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United States Patent D669,457
Li October 23, 2012

Cover of an electronic device having surface ornamentation


CLAIM The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described.
Inventors: Li; Bin (Shenzhen, CN)
Assignee: FIH (Hong Kong) Limited (Kowloon, HK)
Appl. No.: D/423,559
Filed: June 1, 2012

Current U.S. Class: D14/248
Current International Class: 1403
Field of Search: D14/248,138R,138AA,138AB,138AC,138AD,138C,138G,203.7,341-347,250,440,140,240,251-253,439,299,238.1,217,218,168-169,172,496,247,203 D3/201,218,269,273,301,303,248 D21/458,376 455/575.1,575.3,575.4,575.8,556.1,556.2 D25/103,110,111,117,118,145,154,155,156,157,158 D5/2,3,4,7,19,23,24,32,36,39,46,48,55,56,66,99,37-38,41,58-63,1,47,26,20,57,53,12,17,11,49,5,8,27,64,65 D13/103,108,107 D6/595,596,601,602,603,610,611,612,616,617,621,622,615,585 D11/22,96,131,132,140,1,125,76 D32/40 D12/213 15/215 428/30,38 52/506.06,316 D1/104,105,108 D2/741 D24/208 D29/108 463/113

References Cited

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Other References

iphone4 lcd screen protector film 3d from Shenzhen Hua Li Yang Optoelectronics Technology Co., Ltd., <URL:http://mobilehua. en.alibaba.com/product/533348624-212886168/high.sub.--quality.sub.--iphon- e4.sub.--lcd.sub.--screen.sub.--protector.sub.--film.sub.--%203d.html>, retrieved from internet on May 1, 2012. cited by examiner .
Laser Engraving Cell Phone Case for iPhone 4/4s from Shenzhen JingXinQi Electronic Co. Ltd., <URL:http://wenwendove.en.made-in-china.com/product/PelmSVnDYXRH/ China-Laser-Engraving-Cell-Phone-Case-for-i Phone-4-4s.html>, retrieved from internet on May 5, 2012. cited by examiner.

Primary Examiner: Wright; Carla Jobe
Attorney, Agent or Firm: Altis Law Group, Inc.


The present application is related to copending U.S. patent applications Ser. Nos. 29/423,547, 29/423,548, 29/423,549, 29/423,551, 29/423,552, 29/423,555, 29/423,557, and 29/423,560, each, entitled "Cover of an Electronic Device Having Surface Ornamentation", by Bin Li. These applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion 4 in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design.

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