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Patent # Description
US-1,007,0570 Mounting device, image processing method, and imaging unit
A mounting device that, during movement of a mounting head, captures a first image that includes components that are collected in the mounting head and first...
US-1,007,0569 Method for manufacturing an electronic device
A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under...
US-1,007,0568 Method and apparatus for use in the manufacture of a display element
Methods and apparatus for use in the manufacture of a display element. Some embodiments include a method for selective pick up of a subset of a plurality of...
US-1,007,0567 System for printed circuit board unlocking and automated reflow carrier recycling
In embodiments, a PCB reflow process may be carried out by the components of an automated system working together to separate PCBs from reflow carriers and...
US-1,007,0566 Support pin arrangement determination assisting method
A support pin arrangement determination assisting method includes: displaying an image including a board image that indicates a shape and an arrangement of an...
US-1,007,0565 Electric power converter
An electric power converter includes a laminated body, a capacitor, a case, and a pressing member. The laminated body is formed by laminating semiconductor...
US-1,007,0564 Electric power converter
An electric power converter performing power conversion includes a plurality of semiconductor modules with built-in semiconductor elements, a plurality of...
US-1,007,0563 Electronic control unit
A substrate is fixed to a housing. Heating elements are mounted on a surface of the substrate on the housing-side. A radiating component is provided between the...
US-1,007,0562 Method and apparatus for heat-dissipation in an avionics chassis
A method and apparatus for heat-dissipation in an avionics chassis can include a housing having an outer surface, defining an exterior of the housing, an inner...
US-1,007,0561 Cooling system for data center
A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and...
US-1,007,0560 Drawer-level immersion-cooling with hinged, liquid-cooled heat sink
Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a...
US-1,007,0559 Energy storage system case and energy storage system including the same
Provided are an energy storage system case and an energy storage system including the same. An energy storage system case includes: a body unit including a...
US-1,007,0558 Immersion cooled electronic assemblies
An immersion cooled electronics arrangement includes a sealed housing, a coolant contained within the sealed housing, and an electronic device disposed within...
US-1,007,0557 Electronic device having fan motor
An electronic device according to the present invention includes a fan motor disposed at the upper side of a ventilation hole in an upper wall part of a casing...
US-1,007,0556 Methods and system for internal shock isolation
Methods and systems are disclosed for internal shock isolation in an information handling system. The method includes directing a tool to mold an outer frame of...
US-1,007,0555 Insertable fixing module of cabinet rail
An insertable fixing module of an industrial cabinet rail includes a main body, a hook, a linking slider and a press key, and the rail is installed in the...
US-1,007,0554 Flexible chassis interface device
An apparatus including a frame forming an interface device configured for connection to a test chassis, and at least one interface connector coupled to the...
US-1,007,0553 Connector replacement methods in a network element chassis
A connector replacement method in a network element chassis includes obtaining physical access to a backplane in the network element chassis, while the network...
US-1,007,0552 Electronic device and component module
An electronic device and a component module thereof are provided, wherein the electronic device includes a housing, a component and a flexible substrate. The...
US-1,007,0551 Housing module and electronic device with circuit board quick-assembling function
A housing module having a circuit board quick-assembling function is applied to an electronic device with a circuit board having a specific height. The housing...
US-1,007,0550 Fixing device for circuit board and electronic apparatus comprising the same
A fixing device for a circuit board and an electronic apparatus including the fixing device, related to the display field, and can be applied for the fixation...
US-1,007,0549 Removal assembly
A removal assembly includes a main body, a positioning element, an elastic element, an actuating element, and a wrench element. The positioning element is...
US-1,007,0548 Circuit board housing assembly
A circuit board housing assembly includes a housing; a circuit board having an opening attached to the housing; and a board removal tool having a holding...
US-1,007,0547 Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite...
A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric...
US-1,007,0546 Bendable display apparatus and supporting device
A bendable display apparatus includes a carrying plate, two supporting devices disposed on an inner side of the carrying plate, and a bendable display mounted...
US-1,007,0545 Electrical device
The invention relates to an electrical device (1) having a housing (2) and at least one receiving shaft (3), which is accessible from an outer side of the...
