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United States Patent D551,847
Yeap ,   et al. October 2, 2007

Instrument case

Claims


CLAIM The ornamental design for an instrument case, as shown and described.
Inventors: Yeap; Boon Leong (Penang, MY), Foo; Shiew Foe (Penang, MY), Lim; Chee Beng (Penang, MY), Tay; Eng Su (Penang, MY), Ooi; Aik Khong (Penang, MY)
Assignee: Agilent Technologies, Inc. (Palo Alto, CA)
Appl. No.: D/256,075
Filed: March 15, 2006

Current U.S. Class: D3/201 ; D3/218
Current International Class: 0301
Field of Search: D3/201,218,215,219,225-226,294,273-276 208/305,320,328 455/90,100 379/455 D6/407,631-634 224/901,904,240,236,682-683,600,250

References Cited

U.S. Patent Documents
D457374 May 2002 Lee
D530079 October 2006 Thomas et al.
D539530 April 2007 Sanderson et al.
D540539 April 2007 Gutierrez
Primary Examiner: Oliver; Catherine R.
Attorney, Agent or Firm: Bobys; Marc

Description



FIG. 1 is a top, right side perspective view of an instrument case showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a right side elevational view thereof, with left side elevational view being an identical mirror image thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a bottom plan view thereof; and

FIG. 7 is a top, right side perspective view thereof, with the instrument case in an open position and the inner housing separated.

FIG. 8 is a top and right side perspective view of the inner housing of the instrument case;

FIG. 9 is a top right side perspective view thereof, with two of the instrument cases in stacked configuration;

FIG. 10 is a left side perspective view of the two instrument cases in a stacked configuration, with the right side elevational view being an identical mirror image thereof;

FIG. 11 is a front elevational view of the two instrument cases in a stacked configuration; and,

FIG. 12 is a rear elevational view of the two instrument cases in a stacked configuration.

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