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United States Patent D809,494
Han February 6, 2018

Case for electronic devices

Claims


CLAIM The ornamental design for a case for an electronic device, as shown and described.
Inventors: Han; Ye Ri (Seoul, KR)
Applicant:
Name City State Country Type

Han; Ye Ri

Seoul

N/A

KR
Assignee: SPIGEN KOREA CO., LTD. (Geumcheon-Gu, Seoul, KR)
Appl. No.: D/574,838
Filed: August 18, 2016

Current U.S. Class: D14/248
Current International Class: 1403
Field of Search: ;D14/143,189,203.2-203.7,217,238.1,240,248,250-253,440,447,496 ;D3/201,218,247-251,269,273,301,303 ;D13/103,107-108,119 ;D5/32-39

References Cited [Referenced By]

U.S. Patent Documents
D88425 November 1932 Martinoff
D88466 November 1932 Hellman
D110780 August 1938 Heim
D203024 November 1965 Stone
D558718 January 2008 Park
D563925 March 2008 Lee
D567784 April 2008 Lee
D567786 April 2008 Lee
D567787 April 2008 Lee
D577355 September 2008 Jeoung
D598909 August 2009 Seo
D612353 March 2010 Kim
D612616 March 2010 Sanders
D613281 April 2010 Wang
D621811 August 2010 Chen
D627339 November 2010 Nuovo
D630440 January 2011 Reisenthel
D632289 February 2011 Fahrendorff
D633486 March 2011 Fahrendorff
D656322 March 2012 Thompson
D724353 March 2015 Johnson

Other References

Ailun: iPhone 6 6s Case, posted at amazon.com, earliest date reviewed Jul. 14, 2016, [online], acquired on Sep. 13, 2017. Available from Internet, <URL: https://www.amazon.com/Reinforced-Ultra-Slim-Shock-Absorption-An- ti-Scratch-Fingerprint/dp/B01FXJYNZK/ref=cm.sub.--cr.sub.--arp.sub.--d.sub- .--product.sub.--top?ie=UTF8>. cited by examiner .
ACEFAST INC Floral Paisley Flower Plastic Case, posted at amazon.com, earliest date reviewed Sep. 26, 2014, [online], acquired on Sep. 15, 2017. Available from Internet, <URL: https://www.amazon.com/ACEFAST-Floral-Paisley-Flower-Plastic/dp/B00N5EU61- 6>. cited by examiner.

Primary Examiner: Brooks; Cathron
Assistant Examiner: Soroush; Aula
Attorney, Agent or Firm: Lucem, PC Chae; Heedong

Description



FIG. 1 is a front perspective view of a case for an electronic device showing my new design;

FIG. 2 is a rear perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

The broken lines depict portions of the case for an electronic device and form no part of the claimed design.

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