US-1,007,0544 Arrangement for compensating pressure in a housing
A configuration compensates for the pressure in a housing, in which at least one housing wall has a pressure compensation opening which is sealed with a...
US-1,007,0543 Power adapter
A power adapter including a first substrate, a second substrate, a transformer and an insulating frame is provided. The first substrate includes a first...
US-1,007,0542 Electronic-circuit unit and manufacturing method thereof
An electronic circuit unit in which a mold exclusion part, having a rear surface side covered by mold resin and a front surface side exposed from an outer case,...
US-1,007,0541 Display device and method of assembling it
A display device includes a display module, a rear cover that covers the rear surface of the display module, a main circuit board placed in an internal space...
US-1,007,0540 Enclosed media device with improved heat transfer capabilities
A media device enclosure includes a housing with an interior sized and configured to receive a media device therein, a front opening, and a back opening. The...
US-1,007,0539 Electrical junction with wireless controller
One aspect is an electrical junction with wireless controller configured for attachment in a building structure. The junction includes a junction body having...
US-1,007,0538 Display device
A display device may include a display module and a back cover positioned in a rear of the display module. The display module may include a display panel that...
US-1,007,0537 Formation of dielectric with smooth surface
Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment,...
US-1,007,0536 Manufacturing method of circuit board structure
Provided is a manufacturing method of a circuit board structure including steps as below. A glass film is provided on an electrostatic chuck (E-chuck). A dicing...
US-1,007,0535 Waterproof structure for implanted electronic device
A waterproof structure for an implanted electronic device is capable of preventing the liquid or moist from entering and damaging the circuit board of the...
US-1,007,0534 Tool for cutting the isthmuses of printed circuit boards
A tool for cutting the isthmuses in slots of a plate comprising PCBs includes: a base plate, a spindle having a shank and a cutting tip, a spindle support fixed...
US-1,007,0533 Photo-definable glass with integrated electronics and ground plane
The present invention includes compositions and methods of creating electrical isolation and ground plane structures, around electronic devices (inductors,...
US-1,007,0532 Printed circuit board fabrication processes and architecture including point-of-use design and fabrication...
Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as...
US-1,007,0531 Overlay circuit structure for interconnecting light emitting semiconductors
A system and method for packaging light emitting semiconductors (LESs) is disclosed. An LES device is provided that includes a heatsink and an array of LES...
US-1,007,0530 Electronic component and manufacturing method thereof
An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first...
US-1,007,0529 Electronic circuit device
A surface-mount component (10A) having a pair of connection terminals (12a, 12b) with an inter-terminal pitch L2 therebetween is mounted on a circuit substrate...
US-1,007,0528 Semiconductor device wiring pattern and connections
A semiconductor device, while being small, makes it possible to achieve low inductance responding to high speed switching. The semiconductor device includes a...
US-1,007,0527 Semiconductor device
When a nut housing member is inserted from a first opening portion into a case (terminal housing area) in a semiconductor device, first and second protrusions...
US-1,007,0526 Connector with structures for bi-lateral decoupling of a hardware interface
Techniques and mechanisms to provide a connector for securing to a first printed circuit board (PCB). In an embodiment, the connector is configured to receive a...
US-1,007,0525 Internal to internal coaxial via transition structures in package substrates
Methods/structures of forming package structures are described. Those methods/structures may include forming a first sub-laminated board comprising a first...
US-1,007,0524 Method of making glass core substrate for integrated circuit devices
A glass core substrate for an integrated circuit (IC) device may be formed to include a glass core and build-up structures on opposing sides of the glass core....
US-1,007,0523 Printed wiring board with conductor post having multiple surface roughness and method for manufacturing the same
A printed wiring board includes a resin insulating layer, a wiring conductor layer embedded in the insulating layer such that the wiring layer has first surface...
US-1,007,0522 Population of metal oxide nanosheets, preparation method thereof, and electrical conductor and electronic...
An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets,...
US-1,007,0521 Surface-treated copper foil
This surface-treated copper foil is characterized in that the amount of adhesion of Si on the copper foil surface is from 3.1 to 300 .mu.g/dm.sup.2, and the...
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