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THERMAL CONDUCTING STRUCTURE APPLIED TO NETWORK CONTROL AUTOMATION SYSTEM
Abstract
The present disclosure provides a thermal conducting structure applied to
a network control automation system and including a circuit module and a
heat dissipation structure. The circuit module defines bare copper
regions disposed at two opposite side ends thereof, and copper foil
layers are disposed on the bare copper regions. The heat dissipation
structure disposed at two opposite lateral sides thereof, and each of the
side panels defines a track member formed between the outer shell member
and the two side panels thereof. The copper foil layers can be mounted
along the sliding edges, and the outer shell member is then pushed to the
circuit board, so that the circuit board is positioned in a chamber. Heat
generated by the heat source can be conducted through the copper foil
layers, to increase entire heat dissipation area and further improve the
heat dissipation efficiency of overall thermal conducting structure.
1. A thermal conducting structure applied to a network control automation
system, comprising a circuit module and a heat dissipation structure,
said circuit module comprising a circuit board and at least one heat
source disposed on said circuit board, and said circuit board defining
bare copper regions disposed at two opposite side ends thereof, and
copper foil layers disposed on said bare copper regions and configured
for conducting heat generated during operation of said at least one heat
source; said heat dissipation structure comprising an outer shell member
which has opposite side panels respectively disposed at two opposite
lateral sides thereof, and each of said side panels defining a track
member which has a sliding edge to cover said copper foil layer for
forming thermal conducting path, an accommodation open chamber formed
between said outer shell member and side panels thereof to receive and
position said circuit board therein.
2. The thermal conducting structure as claimed in claim 1, wherein said
heat generated during operation of said at least one heat source of said
circuit module is conducted to said copper foil layers via said circuit
board through said thermal conducting path, and said at least one heat
source can be a FPGA chip, a CPU, a chip set or an image processor.
3. The thermal conducting structure as claimed in claim 1, wherein said
circuit board of said circuit module comprises a plurality of ports and a
panel disposed at a front part thereof, said panel defines a plurality of
hollow parts cut therethrough to mount and expose said plurality of
ports, and each of said ports can be a power connector or network
connector, so that said circuit module can be a network interface card
matching with Ethernet-network-based fieldbus technology.
4. The thermal conducting structure as claimed in claim 1, wherein said
circuit board of said circuit module comprises a plurality of fastening
parts located thereon and around said heat source, and said fastening
parts are combined with a heat conducting module which comprises a base
plate configured to respectively contact said heat source and said outer
shell member of said heat dissipation structure for forming thermal
conducting paths.
5. The thermal conducting structure as claimed in claim 4, wherein each
of said fastening parts of said circuit board has a bolt, and said base
plate of said heat conducting module defines a plurality of first punches
cut therethrough and corresponding to said fastening parts, and
positioning elements are respectively inserted into said first punches
for screwing into said bolts, so as to combine said circuit board and
said heat conducting module integrally.
6. The thermal conducting structure as claimed in claim 4, wherein a side
end of said base plate of said heat conducting module is bent and
extended towards said circuit board to form at least one smooth-shaped
first contact plate which is used to abut with a surface of said heat
source, and said first contact plate is then bent and outwardly extended
to form a bent part, and said bent part is then bent and reversely
extended in parallel with said first contact plate to form a
smooth-shaped second contact plate which is used to abut with said outer
shell member of said heat dissipation structure.
7. The thermal conducting structure as claimed in claim 6, wherein a
thermal medium is disposed on said first contact plate of said base plate
of said heat conducting module and configured to elastically attach with
a surface of said heat source.
8. The thermal conducting structure as claimed in claim 6, wherein a
thermal medium is disposed on said second contact plate of said base
plate of said heat conducting module and configured to elastically attach
with a surface of said heat source.
