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Patent # Description
US-1,014,1293 Semiconductor package
A semiconductor package includes a package base substrate including bonding pads and a connection pads respectively on an upper surface and a lower surface of...
US-1,014,1292 Driving chip bump having irregular surface profile, display panel connected thereto and display device...
A display device includes: a display panel driven to display an image, the display panel including a substrate including a display area at which the image is...
US-1,014,1291 Semiconductor device and method of manufacturing the same
The present disclosure relates to a semiconductor device and method of manufacturing the same. The method for manufacturing a semiconductor device includes:...
US-1,014,1290 Display device and method for manufacturing the same
A method for manufacturing a display device is provided. The method includes: forming at least two bottom conductive lines on an array substrate; disposing at...
US-1,014,1289 Semiconductor packages having package-on-package structures
A semiconductor package includes a lower package with a lower semiconductor chip on a lower package substrate, and an upper package with an upper semiconductor...
US-1,014,1288 Surface mount device/integrated passive device on package or device structure and methods of forming
Package structures and methods of forming them are described. In an embodiment, a package structure includes an integrated circuit die embedded in an...
US-1,014,1287 Transferring method, manufacturing method, device and electronic apparatus of micro-LED
The present invention discloses a transferring method, a manufacturing method, a device and an electronic apparatus of micro-LED. The method for transferring...
US-1,014,1286 Methods of manufacturing semiconductor packages
Methods of manufacturing a semiconductor package are provided. The methods may include manufacturing a semiconductor chip in a first semiconductor manufacturing...
US-1,014,1285 Externally induced charge patterning using rectifying devices
A system and method form charge patterns on micro objects. The system and method employ a micro object including a rectifying device. The rectifying device...
US-1,014,1284 Method of bonding semiconductor substrates
The disclosed technology generally relates to semiconductor wafer bonding, and more particularly to direct bonding by contacting surfaces of the semiconductor...
US-1,014,1283 Sinterable bonding material and semiconductor device using the same
An objective of the present invention is to provide a sinterable bonding material excellent in sinterability. The present invention relates to a sinterable...
US-1,014,1281 Substrate and package structure
According to an exemplary embodiment, a substrate having a first area and a second area is provided. The substrate includes a plurality of pads. Each of the...
US-1,014,1280 Mechanisms for forming package structure
Structures and formation methods of a package structure are provided. The package structure includes a semiconductor die and a substrate bonded to the...
US-1,014,1279 Semiconductor device and manufacturing method for semiconductor device
A semiconductor device includes a semiconductor substrate, a conductor provided on a main surface of the semiconductor substrate, an insulating layer disposed...
US-1,014,1278 Chip mounting structure
Highly reliable chip mounting is accomplished by using a substrate having such a shape that a stress exerted on a flip-chip-connected chip can be reduced, so...
US-1,014,1277 Monolithic decoupling capacitor between solder bumps
An integrated circuit includes pads formed on a back end of the line surface, and decoupling capacitor stacks monolithically formed about the pads. Solder balls...
US-1,014,1276 Semiconductor package structure and manufacturing method thereof
A semiconductor package structure and a manufacturing method thereof are provided. The semiconductor package structure includes a redistribution structure, at...
US-1,014,1275 Method for manufacturing a semiconductor structure
The present disclosure provides a method for manufacturing a semiconductor structure. The semiconductor structure includes a substrate having a first surface...
US-1,014,1274 Semiconductor chip with anti-reverse engineering function
A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first...
US-1,014,1273 Semiconductor device and manufacturing method thereof
In a semiconductor device according to an embodiment, a second semiconductor chip is mounted on a first rear surface of a first semiconductor chip. Also, the...
US-1,014,1272 Semiconductor apparatus, stacked semiconductor apparatus and encapsulated stacked-semiconductor apparatus each...
A semiconductor apparatus including a semiconductor device, an on-semiconductor-device metal pad and a metal interconnect each electrically connected to the...
US-1,014,1271 Semiconductor device having enhanced high-frequency capability and methods for making same
A method of reducing electromagnetic interference in a semiconductor device includes: forming at least one functional circuit in a substrate of the...
US-1,014,1270 Semiconductor device and method of manufacturing thereof
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a...
US-1,014,1269 Semiconductor device having conductive wire with increased attachment angle and method
A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the...
US-1,014,1268 Circuit package with internal and external shielding
A module includes a circuit package, which includes first and second electronic components on a substrate, internal and external shields, and a molded compound....
