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Patent # Description
US-1,027,6793 Variable resistance memory devices and methods of manufacturing the same
A variable resistance memory device includes a plurality of first conductive lines, each of the first conductive lines extends in a first direction, a plurality...
US-1,027,6792 Low power barrier modulated cell for storage class memory
Systems and methods for providing a Barrier Modulated Cell (BMC) structure that may comprise a reversible resistance-switching memory element within a memory...
US-1,027,6791 Resistive random access memory device
A memory includes: a first electrode comprising a top boundary and a sidewall; a resistive material layer, disposed above the first electrode, that comprises at...
US-1,027,6790 Top electrode for device structures in interconnect
Some embodiments relate to an integrated circuit device, which includes a bottom electrode, a dielectric layer, and top electrode. The dielectric layer is...
US-1,027,6789 Methods of manufacturing a magnetic field sensor
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a...
US-1,027,6788 Ion beam apparatuses and methods for forming patterns using the same, and methods for manufacturing magnetic...
An ion beam apparatus may include a chamber assembly configured to hold a material and direct an ion beam on the material, a detector configured to detect a...
US-1,027,6787 Integrated anisotropic magnetoresistive device
An integrated device includes a substrate having a semiconductor surface layer including functional circuitry, a lower metal stack on the semiconductor surface...
US-1,027,6786 Magnetic memory
According to one embodiment, a magnetic memory device includes a first conductive layer, a first magnetic layer, a first nonmagnetic layer, a second magnetic...
US-1,027,6785 Spin current magnetization rotational element, magnetoresistance effect element, and magnetic memory
A spin current magnetization rotational element includes: a magnetization free layer including a synthetic structure consisting of a first ferromagnetic metal...
US-1,027,6784 Semiconductor structure and associated operating and fabricating method
A semiconductor structure is provided. The semiconductor structure includes: a substrate; a magnetic layer over the substrate; a magnetic tunnel junction (MTJ)...
US-1,027,6783 Gate voltage controlled perpendicular spin orbit torque MRAM memory cell
A four terminal magnetoresistive memory cell comprises a magnetic tunnel junction stack, a ferroelectric layer and a non-ferromagnetic spin polarization layer...
US-1,027,6782 Half select method and structure for gating Rashba or spin Hall MRAM
The present disclosure generally relates to SHE-MRAM memory cells. A memory cell array comprises one or more memory cells, wherein each of the one or more...
US-1,027,6781 Magnetoresistive structures, semiconductor devices, and related systems
Magnetic memory cells, methods of fabrication, semiconductor device structures, and memory systems are disclosed. A magnetic cell core includes at least one...
US-1,027,6779 Top electrode cap structure for embedded memory
The present application relates to a method for forming a top-electrode cap structure on a memory cell. In some embodiments, a method for forming a...
US-1,027,6778 Crystal pattern forming method, piezoelectric film producing method, piezoelectric element producing method,...
A crystal pattern forming method includes: an electromagnetic wave absorbing layer forming process for forming an electromagnetic wave absorbing layer on one of...
US-1,027,6777 Ferroelectric thin-film laminated substrate, ferroelectric thin-film device,and manufacturing method of...
There is provided a ferroelectric thin-film laminated substrate, including a substrate, and further including a lower electrode layer, a ferroelectric thin-film...
US-1,027,6776 Mechanically amplified smart material actuator utilizing layered web assembly
A smart material actuator comprising a layered web assembly, compensator, smart material device and at least one actuating arm. The web assembly comprises a...
US-1,027,6775 Vibration device
A vibration device that includes a vibration portion, a support portion connected to the vibration portion, a bending-vibrating portion connected to the support...
US-1,027,6774 Multilayer ceramic structure, manufacturing method therefor and piezoelectric actuator
A multilayer ceramic structure, which is to be divided into a large number of piezoelectric actuators, includes a rectangular-parallelepiped-shaped multilayer...
US-1,027,6773 Wearable device, system and method for control of the wearable device
The invention concerns an electronic wearable device (1) adapted to form a loop around a body part of a user and comprising an elongated member (10) being a...
US-1,027,6772 Incorporating arrays of Josephson junctions in a Josephson junction ring modulator in a Josephson parametric...
A Josephson parametric converter is provided. The Josephson parametric converter includes a multi-Josephson junction ring modulator having arrays of Josephson...
US-1,027,6771 Incorporating arrays of josephson junctions in a josephson junction ring modulator in a josephson parametric...
A Josephson parametric converter is provided. The Josephson parametric converter includes a multi-Josephson junction ring modulator having arrays of Josephson...
US-1,027,6770 Flexible thermoelectric element and method for manufacturing the same
A flexible thermoelectric element and a method for manufacturing the same is provided. The thermoelectric element is disposed between a high temperature portion...
US-1,027,6769 Light emitting device
A light emitting device in which a bonding pad is soldered to a mounting substrate, wherein the bonding pad may be formed in various shapes that can minimize...