9. The thermal conducting structure as claimed in claim 1, wherein said
track member of said heat dissipation structure comprises a sliding edge
which is formed by being outwardly extended first and then bent inwardly,
and said sliding edge defines a sliding slot extended along a horizontal
direction, and said copper foil layers of said circuit module are
slidably mounted into and abutted with said sliding slot.
10. The thermal conducting structure as claimed in claim 9, wherein said
copper foil layers of said circuit module define a plurality of mounting
holes cut therethrough and respectively located at corners of said
circuit board, each of said sliding edges of said track members of said
heat dissipation structure defines lugs located at said openings of front
and rear ends of said sliding slot respectively and outwardly extended,
each of said lugs has a second punch, and fixing elements are
respectively penetrated through said mounting holes and said second
punches respectively, so as to combine said circuit module and said heat
dissipation structure integrally.
Description
BACKGROUND OF THE INVENTION
[0001] 1. Field of the Invention
[0002] The present disclosure relates to a thermal conducting structure
applied to a network control automation system, more particularly to a
thermal conducting structure capable of dissipating heat generated during
operation of the heat source of the circuit module through copper foil
layers located at two opposite side ends of the circuit board and the
sliding edges of the track members at two side panels of the outer shell
member of the heat dissipation structure, so as to improve overall heat
dissipation efficiency.
[0003] 2. Description of the Related Art
[0004] With the rapid development of electronic technology, computers,
laptops and other computer equipment are ubiquitous in every corner of
society, and their development trend towards high computing power, fast
speed and small size. However, with open framework of the computer
equipment, standardization of software and hardware and continuous
expansion and upgrading in functions, manufacturers start to develop
industrial computers used in different professional fields including
applications of industrial control, industrial automation, network and
communication equipment, machine vision, intelligent transport system,
and so on. Moreover, the industrial computers also can be used in
military, transportation, aerospace field or other industrial
applications which are required for high reliability and stability,
thereby satisfying customer's requirements for particular specification
and various high-efficiency operations in the severe environment.
[0005] Further, because the information industry progresses continually
and network communication technology boosts, a new generation industrial
automation equipment based on an instant communication interface develops
quickly and vigorously. A servo control technology used by traditional
automation equipment and machine platform has some problems, such as poor
multi-shaft synchronous and instant performance, insufficient resolution,
restriction due to numerous wires, noise interference, and so on.
Therefore, serial servo control technologies which can utilize the
instant communication system to transfer digital signals and control
parameters via network media and be applied for various transfer
communication protocols used by industrial automatic control systems, are
provided in recent years. For example, the EtherCAT is a new open-ended
technology, a fieldbus technology based on Ethernet network architecture,
and also a distributed I/O system having high performance. The EtherCAT
technology has advantages in easy wiring, cost saving, anti-interference
and remote control, and also has potential in developing a motion control
technology having higher speed and high precision, so that the EtherCAT
and the motion control technology can be integrated as a distributed
control servo drive system to replace a large single control system.
However, because of development trend of the industrial automatic control
system towards smaller size and higher speed, a temperature of the FPGA
chip, the CPU, the chipset, the image processor or other heat source on a
circuit board will also be greatly raised. Therefore, an important issue
for stabilization of industrial automatic control system is how to ensure
that the system can be operated normally at a permissive temperature and
its overall heat dissipation efficiency can be improved. The important
issue has been regarded as a problem to be solved effectively by people
who engage in this industry.
SUMMARY OF THE INVENTION
[0006] The present invention has been accomplished under the circumstances
in view. It is therefore the main object of the present invention to
provide a thermal conducting structure including a circuit module and a
heat dissipation structure. A circuit board of the circuit module has at
least one heat source, and the circuit board defines bare copper regions
disposed at two opposite side ends thereof, and copper foil layers are
disposed on the bare copper regions. The heat dissipation structure
includes an outer shell member which has two side panels at two opposite
lateral sides thereof, and each of the two side panels defines a track
member having a sliding edge. The copper foil layers of the circuit board
can be slidably mounted along the sliding edges of the track members, and
the outer shell member is further pushed to move inwardly relative to the
circuit board, so that the circuit board can be received and positioned
in the accommodation open chamber. The sliding edges can completely cover
the copper foil layers of the circuit board to form thermal conducting
path to conduct heat, heat generated by the heat source of the circuit
board in operation can be conduct to the heat dissipation structure
through the copper foil layers, so that the entire heat dissipation area
can be increased and the entire heat dissipation efficiency of the
thermal conducting structure of the present disclosure can further be
improved.
