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United States Patent Application 20180127990
Kind Code A1
Mieczkowski; Marcin May 10, 2018

Subfloor Leveling Assembly

Abstract

A subfloor leveling assembly includes a leveling device, plurality of panels and an adhesive. The leveling device is configured to identify a high spot and a low spot of a subfloor. The panels are rectangularly shaped and are configured to be vertically adjustable relative to the subfloor. Top faces of the panels are coplanarly positionable. The adhesive is configured to couple the plurality of panels to the subfloor.


Inventors: Mieczkowski; Marcin; (Lawrenceville, NJ)
Applicant:
Name City State Country Type

Mieczkowski; Marcin

Lawrenceville

NJ

US
Family ID: 1000002302452
Appl. No.: 15/347187
Filed: November 9, 2016


Current U.S. Class: 1/1
Current CPC Class: E04F 21/20 20130101; E04F 2290/00 20130101; E04B 5/023 20130101
International Class: E04F 21/20 20060101 E04F021/20; E04B 5/02 20060101 E04B005/02

Claims



1. A subfloor leveling assembly comprising: a leveling device configured for identifying a high spot and a low spot of a subfloor; a plurality of panels, said panels being rectangularly shaped, said panels being configured for vertically adjusting relative to the subfloor such that top faces of said panels are coplanarly positionable; an adhesive configured for coupling said plurality of panels to the subfloor; and wherein said leveling device is configured for identifying the high spot and the low spot of a subfloor, wherein said panels are configured for vertically adjusting relative to the subfloor such that top faces of said panels are coplanarly positionable, wherein said adhesive is configured for coupling said plurality of panels to the subfloor; each said panel comprising a first layer and a second layer, said first layer being rigid, said second layer being deformable; each said panel comprising a plurality of penetrations positioned perpendicularly through said first layer; a plurality of screws configured for coupling said panel to the subfloor, each said screw being positioned through a respective said penetration; and wherein said screws are positioned through said panel such that said screws are configured to couple said panel to the subfloor, and wherein said screws are configured for compression of said second layer between said first layer and the subfloor such that said top faces of said panels are coplanarly positionable.

2. The assembly of claim 1, further including said panels being squarely shaped.

3. (canceled)

4. The assembly of claim 1, further including said first layer comprising plastic.

5. The assembly of claim 4, further including said first layer comprising polyvinyl chloride.

6. The assembly of claim 4, further including said first layer comprising polyvinyl butyrate.

7. The assembly of claim 4, further including said first layer comprising polyvinylidene chloride.

8. The assembly of claim 1, further including said second layer comprising polyurethane.

9. (canceled)

10. The assembly of claim 1, further including said plurality of penetrations comprising a first hole centrally positioned in said panel, said plurality of penetrations comprising four second holes, each said second hole being positioned between said first hole and a respective corner of said panel.

11. The assembly of claim 1, further including each said screw being positioned in said respective said penetration such that a head of said screw is positioned below said top face of said panel, such that said head does not protrude from said panel.

12. The assembly of claim 1, further including said adhesive being configured to harden said second layer such that said second layer is resistant to compression.

13. A subfloor leveling assembly comprising: a leveling device configured for identifying a high spot and a low spot of a subfloor; a plurality of panels, said panels being rectangularly shaped, said panels being configured for vertically adjusting relative to the subfloor such that top faces of said panels are coplanarly positionable, said panels being squarely shaped, each said panel comprising a first layer and a second layer, said first layer being rigid, said first layer comprising plastic, said first layer comprising polyvinyl chloride, said first layer comprising polyvinyl butyrate, said first layer comprising polyvinylidene chloride, said second layer being deformable, said second layer comprising polyurethane; each said panel comprising a plurality of penetrations positioned perpendicularly through said first layer, said plurality of penetrations comprising a first hole centrally positioned in said panel, said plurality of penetrations comprising four second holes, each said second hole being positioned between said first hole and a respective corner of said panel; each said panel comprising a plurality of screws configured for coupling said panel to the subfloor, each said screw being positioned through a respective said penetration, wherein said screws are positioned through said panel such that said screws are configured to couple said panel to the subfloor, and wherein said screws are configured for compression of said second layer between said first layer and the subfloor such that said top faces of said panels are coplanarly positionable, each said screw being positioned in said respective said penetration such that a head of said screw is positioned below said top face of said panel, such that said head does not protrude from said panel; an adhesive configured for coupling said plurality of panels to the subfloor, said adhesive being configured to harden said second layer such that said second layer is resistant to compression; and wherein said leveling device is configured for identifying the high spot and the low spot of a subfloor, wherein said screws are positioned through said panel such that said screws are configured to couple said panel to the subfloor such that said screws are configured for compression of said second layer between said first layer and the subfloor, wherein said top faces of said panels are coplanarly positionable, wherein said adhesive is configured for coupling said plurality of panels to the subfloor, and wherein said adhesive is configured to harden said second layer such that said second layer is resistant to compression.

