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United States Patent D440,489
Igami ,   et al. April 17, 2001

Package for electronic device


The ornamental design for a package for electronic device, as shown and described.
Inventors: Igami; Hideo (Fujisawa, JP), Ishii; Yuhta (Machida, JP)
Assignee: IBM Japan Business Logistics Co., Ltd. (Tokyo, JP)
Appl. No.: D/122,268
Filed: April 25, 2000

Current U.S. Class: D9/426 ; D9/423
Current International Class: 0903
Field of Search: D9/420-426,414,337,341 D3/273 206/730,216,307,316.1,701,711,477,478,485,486,487,525,320 220/4.23,4.26,4.21,836,376,266,784,835,839

References Cited

U.S. Patent Documents
D375458 November 1996 Drinnen
D395234 June 1998 Shida et al.
3923152 December 1975 Minneman
4220252 September 1980 Beall et al.
4997100 March 1991 Dudek
5341926 August 1994 Leben
5543114 August 1996 Dudek
5727688 March 1998 Ishii et al.
5769260 June 1998 Killinger et al.
Primary Examiner: Deshmukh; Prabhakar
Attorney, Agent or Firm: Varndell & Varndell, PLLC


FIG. 1 is a perspective view of a package for electronic device showing our new design when the package is opened;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view our design for a package for electronic device when the package is closed.

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