US-1,014,1266 Method of fabricating semiconductor package structure
A semiconductor package structure and a method of fabricating the same are provided. The semiconductor package structure includes a package body having opposing...
US-1,014,1265 Bent-bridge semiconductive apparatus
A bent-bridge semiconductive apparatus includes a silicon bridge that is integral to a semiconductive device and the silicon bridge is deflected out of...
US-1,014,1264 Method and structure for wafer level packaging with large contact area
A method to provide a wafer level package with increasing contact pad area comprising the steps of forming a first packaging layer on wafer top surface,...
US-1,014,1263 Method for fabricating semiconductor device
A method for fabricating semiconductor device includes the steps of: providing a substrate; forming a first gate structure on the substrate, a first spacer...
US-1,014,1262 Electrically conductive laminate structures
Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene...
US-1,014,1261 Device comprising nanostructures and method of manufacturing thereof
A method for manufacturing of a device including a first substrate including a plurality of sets of nanostructures arranged on the first substrate, wherein each...
US-1,014,1260 Interconnection structure and method for forming the same
A method of forming an interconnection structure includes forming a dielectric structure over a non-insulator structure; forming a hole in the dielectric...
US-1,014,1259 Semiconductor devices having electrically and optically conductive vias, and associated systems and methods
Semiconductor devices having one or more vias filled with a transparent and electrically conductive material are disclosed herein. In one embodiment, a...
US-1,014,1258 Semiconductor devices having staggered air gaps
A semiconductor device includes a substrate, a plurality of first conductive patterns disposed on the substrate and a plurality of second conductive patterns...
US-1,014,1257 Semiconductor device and a method of manufacturing the same
For simplifying the dual-damascene formation steps of a multilevel Cu interconnect, a formation step of an antireflective film below a photoresist film is...
US-1,014,1255 Circuit boards and semiconductor packages including the same
A circuit board and a semiconductor packages therewith are disclosed. The circuit board may include a top surface, on which at least one semiconductor chip is...
US-1,014,1254 Direct bonded copper power module with elevated common source inductance
A direct bonded copper (DBC) power module with elevated common source inductance is adapted for use as a half bridge in an electric drive for an electric...
US-1,014,1253 Semiconductor device and method
A semiconductor device includes a substrate, a first redistribution layer (RDL) over a first side of the substrate, one or more semiconductor dies over and...
US-1,014,1252 Semiconductor packages
A semiconductor package includes: a passivation layer having a first surface and a second surface opposite to the first surface, the passivation layer defining...
US-1,014,1251 Electronic packages with pre-defined via patterns and methods of making and using the same
An electronic package is provided. The electronic package includes a substrate and a plurality of vias defined by a corresponding plurality of pre-defined via...
US-1,014,1250 Chip and electronic device
A chip includes a substrate and a die that are wrapped together by means of a packaging process. Multiple substrate cables corresponding to attachment points...
US-1,014,1249 Molded intelligent power module and method of making the same
An intelligent power module (IPM) has a first, second, third and fourth die paddles, a first, second, third, fourth, fifth and sixth metal-oxide-semiconductor...
US-1,014,1248 Semiconductor device and manufacturing method thereof
On the assumption that a pair of hanging parts is provided in a lead frame and a clip includes a main body part and a pair of extension parts, the pair of the...
US-1,014,1247 Power semiconductor device
The invention relates to a power semiconductor device with a substrate and an electrically conductive DC voltage bus bar system and a capacitor connected to the...
US-1,014,1246 Leadframe package with side solder ball contact and method of manufacturing
The present disclosure is directed to a leadframe package having a side solder ball contact and methods of manufacturing the same. A plurality of solder balls...
US-1,014,1245 High-power acoustic device with improved performance
The present disclosure relates to a high-power acoustic device with improved performance. The disclosed acoustic device includes a substrate, a die-attach...
US-1,014,1244 TSV layout structure and TSV interconnect structure, and fabrication methods thereof
TSV layout structure and TSV interconnect structure, and their fabrication methods are provided. An exemplary TSV interconnect structure includes a...
US-1,014,1243 Thyristor assembly radiator for DC converter valve
A thyristor assembly radiator for a DC converter valve. A water discharging port of an N.sup.th radiator is communicated with a water discharging port of an...
US-1,014,1241 Multi-chip self adjusting cooling solution
An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on...
US-1,014,1240 Semiconductor device, corresponding circuit and method
A semiconductor device includes a layered package having a semiconductor die embedded therein, the semiconductor die coupled with a thermally-conductive...
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