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United States Patent Application 20170099744
Kind Code A1
CHANG; SHAO-HAN April 6, 2017

METHOD FOR MAKING MULTI-PART FRAME

Abstract

A method for making a multi-part frame for a device, to render different parts of the frame available for electronic and other functions of the device, includes providing a plurality of conductive frames, and making each of the conductive frames with a predetermined shape. Each sheet of a plurality of conductive sheets can be coupled to a conductive frame. The conductive frames so coupled are placed in an injection mold and a predetermined gap maintained between conductive frames. The gap between conductive frames can be filled with insulating material to form an insulated frame, the insulated frame partially covering the plurality of conductive sheets.


Inventors: CHANG; SHAO-HAN; (New Taipei, TW)
Applicant:
Name City State Country Type

HON HAI PRECISION INDUSTRY CO., LTD.

New Taipei

TW
Family ID: 1000002358899
Appl. No.: 15/379720
Filed: December 15, 2016


Related U.S. Patent Documents

Application NumberFiling DatePatent Number
14567629Dec 11, 20149578145
15379720

Current U.S. Class: 1/1
Current CPC Class: H05K 7/18 20130101; B29C 45/14008 20130101; B29C 45/14639 20130101; B29L 2031/3425 20130101; B29K 2995/0005 20130101; B29K 2995/0007 20130101; B29K 2105/20 20130101
International Class: H05K 7/18 20060101 H05K007/18; B29C 45/14 20060101 B29C045/14

Foreign Application Data

DateCodeApplication Number
Oct 22, 2014CN201410565496.7

Claims



1. A method for making a frame, the method comprising: providing a plurality of conductive frames, and each of the conductive frames has a predetermined shape; providing a plurality of conductive sheets, and coupling each of the plurality of conductive sheets to one of the plurality of conductive frames; wherein each of the plurality of conductive sheets is electrically connected to different conductive frames; placing the plurality of conductive frames in an injection mold and keeping a predetermined gap between each two conductive frames of the plurality of conductive frames; and filling a gap between each two conductive frames with insulating material to form an insulating frame; wherein the insulating frame partially covers the plurality of conductive sheets.

2. The method as claimed in claim 1, wherein the insulating frame comprises a support portion extending from the insulating frame.

3. The method as claimed in claim 1, wherein each conductive frame comprises a main body and an extending portion extending from the main body.

4. The method as claimed in claim 1, wherein each conductive sheet electrically connects to an inside surface of the main body, and the insulating frame fills in a semi-closed space surrounded by the main body and the extending portion.

5. The method as claimed in claim 1, wherein the insulating frame comprises a support portion and a through hole, the support portion extends from the insulating frame, and the through hole is defined in the support portion.

6. The method as claimed in claim 1, wherein one end of each conductive sheet electrically connects to an inside surface of each conductive frame, and the other end of each conductive sheet extends toward an inner side of the frame.

7. The method as claimed in claim 1, wherein the frame comprises a first conductive frame, a second conductive frame, and a third conductive frame; and wherein the second conductive frame is arranged between the first conductive frame and the third conductive frame.

8. The method as claimed in claim 7, wherein the first conductive frame comprises a first main body and a first extending portion extending from the first main body; the third conductive frame comprises a third main body and a third extending portion extending from the third main body; and the first extending portion and the third extending portion are arranged to extend along a same direction.

9. The method as claimed in claim 8, wherein the frame further comprises a first conductive sheet electrically connected to the inside surface of the first main body, a second conductive sheet electrically connected to the inside surface of the second conductive frame and a third conductive sheet electrically connected to the inside surface of the third extending portion.

10. The method as claimed in claim 9, wherein the insulating frame extends to partially cover the first conductive sheet, the second conductive sheet, and the third conductive sheet
Description



CROSS-REFERENCE TO RELATED APPLICATION

[0001] The present application is a divisional application of U.S. patent application Ser. No. 14/567,629, filed on Dec. 11, 2014, which claims priority to Chinese Application No. 201410565496.7 filed on Oct. 22, 2014, the contents of which are entirely incorporated by reference herein.

