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Patent # Description
US-1,027,0271 Energy harvesting fabric
The apparatus includes an apparatus for harvesting energy. The apparatus includes a textile having an insulating substrate, a direct current (DC) power bus...
US-1,027,0267 Charging device for supporting a computing device at multiple positions
A charging device is provided. The charging device includes a support structure and contact elements provided in the support structure. The contact elements are...
US-1,027,0178 Motor vehicle having an antenna arrangement
A motor vehicle includes an outer plate, formed from an electrically conductive material, which delimits an interior of the motor vehicle from an environment,...
US-1,027,0176 Communication device
A communication device includes an antenna system, a metal base, and a metal elevating pillar. The antenna system at least includes a dual-polarized antenna and...
US-1,027,0131 Electrolyte for lithium battery and lithium battery including the same
An electrolyte for a lithium battery and a lithium battery including the electrolyte, the electrolyte including a compound represented by Formula 1 below: ...
US-1,027,0073 Organic/inorganic composite coating porous separator and secondary battery element using same
There is provided an organic/inorganic complex coating porous separator including a porous substrate, and an organic/inorganic complex coating layer formed in a...
US-1,027,0068 Packaging apparatus and method for packaging display substrate
Embodiments of the present application provide a packaging apparatus and a method for packaging a display substrate, which belong to the technical field of...
US-1,027,0066 Pedestal of laser packaging device and laser packaging device
A laser packaging device and its pedestal are provided. The pedestal includes a metal pedestal body and thermal-insulation structures. The thermal-insulation...
US-1,027,0057 Light-emitting device, module, electronic device, and method for manufacturing light-emitting device
A light-emitting element, a bonding layer, and a frame-like partition are formed over a substrate. The partition is provided to surround the bonding layer and...
US-1,027,0056 Display device and method of manufacturing thereof
A novel display device with higher reliability having a structure of blocking moisture and oxygen, which deteriorate the characteristics of the display device,...
US-1,027,0037 Polymers, monomers and methods of forming polymers
A method of forming a crosslinked polymer comprising the step of reacting a crosslinkable group in the presence of a polymer, wherein: the crosslinkable group...
US-1,027,0008 Light emitting element including metal bulk
A light emitting element according to an embodiment of the present invention comprises a first conductive-type semiconductor layer including a contact region on...
US-1,027,0004 Production method for transparent electrically-conductive film using multistage light irradiation
Provided is a production method for a transparent electrically-conductive film including: a) a coating step of coating an electrically-conductive nanowire...
US-1,026,9985 Radical oxidation process for fabricating a nonvolatile charge trap memory device
A memory device is described. Generally, the memory device includes a tunnel oxide layer overlying a channel connecting a source and a drain of the memory...
US-1,026,9976 Method for manufacturing semiconductor device
To provide a transistor in which a channel is formed in an oxide semiconductor and which has stable electrical characteristics. To suppress shift in threshold...
US-1,026,9959 High voltage transistor structure and method
A device comprises a buried layer over a substrate, a first well over the buried layer, a first high voltage region and a second high voltage region extending...
US-1,026,9958 Semiconductor device and method of fabricating the same
A semiconductor device includes first source/drain regions disposed at both sides of a first gate structure and including dopants of a first conductivity type,...
US-1,026,9956 Asymmetric vertical device
A vertical FET with asymmetrically positioned source region and drain region is provided. The source region of the vertical FET is separated from a gate...
US-1,026,9954 Power MOSFETs and methods for manufacturing the same
A semiconductor device and the method of manufacturing the same are provided. The semiconductor device comprises a substrate, a source region, a drain region, a...
US-1,026,9930 Method for producing a semiconductor device with self-aligned internal spacers
Method for producing a semiconductor device, comprising: producing a stack including a first crystalline semiconductor portion intended to form a channel and...
US-1,026,9911 Semiconductor device and method for manufacturing the same
A semiconductor device of the present invention includes a gate electrode buried in a gate trench of a first conductivity-type semiconductor layer, a first...
US-1,026,9909 Memory device and method for manufacturing the same
A memory device includes a substrate and a floating gate memory cell. The floating gate memory cell includes an erase gate structure disposed on the substrate,...
US-1,026,9881 Display device and manufacturing method thereof
A display device includes: a first substrate including: a display area including a plurality of pixels, and a peripheral area positioned around the display...
US-1,026,9858 Image sensor with reduced optical path
Among other things, one or more image sensors and techniques for forming image sensors are provided. An image sensor comprises a photodiode array configured to...
US-1,026,9832 Thin film transistor substrate, method for manufacturing thin film transistor substrate, and display panel
A thin film transistor substrate includes: a substrate; and a first thin film transistor and a second thin film transistor that are disposed on the substrate....
