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Patent # Description
US-9,300,884 Solid-state image sensor and camera having a plurality of photoelectric converters under a microlens
An image sensor includes a semiconductor substrate having first and second faces. The sensor includes a plurality of pixel groups each including pixels, each...
US-9,300,836 Image forming apparatus enabling circuit-cycling time of image carrier included in transfer unit to be found...
An image forming apparatus includes: a transfer unit, a reflectance sensor, a time-series data acquiring unit, and a transfer-unit rotation-time calculating...
US-9,300,556 Method, a computer program product, and a carrier for indicating one-way latency in a data network
Disclosed herein is a method, a computer program product, and a carrier for indicating one-way latency in a data network (N) between a first node (A) and a...
US-9,300,515 Data processing apparatus and method
A data processing apparatus maps input symbols to be communicated onto a predetermined number of sub-carrier signals of an Orthogonal Frequency Division...
US-9,300,514 OFDM generation apparatus in a multi-carrier data transmission system
OFDM generation apparatus and methods generating OFDM transmission signals from OFDM symbols, each including a plural OFDM subcarriers, for transmission in a...
US-9,300,508 High data rate milllimeter wave radio on a chip
A millimeter wave radio transceiver having all or substantially all of its components fabricated on a single chip or chipset of a small number of semiconductor...
US-9,300,499 Transmission apparatus and method using pre-distortion
The present invention relates to a transmission apparatus and a corresponding transmission method for transmitting data within a multi-carrier transmission...
US-9,300,455 Method of transmitting sounding reference signal in wireless communication system
A method of transmitting a sounding reference signal includes generating a physical uplink control channel (PUCCH) carrying uplink control information on a...
US-9,300,448 Search space for component carrier specific UL/DL configuration
A radio frame or subframe is checked and it is determined to satisfy at least one predefined condition. In response to that determination, a second search space...
US-9,300,439 HARQ failure indication method, HARQ failure indication data frame and servicing node B thereof
The present invention provides a Hybrid Automatic Repeat Request (HARQ) failure indication method, an HARQ failure indication data frame and a Serving Node B...
US-9,300,429 Method and apparatus for transporting a client signal over an optical network
A method of transporting a client signal across an optical transport network (OTN) comprises dividing a received client signal into a plurality of parallel...
US-9,300,420 Carrier aggregation receiver architecture
A receiver architecture for carrier aggregation is disclosed. In an exemplary design, an apparatus (e.g., a wireless device, a circuit module, etc.) includes a...
US-9,300,400 Communication through multiplexed one-dimensional optical signals
An example apparatus comprises an optical transmitter which includes a first processor and at least two optical modulators. The first processor is configured to...
US-9,300,395 Method and apparatus for carrier aggregation
The teachings herein provide a number of advantages, including but not limited to improving soft-cell operation in service scenarios involving legacy devices...
US-9,300,384 Method of transmitting at least one sub-packet based on feedback information in a wireless communication system
A method of transmitting subsequent sub-packets in a wireless communication system using a hybrid automatic request (HARQ) technique is disclosed. The method...
US-9,300,373 Selection of precoding vectors in lean-carrier systems
In a system using spatial precoding, in the event that reliable channel state information is unavailable, a transmitting node artificially creates a...
US-9,300,371 Beamforming systems and methods
A first network device including a receiver, a steering module, and a transmitter. The receiver is configured to receive a first signal from a second network...
US-9,300,354 Receiver for acquiring and tracking spread spectrum navigation signals with changing subcarriers
A receiver acquires and tracks a spread spectrum navigation signal with changing subcarriers. The carrier signal changes between several subcarriers according...
US-9,300,338 Systems and methods for multi-channel transceiver communications
Systems and methods for transceiver communication are discussed herein. A filter module may be configured to filter each carrier signal of a multicarrier...
US-9,300,337 Reconfigurable carrier-aggregation receiver and filter
A device includes, a reconfigurable baseband filter configured to receive a communication signal having a first carrier and a second carrier, the first carrier...
US-9,300,222 Three-dimensional power supply module with passive stacked over cavity
A power converter sub-assembly/module includes a power switching assemblage defining a cavity within which can be mounted a driver IC. The power switching...
US-9,300,197 High frequency inductor filter apparatus and method of use thereof
A high frequency inductor filter apparatus coupled with an inverter yielding high frequency harmonics and/or non-sixty Hertz output is described. For example,...
US-9,300,050 Multiband RF antenna
This invention relates to a miniature multiband antenna, in which a substrate being the carrier of a conductive element, and the conductive element configured...
US-9,300,025 Interface between an integrated circuit and a dielectric waveguide using a carrier substrate with a dipole...
A system includes an integrated circuit that has a substrate with a top surface and a bottom surface. Semiconductor circuitry is including a radio frequency...
US-9,299,971 Common carrier for the integrated mandrel battery assembly
A system for the automated coiling of a jelly roll electrode assembly for controlled assembly and tensioning of jelly roll assembly is provided. The system...