[0007] According to an aspect of the present disclosure, the circuit board
of the circuit module has a plurality of fastening parts disposed thereon
and around the heat source, and the fastening parts are combined with a
heat conducting module, and thermal mediums are further disposed on the
heat conducting module for respectively elastically attaching with the
heat source and the outer shell member of the heat dissipation structure
to form thermal conducting path. During operation of the heat source of
the circuit board, a portion of the heat generated by the heat source can
be directly conducted to the outer shell member of the heat dissipation
structure through the thermal medium and the heat conducting module, and
the rest of the generated heat can be conducted to the copper foil layers
through the circuit board and then conducted to the sliding edges of the
track members of the heat dissipation structure to form thermal
conducting path, whereby the heat conducting module cooperating with the
heat dissipation structure can efficiently increase entire heat
dissipation area to improve the heat dissipation efficiency for the heat
source and keep the system to operate normally.
[0008] According to other aspect of the present disclosure, while the
copper foil layers of the circuit board of the circuit module is slidably
mounted along the sliding edges of the outer shell member of the heat
dissipation structure, the copper foil layers can be slid more smoothly
because of self-lubrication of the copper material, so as to prevent the
insulation coating layer coated on the circuit board from being scraped
or damaged improperly, and the entire usage function and effect of the
heat dissipation structure of the present disclosure can further be
improved.
[0009] According to other aspect of the present disclosure, the outer
shell member of the heat dissipation structure can be used to cover the
heat source and other electronic components of the circuit board of the
circuit module for protection, and further prevent the multiple sets of
the circuit modules from being damaged or broken because of being
impacted with each other. Therefore, the thermal conducting structure of
the present disclosure can have nice practicability.
BRIEF DESCRIPTION OF THE DRAWINGS
[0010] The detailed structure, operating principle and effects of the
present disclosure will now be described in more details hereinafter with
reference to the accompanying drawings that show various embodiments of
the present disclosure as follows.
[0011] FIG. 1 is an elevational view of a thermal conducting structure of
the present disclosure.
[0012] FIG. 2 is an exploded view of the thermal conducting structure of
the present disclosure.
[0013] FIG. 3 is an exploded view of a circuit board and a heat conducting
module of the circuit module of the present disclosure before assembly.
[0014] FIG. 4 is an elevational view of the circuit board and the heat
conducting module of the present disclosure during assembly.
[0015] FIG. 5 is an elevational view of the circuit board and the heat
conducting module of the present disclosure after assembly.
[0016] FIG. 6 is a sectional view of the circuit module and the heat
dissipation structure of the present disclosure after assembly.
[0017] FIG. 7 is an elevational view of preferred embodiment of the
present disclosure, illustrating the circuit module being inserting into
a cooler bracket.
[0018] FIG. 8 is an elevational view of preferred embodiment of the
present disclosure, illustrating the circuit module being inserted into
the cooler bracket already.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Reference will now be made in detail to the exemplary embodiments
of the present disclosure, examples of which are illustrated in the
accompanying drawings. Therefore, it is to be understood that the
foregoing is illustrative of exemplary embodiments and is not to be
construed as limited to the specific embodiments disclosed, and that
modifications to the disclosed exemplary embodiments, as well as other
exemplary embodiments, are intended to be included within the scope of
the appended claims. These embodiments are provided so that this
disclosure will be thorough and complete, and will fully convey the
inventive concept to those skilled in the art. The relative proportions
and ratios of elements in the drawings may be exaggerated or diminished
in size for the sake of clarity and convenience in the drawings, and such
arbitrary proportions are only illustrative and not limiting in any way.