US-1,027,6767 Light emitting device
A light emitting device includes an element mounting board including a base, a set of conductive patterns, one or more light emitting elements, and a cover...
US-1,027,6766 Light-emitting device
The light-emitting device of the present invention includes: a support; a plurality of light-emitting elements arranged in a row on the support; and a conductor...
US-1,027,6765 Substrate for light emitting devices, light emitting device, and method for producing substrate for light...
A substrate (5A) includes an aluminum substrate body (10), a reflection layer (12) that is formed between an electrode pattern (20) which obtains electrical...
US-1,027,6764 Micro-lensed light emitting device
A micro-lensed, light emitting device including, a backplane, light emitting diodes (LEDs) disposed on the backplane, an encapsulation layer encapsulating the...
US-1,027,6763 Light emitting device with phase changing off state white material and methods of manufacture
Light emitting devices (LEDs) are described herein. An LED includes a light emitting semiconductor structure, a wavelength converting material and an off state...
US-1,027,6762 Optoelectronic component
An optoelectronic component includes a carrier, and a light source arranged on a surface of the carrier, said light source including at least one luminous...
US-1,027,6761 Photoelectric device package
A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and...
US-1,027,6760 Light emitting diode
Disclosed herein is a light emitting diode. The light emitting diode includes: a light emitting diode chip; a first molding portion covering the light emitting...
US-1,027,6759 Process method using deformable organic silicone resin photoconverter to bond-package LED
A process method for bond-packaging an LED using a special-shaped organic silicone resin photoconverter includes the following continuous process flow:...
US-1,027,6758 Singulaton of light emitting devices before and after application of phosphor
A two-stage singulation process is used in the fabrication of phosphor coated light emitting elements. Prior to the application of the phosphor coating, the...
US-1,027,6757 Light emitting device and method for manufacturing the same
A method for manufacturing a light emitting device includes providing a package having a recess in which a light emitting element is disposed. A translucent...
US-1,027,6756 LED display panel
The present disclosure discloses an LED display panel including at least a thin film transistor array layer, a quantum dot light emitting layer, and an LED...
US-1,027,6755 Fluidic assembly of emissive displays
Fluidic assembly methods are presented for the fabrication of emissive displays. An emissive substrate is provided with a top surface, and a first plurality of...
US-1,027,6754 Method for the fluidic assembly of emissive displays
Fluidic assembly methods are presented for the fabrication of emissive displays. An emissive substrate is provided with a top surface, and a first plurality of...
US-1,027,6753 LED flip-chip package substrate and LED package structure
A LED flip-chip package substrate includes a ceramic base (e.g., aluminum nitride base), a conductive wire layer disposed on the ceramic base and having pads in...
US-1,027,6752 Optoelectronic semiconductor component and method of producing an optoelectronic semiconductor component
An optoelectronic semiconductor component includes a light-emitting semiconductor body having a radiation side, a current expansion layer arranged on the...
US-1,027,6751 Light emitting element
A light emitting element has semiconductor layers and first and second electrodes disposed. In plan view, the first electrode has a first connecting portion, a...
US-1,027,6750 Bonding electrode structure of flip-chip led chip and fabrication method
A bonding electrode structure of a flip-chip LED chip includes: a substrate; a light-emitting epitaxial layer over the substrate; a bonding electrode over the...
US-1,027,6749 Ultraviolet reflective rough adhesive contact
A device including a first semiconductor layer and a contact to the first semiconductor layer is disclosed. An interface between the first semiconductor layer...
US-1,027,6748 Radiation-emitting semiconductor chip, method for producing a plurality of radiation-emitting semiconductor...
Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in...
US-1,027,6747 Substrate wafer and manufacturing method of a III-nitride semiconductor device
A substrate wafer composed of a hexagonal single crystal material including a C crystalline plane, an A crystalline plane, and an M-axis direction includes a...
US-1,027,6746 Polarization electric field assisted hole supplier and p-type contact structure, light emitting device and...
A hole supplier and p-contact structure for a light emitting device or a photodetector includes a p-type group III nitride structure and a hole supplier and...
US-1,027,6745 Light emitting diode including wavelength conversion layers
A light emitting diode including: a structure for emitting light at a first wavelength .lamda..sub.1, comprising a p-n junction in which is arranged an active...
US-1,027,6744 Light-emitting diode epitaxial wafer and method for preparing the same
A light-emitting diode epitaxial wafer, including: a substrate; and a buffer layer, an undoped GaN layer, an n-type GaN contact layer, a multi-quantum well...
US-1,027,6743 Light emitting diode apparatus and manufacturing method thereof
A light emitting diode (LED) apparatus is provided. The LED apparatus includes a light emitting diode, a light conversion layer stacked on the light emitting...
US-1,027,6742 Assembly and mounting of solar cells on space vehicles or satellites
Solar cell array assemblies or modules and methods of making and using such solar cell array assemblies or modules, having discrete predefined pressure...
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