductor dielets mechanically suspended on a frame with at least one...
US-1,002,0218 Substrate support assembly with deposited surface features
A method of manufacturing an electrostatic chuck includes polishing a surface of a ceramic body of the electrostatic chuck to produce a polished surface and...
US-1,002,0217 Systems and methods for treating substrates with cryogenic fluid mixtures
Disclosed herein are systems and methods for treating the surface of a microelectronic substrate, using a cryogenic fluid mixture used to treat an exposed...
US-1,002,0216 Robot diagnosing method
A robot diagnosing method of detecting a deviation amount caused by a lost motion includes: a first step of preparing a robot and a line sensor, the robot...
US-1,002,0215 Frame cassette
According to various embodiments, a frame cassette may include: a housing; a mounting structure inserted in the housing, the mounting structure including a...
US-1,002,0214 Conveyor apparatus and method for transporting leadframe
A conveyor apparatus for a leadframe includes a track defining a longitudinally extending passage through which the leadframe travels. A magnetic clamping...
US-1,002,0213 Semiconductor wafer carriers
Semiconductor wafer carriers, methods for manufacturing the semiconductor wafer carriers, and methods for using the semiconductor wafer carriers. The...
US-1,002,0212 Micro-LED pick and place using metallic gallium
An LED die containing a gallium semiconductor layer is placed on a target substrate using a pick-up tool (PUT) attached to the LED die using metallic gallium....
US-1,002,0211 Wafer-level molding chase design
An apparatus includes a mold chase, which includes a top portion and an edge ring having a ring-shape. The edge ring is underlying and connected to an edge of...
US-1,002,0210 Systems and methods for microwave-radiation annealing
Systems and methods are provided for annealing a semiconductor structure using microwave radiation. A semiconductor structure is provided. One or more...
US-1,002,0209 Fine temperature controllable wafer heating system
Disclosed are a method and a system for processing wafers in fabricating a semiconductor device where disposing chemicals and wafer heating are needed for...
US-1,002,0208 Methods and apparatus for cleaning semiconductor wafers
A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a...
US-1,002,0207 Apparatus and method for scanning an object through a fluid stream
An apparatus for treating the surface of a microelectronic workpiece via impingement of the surface with at least one fluid and a method for operating the...
US-1,002,0206 Encapsulated dies with enhanced thermal performance
The present disclosure relates to enhancing the thermal performance of encapsulated flip chip dies. According to an exemplary process, a plurality of flip chip...
US-1,002,0205 Transparent display apparatus
A display apparatus includes a pixel having a first area emitting light and a second area transmitting light. A pixel circuit unit is in the first area and...
US-1,002,0204 Bottom processing
Embodiments disclosed herein generally relate to methods and apparatus for processing of the bottom surface of a substrate to counteract thermal stresses...
US-1,002,0203 Epitaxial silicon wafer
An epitaxial silicon wafer includes a silicon wafer consisting of a COP region in which a nitrogen concentration is 1.times.10.sup.12-1.times.10.sup.13...
US-1,002,0202 Fabrication of multi threshold-voltage devices
A method of fabricating multi V.sub.th devices and the resulting device are disclosed. Embodiments include forming a high-k dielectric layer over a substrate;...
US-1,002,0201 Semiconductor device and method of fabricating the same
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes: an active region provided on a substrate; an inlet...
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