US-1,026,9825 Semiconductor device and method for manufacturing same
According to one embodiment, a stacked body includes a plurality of metal layers stacked with an insulator interposed. A semiconductor body extends in a...
US-1,026,9774 Semiconductor device
In a semiconductor device, a first semiconductor chip having a main surface provided with a first terminal group including terminals, and a rear face mounted on...
US-1,026,9773 Semiconductor packages and methods of forming the same
A device is provided, including: a first device package including: a first redistribution structure including a first redistribution line and a second...
US-1,026,9763 Package-on-package structure having polymer-based material for warpage control
The present disclosure relates to a package-on-package structure providing mechanical strength and warpage control. In some embodiments, the package-on-package...
US-1,026,9761 Semiconductor device and method
A semiconductor device and method are provided which utilizes a single mask to form openings for both a through substrate via as well as for a through...
US-1,026,9758 Systems and processes for measuring thickness values of semiconductor substrates
A system for determining thickness variation values of a semiconductor substrate comprises a substrate vacuumed to a pedestal that defines a reference plane for...
US-1,026,9727 Composite magnetic sealing material and electronic circuit package using the same as mold material
Disclosed herein is a composite magnetic sealing material includes a resin material and a filler blended in the resin material in a blend ratio of 50 vol. % or...
US-1,026,9722 Wiring board having component integrated with leadframe and method of making the same
A wiring board includes an electronic component laterally surrounded by a leadframe, and first and second buildup circuitries disposed beyond the space...
US-1,026,9717 Structure and formation method for chip package
Structures and formation methods of a chip package are provided. The chip package includes a semiconductor die and a package layer partially or completely...
US-1,026,9690 Cascode semiconductor package and related methods
A semiconductor package includes an electrically conductive base (base) having a source connector. A drain connector and a gate connector are electrically...
US-1,026,9683 Semiconductor device having a through electrode and method of manufacturing the same
A semiconductor device according to an embodiment includes a semiconductor layer having a first plane and a second plane, an insulating layer provided in the...
US-1,026,9682 Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices are disclosed. In some embodiments, a cooling device for a...
US-1,026,9681 Semiconductor device and manufacturing method of semiconductor device
A semiconductor device includes: a wiring board including an insulating board and a wiring layer, the insulating board having an element mounting surface, which...
US-1,026,9659 Semiconductor structure and fabrication method thereof
A semiconductor structure and a fabrication method are provided. A fabrication method includes providing a substrate including an NMOS region and a PMOS region;...
US-1,026,9638 Semiconductor apparatus, method of manufacturing the same, and equipment
A semiconductor apparatus includes a semiconductor substrate having an upper surface on which a semiconductor element is disposed, a lower surface opposite to...
US-1,026,9629 Semiconductor device and method of manufacturing the same
A semiconductor device and a method of manufacturing the same, the semiconductor device including a substrate; an insulating layer on the substrate, the...
US-1,026,9609 Wafer level flat no-lead semiconductor packages and methods of manufacture
Methods of manufacturing semiconductor packages. Implementations may include: providing a substrate with a first side, a second side, and a thickness; forming a...
US-1,026,9595 Seal for wafer processing assembly
A seal having a cross-sectional profile that includes a first lobe, a second lobe, and a corner having an angle between 45 and 90 degrees, inclusive, a first...
US-1,026,9588 Integrated circuit underfill scheme
An integrated circuit includes a substrate having at least one depression on a top surface. At least one solder bump is disposed over the substrate. A die is...
US-1,026,9560 Atomic layer deposition method for manufacturing semiconductor structure
A method for manufacturing semiconductor structure is disclosed. The method includes: providing a semiconductor substrate; hydrogenizing a surface of the...
US-1,026,9558 Method of forming a structure on a substrate
The invention relates to a method of providing a structure by depositing a layer on a substrate in a reactor. The method comprising: introducing a silicon...
US-1,026,9554 Method for manufacturing SiC epitaxial wafer and SiC epitaxial wafer
In order to reduce edge defects efficiently and sufficiently, a method for manufacturing a SiC epitaxial wafer according to the present invention is a method...
US-1,026,9498 Multi-layer ceramic capacitor and method of producing the same
A multi-layer ceramic capacitor includes a body. The body includes a capacitance forming unit, a cover, and a side margin. The capacitance forming unit includes...
US-1,026,9478 Apparatus and methods for changing the magnetisation of a superconductor
A superconducting circuit having: a charging loop; a load loop including a superconductor; a superconducting connection which is simultaneously part of the...
US-1,026,9471 Method and apparatus for producing a submarine cable, and submarine cable produced therewith
A method and to an apparatus for producing a submarine cable containing a number of conductors, in particular energy conductors and/or data conductors, that are...
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