FIELD

[0002] The subject matter herein generally relates to electrically insulated structures.

BACKGROUND

[0003] A frame of an electronic device may be utilized by inner circuitry, such as for an antenna of the electronic device. In order to make the frame meet different needs of the circuit, the frame needs to made of segments. Some metal segments are coupled together, and plastic is injected between the metal segments to create the complete frame.

BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Implementations of the present technology will now be described, by way of example only, with reference to the attached figures.

[0005] FIG. 1 is a diagrammatic view of an embodiment of a multi-part frame.

[0006] FIG. 2 is a side view of the frame of FIG. 1.

[0007] FIG. 3 is a cross-sectional view of the frame of FIG. 1 taken along a line

[0008] FIG. 4 is a cross-sectional view of the frame of FIG. 1 taken along a line IV-IV.

[0009] FIG. 5 is a cross-sectional view of another embodiment of a multi-part frame.

[0010] FIG. 6 is a flow chart of a process for a method for making the multi-part frame.

DETAILED DESCRIPTION

[0011] It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.

[0012] Several definitions that apply throughout this disclosure will now be presented.

[0013] The term "coupled" is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term "inside" indicates that at least a portion of a region is partially contained within a boundary formed by the object. The term "substantially" is defined to be essentially conforming to the particular dimension, shape, or other feature that the term modifies, such that the component need not be exact. For example, "substantially cylindrical" means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term "comprising" when utilized, means "including, but not necessarily limited to"; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.

[0014] FIG. 1 illustrates an embodiment of a frame 100 which is configured both to protect the internal electronic components and to function as part of an electronic device. The frame 100 can include a first conductive sheet 111, a second conductive sheet 121, and a support portion 131. The first conductive sheet 111 and the second conductive sheet 121 can be electrically connected to different places of an inside surface of the frame 100, and the support portion 131 can extend from the inside surface of the frame 100. The first conductive sheet 111 and the second conductive sheet 121 can be conductive materials and can be coupled to the inside surface of the frame 100 by soldering. In another embodiment, the first conductive sheet 111 and the second conductive sheet 121 can be integrated with the inside surface of the frame 100. The first conductive sheet 111 and the second conductive sheet 121 can be configured as an electrical connection between the frame 100 and inner circuitry of the electronic device. The support portion 131 can be configured to support internal electronic components.

[0015] FIG. 2 illustrates that the frame 100 can include a first conductive frame 110, a second conductive frame 120, and an insulating frame 130. The first conductive frame 110 and the second conductive frame 120 can be made of conductive materials and be annular structures. A predetermined gap can be formed between the first conductive frame 110 and the second conductive frame 120. The insulating frame 130 can be made of insulating materials and be of annular structures. The insulating frame 130 can be sandwiched between the first conductive frame 110 and the second conductive frame 120. The insulating frame 130 can be coupled to the first conductive frame 110 and the second conductive frame 120 throughout the entire annular surface to increase contact surface area and enhance the strength of the connection.

[0016] FIG. 3 illustrates that the first conductive frame 110 can include a first main body 112 and a first extending portion 113 extending inward from the first main body 112. The first main body 112 and the first extending portion 113 can form a substantially "L"-shaped semi-closed space to receive the insulating frame 130. The first extending portion 113 can increase the contact area between the insulating frame 130 and the first conductive frame 110 to enhance the structural strength of the insulating frame 130 and the first conductive frame 110. The second conductive frame 120 can include a second main body 122 and a second extending portion 123 extending inwardly from the second main body 122. The second main body 122 and the second extending portion 123 can form a substantially "L"-shaped semi-closed space to receive the insulating frame 130. The second extending portion 123 can increase the contact area between the insulating frame 130 and the second conductive frame 120 to enhance the structural strength of the insulating frame 130 and the second conductive frame 120. That is, a part of the insulating frame 130 can be sandwiched between the first main body 112 of the first conductive frame 110 and the second main body 122 of the second conductive frame 120. An extended part of the insulating frame 130 can be located between the first extending portion 113 of the first conductive frame 110 and the second extending portion 123 of the second conductive frame 120. The insulating frame 130 can include a support portion 131 extending from an inner surface thereof and a through hole 132 defined on the support portion 131. The support portion 131 can locate and support the internal electronic components, and the through hole 132 can be coupled to a fastener configured to tighten the internal electronic components.