The same reference numbers are used in the drawings and the description
to refer to the same or like parts.
[0020] It will be understood that, although the terms `first`, `second`,
`third`, etc., may be used herein to describe various elements, these
elements should not be limited by these terms. The terms are used only
for the purpose of distinguishing one component from another component.
Thus, a first element discussed below could be termed a second element
without departing from the teachings of embodiments. As used herein, the
term "or" includes any and all combinations of one or more of the
associated listed items.
[0021] Please refer to FIG. 1 through FIG. 3 which show elevational view
and exploded view of the thermal conducting structure of the present
disclosure, and an exploded view of a circuit board of a circuit module
and a heat conducting module of the present disclosure before assembly.
As shown in FIG. 1 through FIG. 3, the thermal conducting structure of
the present disclosure includes a circuit module 1 and a heat dissipation
structure 2. Main members and features of the present disclosure are
described blow.
[0022] The circuit module 1 includes a multiple-layered circuit board 11,
and at least one heat source 111 is disposed on one or two side surfaces
of the circuit board 11. Preferably, the heat source 111 can be a FPGA
chip; alternatively, in actual applications, the heat source 111 can be a
CPU, chip set (such as ICH, RAM and so on), or an image processor (such
as GMCH). The circuit board 11 defines bare copper regions 110 at top and
bottom side ends thereof, and is provided with copper foil layers 12
respectively disposed along a horizontal direction on the bare copper
regions 110 of the top and bottom side ends of the circuit board 11. The
copper foil layers 12 and multiple metal interlayers (not shown in FIGs)
inside the circuit board 11 form thermal conducting path to facilitate
the heat generated during operation of the heat source 111 to be
conducted to the copper foil layers 12 through the circuit board 11. The
circuit board 11 further defines a plurality of mounting holes 121 cut
through the copper foil layers 12 at corners thereof.
[0023] Further, the circuit board 11 has plurality of ports 112 at a front
part thereof. The port 112 can be a power connector, a network connector
(such as RJ45) or other connector matching with other transmission
interface specification. The circuit board 11 includes an insertion part
113 (such as a plurality of metal contacts) disposed along a vertical
direction at a rear end thereof and a panel 13 disposed at the front part
thereof. The panel 13 defines a plurality of hollow parts 131 cut
therethrough to expose the ports 112. The panel 13 includes two manual
screws 132 disposed at top and bottom sides thereof, so that the circuit
board 11 can be constructed as a network interface card or a serial
transmission card matching with the Ethernet-network-based fieldbus
technology or other communication protocol.
[0024] The circuit board 11 further has a plurality of fastening parts 114
located on a surface thereof and around the heat source 111. Each of the
fastening parts 114 has a bolt 1141. The fastening parts 114 are used to
combine with a heat conducting module 14 which has a smooth-shaped base
plate 141. A side surface of the base plate 141 is bent towards the
circuit board 11 and extended to form at least one a smooth-shaped first
contact plate 1411 configured for being abutted with and positioned on a
surface of the heat source 111, and the first contact plate 1411 is
further bent outwardly to extend cross the base plate 141 to form a bent
part 1412 at other side surface of the base plate 141, and the bent part
1412 is further bent and reversely extended in parallel with the first
contact plate 1411 to form a smooth-shaped second contact plate 1413.
Thermal mediums (such as elastic thermal pads, thermal paste, and so on)
are respectively disposed on the first contact plate 1411 and the second
contact plate 1413, so that the first contact plate 1411 and the second
contact plate 1413 can be elastically attached on the surface of the heat
source 111. The heat conducting module 14 defines a plurality of first
punches 143 cut therethrough and corresponding to the fastening parts 114
of the circuit board 11, and positioning elements 144 having screws 1441
are respectively disposed in the first punches 143. Each of the screws
1441 is penetrated through the first punch 143 and then screwed into the
bolts 1141 of the fastening parts 114, so as to combine the heat
conducting module 14 and the circuit board 11 integrally.
