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United States Patent D828,360
Moore ,   et al. September 11, 2018

Electronic device cover

Claims


CLAIM The ornamental design for an electronic device cover, as shown and described.
Inventors: Moore; Jesse Wheeler (Oakland, CA), Curtis; Robert Brian (San Francisco, CA), Mecchella; Monica Liane (San Francisco, CA), Wall; Timothy Eli (San Francisco, CA)
Applicant:
Name City State Country Type

Amazon Technologies, Inc.

Seattle

WA

US
Assignee: Amazon Technologies, Inc. (Seattle, WA)
Appl. No.: D/598,552
Filed: March 27, 2017

Current U.S. Class: D14/440
Current International Class: 1402
Field of Search: ;D14/440,250,447,426,330 ;206/45.23,320,45.2 ;361/679.55 ;294/25

References Cited [Referenced By]

U.S. Patent Documents
D323937 February 1992 Solomon
D467429 December 2002 Bone
D657354 April 2012 Kim
D676448 February 2013 Gorman
D676449 February 2013 Probst
8542495 September 2013 Gorman
D707229 June 2014 Almodova
D736777 August 2015 Rayner
D742888 November 2015 Mecchella
D742889 November 2015 Mecchella
D742890 November 2015 Mecchella
D748097 January 2016 Feng
D748636 February 2016 Zadvinskis
D753123 April 2016 Probst
9307131 April 2016 Breen
D761798 July 2016 Lee
D765086 August 2016 Lee
D765663 September 2016 Shih
D768638 October 2016 Lee
D774036 December 2016 Kuntz
D781278 March 2017 Kim
D787520 May 2017 Wall
D792412 July 2017 Zhang
D792887 July 2017 Zhang
D808393 January 2018 Moore
D810088 February 2018 Moore
D811411 February 2018 Moore
2007/0097087 May 2007 Homer
2008/0194139 August 2008 Chan
2012/0043235 February 2012 Klement
2013/0264459 October 2013 McCosh
2016/0011628 January 2016 Sato
Foreign Patent Documents
D1566193 Dec 2016 JP

Other References

Indian Office Action dated Sep. 21, 2017 for Indian Design Application No. 297565, a counterpart foreign application of Design U.S. Appl. No. 29/598,552, 2 pages. cited by applicant .
Translated Japanese Office Action dated Feb. 9, 2018 for Japanese design application No. 2017-020119, a counterpart foreign application of design U.S. Appl. No. 29/598,552, 4 pages. cited by applicant .
Canadian Office Action dated Mar. 19, 2018 for Canadian Patent Application No. 177011, a counterpart foreign application of U.S. Appl. No. 29/598,552, 1 page. cited by applicant.

Primary Examiner: Underwood; Cynthia R
Attorney, Agent or Firm: Lee & Hayes, PLLC

Description



FIG. 1 is a back perspective view of a first embodiment of an electronic device cover.

FIG. 2 is a front perspective view of the first embodiment of the electronic device cover.

FIG. 3 is a front view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 4 is a back view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 5 is a right-side view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 6 is a left-side view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 7 is a bottom view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 8 is a top view of the first embodiment of the electronic device cover of FIG. 1.

FIG. 9 is a first opened state view of the first embodiment of the electronic device cover of FIG. 1. The first opened state view shows the outer surface of the electronic device cover in an unfolded state and is included as a reference view.

FIG. 10 is a second opened state view of the first embodiment of the electronic device cover of FIG. 1. The second opened state view shows the inner surface of the electronic device cover in an unfolded state and is included as a reference view.

FIG. 11 is a back perspective view of a second embodiment of an electronic device cover.

FIG. 12 is a front perspective view of the second embodiment of the electronic device cover.

FIG. 13 is a front view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 14 is a back view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 15 is a right-side view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 16 is a left-side view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 17 is a bottom view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 18 is a top view of the second embodiment of the electronic device cover of FIG. 11.

FIG. 19 is a first opened state view of the second embodiment of the electronic device cover of FIG. 11. The first opened state view shows the outer surface of the second embodiment of the electronic device cover in an unfolded state and is included as a reference view; and,

FIG. 20 is a second opened state view of the second embodiment of the electronic device cover of FIG. 11. The second opened state view shows the inner surface of the second embodiment of the electronic device cover in an unfolded state and is included as a reference view.

The broken lines depict portions of the electronic device cover which form no part of the claimed design.

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