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United States Patent D788,705
Tateno ,   et al. June 6, 2017

Heat insulating unit for substrate processing apparatus

Claims


CLAIM We claim the ornamental design for a heat insulating unit for substrate processing apparatus, as shown (and described).
Inventors: Tateno; Hideto (Toyama, JP), Hara; Daisuke (Toyama, JP)
Applicant:
Name City State Country Type

Hitachi Kokusai Electric Inc.

Chiyoda-ku, Tokyo

N/A

JP
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo, JP)
Appl. No.: D/555,040
Filed: February 18, 2016

Foreign Application Priority Data

Aug 21, 2015 [JP] 2015-018407

Current U.S. Class: D13/129; D13/184
Current International Class: 1303
Field of Search: ;D13/118,129,182,179,133,154,184 ;D15/5,127,128,140 ;76/107.1

References Cited [Referenced By]

U.S. Patent Documents
D440138 April 2001 Campbell
D599386 September 2009 Moellering
D613245 April 2010 Honna
D654211 February 2012 Melzner
D670247 November 2012 Savill, Jr.
D703238 April 2014 Ueno
D709323 July 2014 Brown
9082694 July 2015 Saido
9134052 September 2015 Kuo
D758317 June 2016 Plassiard
D766833 September 2016 Plassiard
Primary Examiner: Bui; Daniel
Assistant Examiner: Kerr; Andrew
Attorney, Agent or Firm: Fitch, Even, Tabin & Flannery, LLP

Description



FIG. 1 is a front and top perspective view of a heat insulating unit for substrate processing apparatus showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view.

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