[0017] FIG. 4 illustrates that the first conductive sheet 111 and the second conductive sheet 121 can be substantially "L"-shaped. One end of the first conductive sheet 111 and one end of the second conductive sheet 121 can be respectively coupled to different locations of the first main body 112 and the second main body 122, and the other end of the first conductive sheet 111 and of the second conductive sheet 121 can be extended inside the frame 100. In another embodiment, the first conductive sheet 111 and the second conductive sheet 121 can be substantially triangular, or rectangular, or other shapes. The insulating frame 130 can extend to partially cover the first conductive sheet 111 and the second conductive sheet 121. The insulating frame 130 can avoid exposure of the first conductive sheet 111 and the second conductive sheet 121 inside the frame 100 and can enhance the structural and connecting strength of the first conductive frame 110 and the second conductive frame 120.

[0018] FIG. 5 illustrates another embodiment of a frame 200. The frame 200 can include a first conductive frame 210, a second conductive frame 220, and a third conductive frame 230. The insulating frame 240 can be arranged between the first conductive frame 210, the second conductive frame 220, and the third conductive frame 230. A first conductive sheet 211, a second conductive sheet 221, and a third conductive sheet 231 can be electrically connected to different locations of the inside surface of the first conductive frame 210, the second conductive frame 220, and the third conductive frame 230. The insulating frame 240 can extend to partially cover the first conductive sheet 211, the second conductive sheet 221, and the third conductive sheet 231. The first conductive frame 210 can include a first main body 212 and a first extending portion 213 extended from the first main body 212. The first extending portion 213 can increase the contact area between the insulating frame 240 and the first conductive frame 210. The second conductive frame 220 can include a main body only. In another embodiment, there can be a different or any number of the second conductive frames 220. The third conductive frame 230 can include a third main body 232 and a third extending portion 233 extended from the third main body 232. The third extending portion 233 can increase the contact area between the insulating frame 240 and the third conductive frame 230. The first extending portion 213 and the third extending portion 233 can be arranged to extend along a same direction. The insulating frame 240 can be arranged between the first extending portion 213 and the third extending portion 233. In another embodiment, the frame 200 can include four or more conductive frames, and an insulating frame can be arranged between any number of conductive frames.

[0019] FIG. 6 illustrates a flowchart in accordance with an example embodiment. The example method is provided by way of example, as there are a variety of ways to carry out the method. The method described below can be carried out using the configurations illustrated in FIG. 1, for example, and various elements of the figure are referenced in explaining the example method. Each block shown in FIG. 6 represents one or more processes, methods, or subroutines carried out in the example method. Additionally, the illustrated order of blocks is by example only and the order of the blocks can change. The example method can begin at block 101.

[0020] At block 101, a plurality of conductive frames can be provided, and each conductive frame can be made with a predetermined shape.

[0021] The conductive frames can be made, and each conductive frame can include a main body and an extending portion extending from the main body, or just include a simple main body.

[0022] At block 102, a plurality of conductive sheets can be provided, and each conductive sheet can be coupled to an inside surface of one of the plurality of conductive frames. Each of the plurality of conductive sheets can be electrically connected to different conductive frames.

[0023] Conductive sheets can be coupled to different places inside each conductive frame, thus the frame can electrically connected to the inside circuitry.

[0024] At block 103, each conductive frame can be placed in an injection mold and a predetermined gap can be kept between each two conductive frames.

[0025] At block 104, the gap between each two conductive frames can be filled with insulating material to form an insulating frame, and the insulating frame can partially cover the conductive sheets.

[0026] During the forming work, the molten insulating material can be filled in the gap to form the insulating frame and the insulating frame can extend to partially cover the conductive sheets. The insulating frame can also extend to form a support portion in predetermined places. The support portion can be configured to support the internal electronic components.

[0027] The embodiments shown and described above are only examples. Many details are often found in the art such as the other features of a method of manufacturing multi-part frame. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the details, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.

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