[0025] The heat dissipation structure 2 includes an outer shell member 21
which defines two opposite side panels 211 at up and bottom sides
thereof. Each of the side panels 211 defines a sliding edge 221 of a
track member 22. Each sliding edge 221 is formed by being extended
outwardly first and then bent inwardly. Each sliding edge 221 defines a
sliding slot 222 extended along a horizontal direction therein. An
accommodation open chamber 20 through front-to-rear is formed between the
outer shell member 21 and the side panels 211. The sliding edge 221
further defines lugs 223 respectively located at front and rear openings
of the sliding slots 222 and extended outwardly, and each lug 223 has a
second punch 224. A nut 2252 is disposed in the second punch 224 and can
be inserted by and locked with a screw 2251 of a fixing element 225.
Alternatively, the nuts 2252 can be directly welded and fastened on the
copper foil layers 12, and aligned with the mounting holes 121 at the
corners of the circuit board 11, to facilitate the screws 2251 to be
locked into the nut 2252 respectively. Each of the two side panels 211 of
the outer shell member 21 further defines at least one elastic convex
part 23 having a spring clip 231, and the spring clip 231 has an arch
structure or a hanging-arm structure.
[0026] The heat conducting module 14 of the circuit module 1 can be made
of aluminum material by utilizing process of mechanically punching press
or bending. In a preferred implementation, the heat dissipation structure
2 is made of copper, iron or steel material integrally, and structures of
the outer shell member 21 and the track members 22 thereof are shaped by
process of mechanically punching press and bending. Alternatively, in
actual application, the heat dissipation structure 2 can be made of
aluminum material integrally, and the outer shell member 21 can be a
frame panel, or the outer shell member 21 has a plurality of standing
fins located on the surface thereof and formed by the aluminum extrusion
process to increase surface areas for heat dissipation. There are various
manners for shaping and forming the heat conducting module 14 and the
outer shell member 21 of the heat dissipation structure 2, so their
designs can be changed according to the actual application.
[0027] Please refer to FIG. 4 through FIG. 6 which show elevational view
of the circuit module and the heat dissipation structure during assembly,
and elevational view and sectional view of the circuit module and the
heat dissipation structure after assembly, respectively. As shown in FIG.
4 through FIG. 6, during assembly of the circuit module 1 and the heat
dissipation structure 2 of the present disclosure, the sliding edges 221
of the track members 22 of top and bottom sides of the outer shell member
21 are used to respectively cover the copper foil layers 12 of the
circuit board 11 corresponding thereto, and the copper foil layers 12 of
the circuit board 11 are slidably mounted along the sliding slots 222 of
the sliding edge 221, and the outer shell member 21 is then pushed to
move inwardly relative to the circuit board 11, so as to receive and
position the circuit board 11 in the accommodation open chamber 20. After
second punches 224 of lugs 223 are aligned with the mounting holes 121 of
the copper foil layer 12 respectively, the screws 2251 of the fixing
elements 225 are penetrated through the second punches 224 and the
mounting holes 121 and screwed into the nuts 2252, so that the outer
shell member 21 and the circuit board 11 are locked and fastened
integrally, and the circuit board 11 can be prevented from falling out of
the outer shell member 21 to ensure stable combination between the outer
shell member 21 and the circuit board 11. The copper foil layers 12 are
respectively abutted with the inner sidewalls of the sliding edges 221 of
the track members 22 to form the thermal conducting path and, at the same
time, the second contact plate 1413 of the base plate 141 of the heat
conducting module 14 is tightly and elastically attached with an inner
sidewall of the accommodation open chamber 20 of the outer shell member
21 through the thermal medium 142 to form other thermal conducting path.
