Easy To Use Patents Search & Patent Lawyer Directory

At Patents you can conduct a Patent Search, File a Patent Application, find a Patent Attorney, or search available technology through our Patent Exchange. Patents are available using simple keyword or date criteria. If you are looking to hire a patent attorney, you've come to the right place. Protect your idea and hire a patent lawyer.

Searching:





Search by keyword, patent number, inventor, assignee, city or state:




Patent # Description
US-1,009,0228 Semiconductor device with leadframe configured to facilitate reduced burr formation
A semiconductor package or device includes a leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a...
US-1,009,0227 Back biasing in SOI FET technology
In one aspect, the present disclosure provides a semiconductor device structure with a silicon-on-insulator (SOI) substrate composed of an active layer, a...
US-1,009,0226 Distribution and stabilization of fluid flow for interlayer chip cooling
A method of forming metallic pillars between a fluid inlet and outlet for two-phase fluid cooling. The method may include; forming an arrangement of metallic...
US-1,009,0225 Placement base for semiconductor device and vehicle equipment
A placement base (100) of a semiconductor device (90) comprises a body (10) on which the semiconductor device (90) is disposed, and a fixing unit (40) for...
US-1,009,0223 Semiconductor device and method of manufacturing same
A semiconductor device includes a heat-dissipating base, a first conductive layer bonded to the top surface of the heat-dissipating base, an AlN insulating...
US-1,009,0222 Semiconductor device with heat dissipation and method of making same
A semiconductor device includes: a semiconductor module and a heat dissipation sheet attached to a bottom surface of the semiconductor module, the heat...
US-1,009,0221 Semiconductor device with self-heat reducing layers
A method of forming a semiconductor device includes implanting dopants in a first region of the semiconductor device to form a source region. The method further...
US-1,009,0220 Semiconductor device
A semiconductor device includes a substrate; a semiconductor layer; a first protective film; a first adhesive layer disposed on the first protective film; an...
US-1,009,0219 Cured product
The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED...
US-1,009,0218 Placement base for semiconductor device and vehicle equipment
A placement base (100) of a semiconductor device (90) comprises a body (10), to which a radiation agent (80) having viscosity is applied and on which a...
US-1,009,0217 Chip packaging method and package structure
A chip packaging method and package structure, the package structure including a substrate, a sensing chip coupled to the substrate, a plastic package layer...
US-1,009,0216 Semiconductor package with interlocked connection
A semiconductor package includes a block having opposing first and second main surfaces and sides between the first and second main surfaces, and an...
US-1,009,0215 System and method for dual-region singulation
A semiconductor die includes a semiconductor circuit disposed within or over a substrate. A conductive contact pad is disposed over the substrate outside the...
US-1,009,0214 Wafer and method for processing a wafer
A wafer in accordance with various embodiments may include: at least one metallization structure including at least one opening; and at least one separation...
US-1,009,0213 Interposer test structures and methods
An embodiment of the disclosure is a structure comprising an interposer. The interposer has a test structure extending along a periphery of the interposer, and...
US-1,009,0212 Evaporation method including stretching a flexible substrate
An embodiment of the present disclosure discloses an evaporation method, including: providing a flexible substrate having an original size; stretching the...
US-1,009,0211 Edge seal for lower electrode assembly
A lower electrode assembly useful for supporting a semiconductor substrate in a plasma processing chamber includes a temperature controlled base plate, an upper...
US-1,009,0210 Material growth with temperature controlled layer
A metal-organic chemical vapor deposition (MOCVD) growth with temperature controlled layer is described. A substrate or susceptor can have a temperature...
US-1,009,0209 Methods of predicting unity gain frequency with direct current and/or low frequency parameters
Various embodiments include approaches for predicting unity gain frequency in a MOSFET. In some cases, a method includes predicting a unity gain frequency...
US-1,009,0208 Evaluation method for oxide semiconductor thin film, quality control method for oxide semiconductor thin film,...
Provided are: a method for measuring and evaluating (predicting or estimating) stress stability of an oxide semiconductor thin film in a contactless manner; and...
US-1,009,0207 Multi-point chemical mechanical polishing end point detection system and method of using
A wafer polishing system including a platen configured to rotate in a first direction, and a polishing head configured to hold a wafer, the polishing head...
US-1,009,0206 FinFET gate structure and method for fabricating the same
A semiconductor device includes a n-type gate structure over a first semiconductor fin, in which the n-type gate structure includes a n-type work function metal...
US-1,009,0205 Fin profile improvement for high performance transistor
A finFET semiconductor device and method for fabricating such a device are presented. The semiconductor device includes a first fin formed in a first...
US-1,009,0204 Vertical FINFET structure and methods of forming same
The disclosure is directed to an integrated circuit structure and methods of forming the same. The integrated circuit structure may include: a set of fins...
US-1,009,0203 Method for fabricating semiconductor device
A semiconductor device and a method of forming the same, the semiconductor device includes a substrate, a plurality of fin shaped structures and an insulating...