US-9,299,897 Optoelectronic semiconductor chip having a plurality of active regions arranged alongside one another
An optoelectronic semiconductor chip is disclosed. The optoelectronic semiconductor chip includes a semiconductor layer sequence having an active zone suitable...
US-9,299,876 Light emitting and lasing semiconductor methods and devices
A method for producing light emission from a semiconductor structure, including the following steps: providing a semiconductor structure that includes a...
US-9,299,873 Avalanche photodiode operating in geiger mode including a structure for electro-optical confinement for...
An avalanche photodiode includes a cathode region and an anode region. A lateral insulating region including a barrier region and an insulating region surrounds...
US-9,299,851 Semiconductor device and method for manufacturing the same
An object is to provide a semiconductor device including an oxynitride semiconductor whose carrier density is controlled. By introducing controlled nitrogen...
US-9,299,791 Oxide semiconductor thin film and thin film transistor
An oxide crystalline thin film having a comparatively high carrier mobility and suitable as TFT channel layer material is provided. The oxide semiconductor thin...
US-9,299,767 Source-channel interaction in 3D circuit
A multilayer source provides charge carriers to a multitier channel connector. The source includes a metal silicide layer on a substrate and a metal nitride...
US-9,299,742 High-voltage solid-state transducers and associated systems and methods
High-voltage solid-state transducer (SST) devices and associated systems and methods are disclosed herein. An SST device in accordance with a particular...
US-9,299,739 Image pickup apparatus and image pickup system
In a photoelectric conversion apparatus that adds signals of a plurality of photoelectric conversion elements included in photoelectric conversion units, each...
US-9,299,690 Method for fabricating a power semiconductor package including vertically stacked driver IC
In one implementation, a semiconductor package includes a control conductive carrier having a die side and an opposite input/output (I/O) side connecting the...
US-9,299,688 Packaged semiconductor devices and methods of packaging semiconductor devices
Packaged semiconductor devices and methods of packaging semiconductor devices are disclosed. In some embodiments, a method of packaging a semiconductor device...
US-9,299,682 Packaging methods for semiconductor devices
Methods of packaging semiconductor devices are disclosed. In one embodiment, a packaging method for semiconductor devices includes providing a workpiece...
US-9,299,651 Semiconductor assembly and method of manufacturing the same
A method of making a semiconductor assembly is characterized by the step of attaching a chip-on-interposer subassembly on a base carrier with the chip inserted...
US-9,299,615 Multiple V.sub.T in III-V FETs
In one aspect, a method of forming a multiple V.sub.T device structure includes the steps of: forming an alternating series of channel and barrier layers as a...
US-9,299,614 Method and carrier for dicing a wafer
Methods of and carriers for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a carrier for...
US-9,299,601 SOI RF device and method for forming the same
A SOI RF device and a method for forming the same are provided. A trench exposed a part of the high resistivity silicon base is formed in the SOI substrate; a...
US-9,299,600 Method for repairing an oxide layer and method for manufacturing a semiconductor structure applying the same
A method for repairing an oxide layer and a method for manufacturing a semiconductor structure applying the same are provided. The method for repairing an oxide...
US-9,299,594 Substrate bonding system and method of modifying the same
The embodiments described provide apparatus and methods for bonding wafers to carriers with the surface contours of plates facing the substrates or carriers are...
US-9,299,592 Package structure and packaging method of wafer level chip scale package
A package structure and a packaging method of wafer level chip scale package are provided. The packaging method includes: providing a carrier, and disposing a...
US-9,298,533 Portable data carrier having operating error counter
In a method in a portable data carrier for securing the data carrier against external attacks on the data carrier, there is employed at least one counter in the...
US-9,298,119 Carrier for two-component developer, two-component developer using the carrier, and image forming method and...
A carrier is provided. The carrier includes a particulate magnetic core, and a cover layer located on the surface of the particulate magnetic core and including...
US-9,298,111 Optical arrangement in a projection exposure apparatus for EUV lithography
An optical arrangement includes a multiplicity of optical elements and a carrier structure which carries the optical elements. The carrier structure is composed...
US-9,298,108 Position measurement method, position control method, measurement method, loading method, exposure method and...
An exposure method and apparatus exposes a substrate that is loaded on a stage via a carrier system, with an exposure beam via a projection optical system and a...
US-9,297,941 Optically variable element, in particular security element
An optically variable element, in particular a security element, has a transparent carrier layer, an at least partly transparent reflective layer formed on the...
US-9,297,904 Systems and methods for monitoring broadband radio frequency interference
Systems and methods for monitoring broadband radio frequency interference are provided. In certain embodiments, a method comprises calculating a smoothed...
US-9,297,884 Systems and methods of frequency estimation for geolocation
A method includes computing a cross-spectral surface of a signal. The method further includes determining initial frequency estimates to be points on the...
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