Thereafter, the panel 13 is also combined at the front part of the
circuit board 11 by above described manner of screw locking, and the
panel 13 and the circuit board 11 are arranged with right angle. The
ports 112 of the circuit board 11 are respectively inserted into the
hollow parts 131 and exposed to the outside. In addition, other side
surface of the circuit board 11 opposite to the outer shell member 21 can
be combined with other metal shell member (not shown in FIGs) by the
manner of screw locking.
[0028] Further, the copper foil layers 12 are respectively disposed at
bare copper regions 110 on two opposite side ends of the circuit board 11
of the circuit module 1, when the copper foil layer 12 on the circuit
board 11 is slidably mounted along the sliding edges 221 of the outer
shell member 21, the copper foil layers 12 can be easily and smoothly
slid because of self-lubrication of the copper material, so as to prevent
the insulation coating layer coated on the circuit board 11 from being
scraped or damaged improperly to impact the original capabilities of
moisture-proof, dirt-proof, dust-proof, chemical-resistance and so on.
Therefore, the overall functions and effects of the heat dissipation
structure 2 can be improved.
[0029] A portion of heat generated by the heat source 111 of the circuit
module circuit module during operation can be first directly conducted to
the first contact plate 1411 of the base plate 141 of the heat conducting
module 14 through the thermal medium 142, and then conducted to the outer
shell member 21 of the heat dissipation structure 2 by the second contact
plate 1413 through the thermal medium 142, to form the thermal conducting
path. The rest of heat generated during operation of the heat source 111
can be conducted to copper foil layers 12 at two opposite side ends of
the circuit board 11 through the metal interlayers inside the circuit
board 11, and then conducted to the sliding edges 221 of the track member
22 of the heat dissipation structure 2 to form the thermal conducting
path. The design that the bent structures of the sliding edges 221
completely cover the copper foil layers 12 can facilitate to conduct heat
and increase entire heat dissipation area, so the accumulated heat of the
heat source 111 of the circuit board 11 can be conducted to the heat
dissipation structure 2 for heat dissipation, and overall heat
dissipation efficiency of the thermal conducting structure of the present
disclosure can be improved.
[0030] Please refer to FIG. 7 and FIG. 8 which respectively show an
elevational view before the circuit module 1 is inserted into the cooler
bracket 3, and a sectional view after the circuit module 1 is inserted
into the cooler bracket 3 already. As shown in FIGs, the circuit module 1
of the present disclosure cooperating with the heat dissipation structure
2 can be assembled with a shell member of the network control automation
system or the cooler bracket 3. The cooler bracket 3 has a main body 31
in chassis shape. The main body 31 defines a docking chamber 30 with an
opening 301 at the front end thereof, and has a plurality of thread holes
311 arranged in intervals at top and bottom sides around the opening 301.
The main body 31 defines a plurality of mounting part 32 which are
located in intervals at top and bottom sidewall of the docking chamber 30
and backwardly extended from the opening 301 along a horizontal
direction. Each of the mounting parts 32 has a track slot 321, and a
protruding stop block 322 is disposed at the bottom sidewall of the
docking chamber 30 between two adjacent track slots 321. A wire board 33
is disposed at the rear of the docking chamber 30 of the main body 31,
and at least one connection element (such as a socket) 331 is disposed on
the wire board 33.