14. A method for leveling a subfloor, the steps of the method comprising: providing a subfloor leveling assembly comprising: a leveling device, a plurality of panels, said panels being rectangularly shaped, said panels being configured for vertically adjusting relative to a subfloor such that top faces of said panels are coplanarly positionable, and an adhesive configured for coupling said plurality of panels to the subfloor; utilizing said leveling device, identifying a high spot and a low spot of the subfloor; positioning a respective said panel atop the high spot; adjusting said respective said panel such that said top face of said respective said panel is level; adhering said respective said panel to the subfloor by positioning of said adhesive between said respective said panel and the subfloor; positioning and adjusting of additional said panels adjacent to said respective said panel such that said top faces are coplanarly positioned; and coupling said additional said panels to the subfloor by positioning of said adhesive between said additional said panels and the subfloor.
Description



CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] Not Applicable

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

[0002] Not Applicable

THE NAMES OF THE PARTIES TO A JOINT RESEARCH AGREEMENT

[0003] Not Applicable

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC OR AS A TEXT FILE VIE THE OFFICE ELECTRONIC FILING SYSTEM

[0004] Not Applicable

STATEMENT REGARDING PRIOR DISCLOSURES BY THE INVENTOR OR JOINT INVENTOR

[0005] Not Applicable

BACKGROUND OF THE INVENTION

(1) Field of the Invention

(2) Description of Related Art Including Information Disclosed Under 37 CFR 1.97 and 1.98

[0006] The disclosure and prior art relates to leveling assemblies and more particularly pertains to a new leveling assembly for subfloors.

BRIEF SUMMARY OF THE INVENTION

[0007] An embodiment of the disclosure meets the needs presented above by generally comprising a leveling device, plurality of panels and an adhesive. The leveling device is configured to identify a high spot and a low spot of a subfloor. The panels are rectangularly shaped and are configured to be vertically adjustable relative to the subfloor. Top faces of the panels are coplanarly positionable. The adhesive is configured to couple the plurality of panels to the subfloor.

[0008] There has thus been outlined, rather broadly, the more important features of the disclosure in order that the detailed description thereof that follows may be better understood, and in order that the present contribution to the art may be better appreciated. There are additional features of the disclosure that will be described hereinafter and which will form the subject matter of the claims appended hereto.

[0009] The objects of the disclosure, along with the various features of novelty which characterize the disclosure, are pointed out with particularity in the claims annexed to and forming a part of this disclosure.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWING(S)

[0010] The disclosure will be better understood and objects other than those set forth above will become apparent when consideration is given to the following detailed description thereof. Such description makes reference to the annexed drawings wherein:

[0011] FIG. 1 is an isometric perspective view of a subfloor leveling assembly according to an embodiment of the disclosure.

[0012] FIG. 2 is a side view of an embodiment of the disclosure.

[0013] FIG. 3 is a bottom view of an embodiment of the disclosure.

[0014] FIG. 4 is a cross-sectional view of an embodiment of the disclosure.

[0015] FIG. 5 is an in-use view of an embodiment of the disclosure.

[0016] FIG. 6 is a detail view of an embodiment of the disclosure.

DETAILED DESCRIPTION OF THE INVENTION

[0017] With reference now to the drawings, and in particular to FIGS. 1 through 6 thereof, a new leveling assembly embodying the principles and concepts of an embodiment of the disclosure and generally designated by the reference numeral 10 will be described.