US-1,009,0202 Source and drain epitaxial semiconductor material integration for high voltage semiconductor devices
A method of forming a semiconductor device that includes providing a first set of fin structures having a first pitch, and a second set of fin structure having...
US-1,009,0201 Method of manufacturing semiconductor device reducing variation in thickness of silicon layer among...
A semiconductor device manufacturing method includes forming a silicon layer by epitaxial growth over a semiconductor substrate having a first area and a second...
US-1,009,0200 Bipolar junction semiconductor device and method for manufacturing thereof
A bipolar junction semiconductor device and associated method of manufacturing, the bipolar junction semiconductor device has a P type substrate, a N type...
US-1,009,0199 Semiconductor device and method for supporting ultra-thin semiconductor die
A first semiconductor substrate contains a first semiconductor material, such as silicon. A second semiconductor substrate containing a second semiconductor...
US-1,009,0198 Method for separating substrates and semiconductor chip
Disclosed is a method for separating a substrate (1) along a separation pattern (4), in which method a substrate (1) is provided and an auxiliary layer (3) is...
US-1,009,0197 Aggressive tip-to-tip scaling using subtractive integration
An interconnect structure including a semiconductor structure on a semiconductor substrate, the semiconductor structure having a gate structure, shallow trench...
US-1,009,0196 3D integrated circuit and methods of forming the same
An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous...
US-1,009,0195 Method including a formation of a diffusion barrier and semiconductor structure including a diffusion barrier
A method includes forming a diffusion barrier over a semiconductor structure. The formation of the diffusion barrier includes performing a first tantalum...
US-1,009,0194 Semiconductor device and method
A method of manufacturing a semiconductor device includes the step of positioning a patterned mask over a dielectric layer. The dielectric layer comprises a...
US-1,009,0193 Integrated circuit structure incorporating a stacked pair of field effect transistors and a buried interconnect...
Disclosed is an integrated circuit (IC) structure that incorporates stacked pair(s) of field effect transistors (FETs), where each stacked pair has a shared...
US-1,009,0192 Method for producing a conductor line
A method for producing a rounded conductor line of a semiconductor component is disclosed. In that method, a partially completed semiconductor component is...
US-1,009,0191 Selective plasma etching method of a first region containing a silicon atom and an oxygen atom
A method includes performing one or more times of a sequence and reducing a film thickness of a fluorocarbon-containing film formed by performing one or more...
US-1,009,0190 Methods of fabricating semiconductor devices including fin-shaped active regions
A method of manufacturing a semiconductor device includes forming a plurality of fins by forming a plurality of first device isolating trenches repeated at a...
US-1,009,0189 Substrate cleaning apparatus comprising a second jet nozzle surrounding a first jet nozzle
A substrate cleaning apparatus capable of removing particles that exist in minute recesses formed on a substrate surface is disclosed. The substrate cleaning...
US-1,009,0188 Robot subassemblies, end effector assemblies, and methods with reduced cracking
A robot subassembly including roll, pitch, and/or vertical orientation adjustability capability of a ceramic or glass end effector. The robot subassembly...
US-1,009,0187 Multi-zone pedestal for plasma processing
A method and apparatus for a heated pedestal is provided. In one embodiment, the heated pedestal includes a body comprising a ceramic material, a plurality of...
US-1,009,0186 Chuck table
A chuck table holds under suction a front side of a wafer which includes a device region including a plurality of devices, each having a plurality of electrode...
US-1,009,0185 Semiconductor device and manufacturing method thereof
Provided are a semiconductor device and a method of manufacturing the same. A carrier is removed after a first semiconductor die and a second semiconductor die...
US-1,009,0184 Carrier substrate, method of manufacturing the same, and method of manufacturing flexible display device using...
A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface...
US-1,009,0183 Sample holder
A sample holder includes a substrate which is formed of a ceramic containing aluminum nitride as a primary component and which has an outer surface functioning...
US-1,009,0182 Load port device and cleaning gas introducing method into a container on a load port
A load port device includes an installation stand, an opening and closing part, a gas introduction part, and a gas discharge part. The installation stand...
US-1,009,0181 Method and apparatus for substrate transfer and radical confinement
Embodiments of the present invention provide an apparatus for transferring substrates and confining a processing environment in a chamber. One embodiment of the...
US-1,009,0180 Package assembly for thin wafer shipping and method of use
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a...
US-1,009,0179 Semiconductor stocker systems and methods
In an embodiment, the present invention discloses cleaned storage processes and systems for high level cleanliness articles, such as extreme ultraviolet (EUV)...
US-1,009,0178 Gas temperature measurement method and gas introduction system
There is provided a method of measuring a temperature of a gas in a line connected to a gas supply source and a decompressor, the line being divided by a first,...
← Previous | 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 141 142 | Next →

File A Patent Application

  • Protect your idea -- Don't let someone else file first. Learn more.

  • 3 Easy Steps -- Complete Form, application Review, and File. See our process.

  • Attorney Review -- Have your application reviewed by a Patent Attorney. See what's included.