[0031] When the circuit module 1 cooperating with the heat dissipation
structure 2 are assembled into the cooler bracket 3, the sliding edges
221 of the track members 22 at top and bottom sides of the outer shell
member 21 are respectively slidably mounted along the track slots 321 of
the mounting part 32 corresponding thereto first, and the spring clips
231 of the elastic convex parts 23 are respectively abutted with the stop
blocks 322, and the spring clip 231 generates inward elastic deformation
subject to the pushing force of the stop block 322. After the outer shell
member 21 is inserted into and fastened in the cooler bracket 3, an about
0.1 mm of predetermined constraint value is formed between the spring
clip 231 of the elastic convex part 23 and the stop block 322;
alternatively, the top surfaces of the spring clips 231 can be directly
abutted with the inner sidewalls of the docking chamber 30 of the main
body 31. In shaping process for the main body 31 of the cooler bracket 3,
in order to separate the workpiece from the mold more easily, a certain
allowance (such as a draft angle) is often reserved between the workpiece
and a die parting face of the mold, so the elastic convex parts 23
abutted with the track members 22 of the cooler bracket 3 can form tight
contacts to facilitate heat conduction. Therefore, the multiple sets of
the circuit modules 1 cooperating with the heat dissipation structures 2
can be sequentially inserted into the docking chamber 30 of the cooler
bracket 3 by above described assembly manner to be arranged in parallel,
and the insertion part 113 of the circuit board 11 are matedly connected
to the corresponding connection element 331 of the wire board 33
electrically and, in the meantime, the top and bottom sides of each of
the panels 13 are abutted with the peripheral surface of the opening 301
of the main body 31, the manual screw 132 can be screwed into the thread
hole 311 of the main body 31 to be fastened with the main body 31
integrally, so as to prevent the circuit module 1 and the heat
dissipation structure 2 from falling out of the cooler bracket 3 to be
damaged while the cooler bracket 3 is impacted by an external force.
[0032] The heat generated by the heat source 111 of the circuit module 1
in operation can be conducted to the copper foil layers 12 via the metal
interlayers inside the circuit board 11, and the heat of the copper foil
layers 12 is then conducted to the mounting part 32 of the cooler bracket
3 through the sliding edges 221 and the elastic convex parts 23 of the
track members 22 of the heat dissipation structure 2, so as to form the
thermal conducting path. Therefore, the heat dissipation structure 2
cooperating with the cooler bracket 3 can further increase entire heat
dissipation area, and the accumulated heat of the heat source 111 of the
circuit board 11 can be conducted to the heat dissipation structure 2 and
the cooler bracket 3 for heat dissipation. According to the thermal test,
the 20.degree. C. of heat can be conducted and a nice heat dissipation
effect can be provided. The amount of heat of the circuit module 1 to be
conducted by the heat dissipation structure 2 cooperating with the cooler
bracket 3 primarily depends on the type of material, to improve the heat
dissipation efficiency for the heat source 111 and maintain normal
operation of the system.
[0033] When the circuit module 1 cooperating with the heat dissipation
structure 2 are assembled into the docking chamber 30 of the cooler
bracket 3, the copper foil layers 12 of the circuit board 11 are
respectively covered by the bent structures of the sliding edges 221 of
the track members 22, so that the structural strength of the circuit
board 11 can be enhanced and the circuit module 1 can be protected from
being deformed or damaged in structure thereof during the repeated
plugging connection. By such a way that the sliding edge 221 of the track
member 22 is in cooperation with the corresponding mounting part 32 of
the cooler bracket 3 to be guided and constrained, the circuit module 1
can be assembled in the docking chamber 30 of the cooler bracket 3
stably. By means of covering the heat source 111 and other electronic
components of the circuit board 11, the heat dissipation structure 2 can
protect all heat sources 111 and electronic components on the circuit
board 11. It is hard to limit the strength and direction of user's force
during the plugging connection of the circuit module 1, so the heat
dissipation structure 2 can be used to prevent multiple sets of circuit
modules 1 from being damaged or broken because of being impacted with
each other. Therefore, the present disclosure has nice practicability.
[0034] The above-mentioned descriptions represent merely the exemplary
embodiment of the present disclosure, without any intention to limit the
scope of the present disclosure thereto. Various equivalent changes,
alternations or modifications based on the claims of present disclosure
are all consequently viewed as being embraced by the scope of the present
disclosure.