[0018] As best illustrated in FIGS. 1 through 6, the subfloor leveling assembly 10 generally comprises a leveling device 12, plurality of panels 14 and an adhesive 16. The leveling device 12 is configured to identify a high spot and a low spot of a subfloor. The panels 14 are rectangularly shaped and are configured to be vertically adjustable relative to the subfloor. In one embodiment, the panels 14 are squarely shaped. In another embodiment, the panel 14 comprises a first layer 18 and a second layer 20. The first layer 18 is rigid and the second layer 20 is deformable. In one embodiment, the first layer 18 comprises plastic. In another embodiment, the first layer 18 comprises polyvinyl chloride. In yet another embodiment, the first layer 18 comprises polyvinyl butyrate. In still yet another embodiment, the first layer 18 comprises polyvinylidene chloride. In still yet another embodiment, the second layer 20 comprises polyurethane.

[0019] Each panel 14 comprises a plurality of penetrations 22 that is positioned perpendicularly through the first layer 18. In one embodiment, the plurality of penetrations 22 comprises a first hole 24 and four second holes 26. The first hole 24 is centrally positioned in the panel. Each second hole 26 is positioned between the first hole 24 and a respective corner 28 of the panel.

[0020] Each panel 14 comprises a plurality of screws 30 that is configured to couple the panel 14 to the subfloor. Each screw 30 is positioned through a respective penetration 22. The screws 30 are positioned through the panel 14 such that the screws 30 are configured to couple the panel 14 to the subfloor. The screws 30 also are configured to compress the second layer 20 between the first layer 18 and the subfloor such that top faces 32 of the panels 14 are coplanarly positionable. In one embodiment, each screw 30 is positioned in the respective penetration 22 such that a head 34 of the screw 30 is positioned below the top face 32 of the panel 14. The head 34 does not protrude from the panel 14.

[0021] The adhesive 16 is configured to couple the plurality of panels 14 to the subfloor. In one embodiment, the adhesive 16 is configured to harden the second layer 20 such that the second layer 20 is resistant to compression.

[0022] In use, the leveling device 12 is configured to identify the high spot and the low spot of a subfloor. The screws 30 are positioned through the panel 14 such that the screws 30 are configured to couple the panel 14 to the subfloor. The screws 30 also are configured to compress the second layer 20 between the first layer 18 and the subfloor. The top faces 32 of the panels 14 are coplanarly positionable. The adhesive 16 is configured to couple the plurality of panels 14 to the subfloor. The adhesive 16 also is configured to harden the second layer 20 such that the second layer 20 is resistant to compression.

[0023] The present invention also comprises a method for leveling a subfloor. The steps of the method comprise a providing step, wherein a subfloor leveling assembly 10 that comprises a leveling device 12, a plurality of panels 14, and an adhesive 16 is provided. The panels 14 are rectangularly shaped. The panels 14 are configured to be vertically adjusted relative to a subfloor such that top faces 32 of the panels 14 are coplanarly positionable. The adhesive 16 is configured to couple the plurality of panels 14 to the subfloor.

[0024] The method comprises a utilizing step, wherein the leveling device 12 is used to identify a high spot and a low spot of the subfloor.

[0025] A positioning step entails positioning of a respective panel 14 atop the high spot.

[0026] An adjusting step entails adjustment of the respective panel 14 such that the top face 32 of the respective panel 14 is level.

[0027] An adhering step entails adhering the respective panel 14 to the subfloor by positioning of the adhesive 16 between the respective panel 14 and the subfloor.

[0028] A positioning and adjusting step entails positioning and adjustment of additional panels 14 adjacent to the respective panel 14 so that the top faces 32 are coplanarly positioned.

[0029] A coupling step entails coupling of the additional panels 14 to the subfloor by positioning of the adhesive 16 between the additional panels 14 and the subfloor.

[0030] With respect to the above description then, it is to be realized that the optimum dimensional relationships for the parts of an embodiment enabled by the disclosure, to include variations in size, materials, shape, form, function and manner of operation, assembly and use, are deemed readily apparent and obvious to one skilled in the art, and all equivalent relationships to those illustrated in the drawings and described in the specification are intended to be encompassed by an embodiment of the disclosure.

[0031] Therefore, the foregoing is considered as illustrative only of the principles of the disclosure. Further, since numerous modifications and changes will readily occur to those skilled in the art, it is not desired to limit the disclosure to the exact construction and operation shown and described, and accordingly, all suitable modifications and equivalents may be resorted to, falling within the scope of the disclosure. In this patent document, the word "comprising" is used in its non-limiting sense to mean that items following the word are included, but items not specifically mentioned are not excluded. A reference to an element by the indefinite article "a" does not exclude the possibility that more than one of the element is present, unless the context clearly requires that there be only one of the elements.

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